JPS58216500A - Cooler for electronic equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention relates to a cooling device for electronic equipment.

Some types of electronic equipment require a sealed structure due to the environment in which they are used, but the problem with sealed structures lies in how to dissipate heat from the circuit elements mounted inside the box. .

Conventionally, measures have been taken to achieve this, but the current situation is that they have not been widely adopted, for example, due to cost issues. In other words, 1. For example, there are devices that use heat pipes or thermal louvers, but devices that use heat pipes require a large number of heat pipes for the entire device because they only partially cool the elements, and this requires a structural solution. There are many unavoidable problems. On the other hand, in devices using a thermal louver, the thermal louver itself is extremely expensive, so it is used only in devices in very limited fields.

The present invention proposes a cooling device for electronic equipment that has a closed structure and can be used in many fields by improving these problems.

The present invention will be described in detail below using FIGS. 1 and 2.

In the figure, (1) has an intake hole (2) and an exhaust hole (3).

In addition, it is a box body in which circuit elements (not shown) are mounted.

Between the two boxes 11), there is a primary air which passes through the intake hole (2) of the box (1) and circulates inside the box (1) by a first blower (4). Air (high temperature side) (direction of arrow A in the figure) and 2 blown by the second blower (5).
A radiator (6) is located so that the secondary air (low temperature side) (in the direction of the arrow in the figure) is orthogonal to each other without intersecting with each other. (7) is a gasket (for example, silicone rubber) for sealing between the box (1) and the radiator (61), and (8) is a seal between the two boxes (1).
Depending on the amount of heat generated by circuit elements (not shown) mounted inside the radiator (6
) is a partition plate that divides the

Since this invention is as described above, the box body (1
) The high-temperature air (primary side) (in the direction of arrow A in the figure) heated by the heat generated by the circuit elements mounted in the hole (9;
It is guided into the radiator 6) for heat exchange. Further, as is clear from the above description, since no expensive cooling equipment is used, the present invention can be applied to various electronic devices. moreover,
Since one radiator 6) is shared by two devices, the packaging density can be extremely increased.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a cooling device for electronic equipment according to the present invention, and FIG. 2 is a diagram showing cross section AA of FIG. 1. In the figure, (11 is a box body, (21 is an intake hole, (3) is an exhaust hole,
(4) is the first blower, and (5) is the second blower. 16) is a radiator, (7) is a gasket, (8) is a partition plate, and (9; is a hole. In addition, the same or equivalent parts in the two figures are indicated with the same reference numerals. , b Substitute People Makoto Kuzuno −

Claims (1)

[Claims] Two boxes each having a circuit element mounted thereon and having an air intake hole and an air exhaust hole on one surface are positioned so that the air intake hole and the exhaust hole face each other, and the opposite Between the two sides, there is a first blower at a position corresponding to the intake hole, a hole at a position corresponding to the exhaust hole, and a second blower at a vertical side not in contact with the two boxes. A radiator having a blower is disposed, and the first blower circulates the primary air (high temperature side) in the two boxes and guides it into the radiator, while the second blower circulates the primary air (high temperature side) inside the radiator. Blow secondary air (low temperature 9111) into the radiator. By the action of the radiator, which is configured such that the primary air (high temperature side) and the secondary air (low temperature side) are orthogonal to each other without intersecting with each other, the primary air (high temperature side) is cooled and the secondary air (low temperature side) is cooled. A cooling device for electronic equipment characterized by cooling circuit elements.