JPS58212942A - Film for packing - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a packaging film, and more particularly to a film for packaging electronic components. Even after several years of damage to electronic circuits, they are easily damaged by static electricity, posing a serious problem.

Therefore, in order to protect electronic components from static electricity,
Plastic films and metal foils mixed with conductive substances such as carbon and metal powder are used as packaging materials for electronic components.

However, in these cases, the b deviation is also opaque, so the
Until then, it is impossible to confirm the existence and damage of the electrical parts inside, or to identify the type.On the other hand, there are also plastic films mixed with antistatic agents, but this The electrical resistance of
This invention is completely inadequate for protecting electronic components, and depending on the type of antistatic agent, it is easily affected by moisture and lacks stability. This invention eliminates the above drawbacks, and the contents of the package The purpose of the present invention is to provide a film for packaging electronic components that is sufficient to protect electronic components from static electricity while allowing electronic components to be seen through. A transparent resin film is provided on the thin film, and it is a film for packaging electronic parts, which is used to form a package with the transparent plastic film or the transparent resin film inside.

This will be explained below with reference to the l*1 plane.

FIG. 1 is a partially enlarged cross-sectional view of the electronic component packaging film of the present invention; FIG. It is a partially cutaway perspective view when a package is formed as an inner side. In the figure,
1. is a transparent plastic film, 2 is a metal thin film, 5 is a transparent resin film, and 4 is a joint portion, respectively.

As the transparent plastic film 1, polyester film, acrylic film, km-containing hibinyl film can be used.
Fluororesin film, styrene film, polypropylene film, polyethylene film, nylon film, etc.
Rem, ionomer tffJ fat film, ethylene-
Vinyl acetate copolymer film and all other materials that can be used as packaging materials can be used.

The transparent plus book film 1 preferably has a thickness of 4μ to 150μ. Transparent plastic film 1 is 4μ
If it is thinner, it is extremely thin and extremely weak, making it useless as a packaging material. Transparent plastic film 1 is 150
If it is thicker than μ, it will be too stiff and have a strong repulsive force, making it extremely inconvenient to handle during and after forming the package.

The metal thin film 2 can be provided on one side of the transparent plastic film 1 by a conventionally known thin film production method such as a vacuum deposition method, a sputtering method, an ion blating method, or an electron beam evaporation method.

In this specification, the term "metal thin film" includes all thin films of simple metals, alloys, and metal compounds such as metal oxides.

The metal thin film 2 includes Cr, kg 1Ni, Fe, In
,Ag,Au',Cu,Sn,Zn,',['i
, Ni-Cr, In2O,, SnO2, ■n-8n-
Single metals such as 02 series, metal compounds such as metal oxides,
Any other material capable of forming a thin film can be used. The metal thin film 2 must satisfy the conditions of a light transmittance of 25% or more and an electrical resistance per unit area of 108 Ω or less. These conditions of light transmittance and electrical resistance are essential to achieving the purpose of this invention.

That is, if the light transmittance is lower than 25 coefficients, it will be difficult to see through the electronic components inside the package. -Also, the electrical resistance is 10
If it is higher than 6Ω, the conductivity is poor and it is insufficient to protect electronic components from static electricity charging.

The transparent resin film 3 may be provided by laminating the same or different type of plastic film as the transparent glass film 1 to the gold IE/v film 2F, extruding and laminating an appropriate resin, or using cope ink 1-. Can be done.

This invention forms a package with a transparent plastic film 1 or a transparent resin film 3 inside [7] Electronic components are packaged in this package.

The packaging may be formed by conventionally known plastic film bonding methods such as heat sealing, impulse sealing, ultrasonic bonding, and high frequency bonding, depending on the properties of the transparent plastic film 1 and transparent resin film 3 used. , a suitable adhesive, adhesive, or the like may be used to form the package.

4 in the figure is a joint. Note that the joint portion 4 may be formed continuously around the entire circumference of the package as shown in FIG. 2, or may be formed partially in the upper portion, such as in a dotted line shape.

In this invention, the electrical resistance per unit area of the metal thin film 2 is 1.
Since it has a conductivity of 0.8Ω or less, electronic components can be sufficiently protected from static electricity generated inside and outside the package.

In the present invention, a film containing an antistatic agent is used as the transparent plastic film 1, and a layer containing an antistatic agent can be appropriately formed on one or both sides of the transparent plastic film 1. The layer containing the inhibitor can also be provided at other appropriate locations such as the surface of the transparent resin film.

Moreover, an antistatic agent can also be mixed into the transparent resin film 3.

In this invention, when the package is formed, the metal thin film 2 is sandwiched between the transparent plastic film 1 and the transparent resin film 3, so that the packaging has extremely good weather resistance.

Note that this invention can naturally be colored or printed as appropriate.

Example 1 One side of a transparent polyester film (Diafoil manufactured by Diafoil Co., Ltd.) with a thickness of 12μ was coated with a vacuum degree of 8×10 To
Under the conditions of rr, Cr was deposited at a deposition distance of 2oα, the light transmittance was 27%, the resistance per unit area was 150Ω, and the film thickness was 22
A 0X Cr vapor deposition film was formed. Next, a 2-thickness Cr vapor deposition film was formed on the Cr vapor deposition surface.
A 5 μm transparent polyester film (Diafoil manufactured by Diafoil Co., Ltd.) was laminated to obtain the electronic component packaging film of the present invention.

Example 2 By the same method as in Example 1, a transparent polyester film (Diafoil manufactured by Diafoil Co., Ltd.) with a thickness of 25 μm was coated on one side with a light transmittance of 67 and a resistance per unit area of 150Ω.
, film thickness 6o X L (near) hl vapor-deposited film was formed. Next, a polyethylene film with a thickness of 60 μm was laminated on the A/deposited film. Furthermore, a cationic antistatic agent was coated on the non-evaporated surface of the polyester film to obtain a film for packaging electronic components of the present invention.

Example 5: Argon + oxygen mixed gas 2 x 10 TO was applied to the surface of a 25μ thick transparent polyester film (Diafoil manufactured by Diafoil) by magnetron sputtering.
Indium oxide with a light transmittance of 80 cm, a resistance per unit area of 5 x 106 Ω, and a film thickness of 500 x was formed by reactive sputtering using EL as a target in a rr atmosphere with a discharge power of 0.5 KV x 1 QA. After forming the film, EVA (ethylene-vinyl acetate copolymer) was coated on the indium oxide film to obtain a film for packaging electronic components of the present invention.

Next, a comparison example with conventional products is shown.

As a comparative example, sample 1 is a heat-sealable non-static polyethylene package (pink polyethylene bag manufactured by Tokyo Denki Kagaku Kogyo Co., Ltd.) formed from a conventionally commercially available film mixed with an antistatic agent, and a polyethylene film with a thickness of 30μ and AI A package was prepared by pasting the aluminum foil and aluminum foil on the outside, and this was used as sample 2. Further, using the electronic component packaging films of the present invention obtained in Examples 1 to 3, packages were formed by heat sealing or ultrasonic bonding, using a 25 μm thick polyester film as the outside.

A liquid crystal plate was enclosed in each of the above packages.

Meanwhile, a static electricity generator of aooo v~10000 V (
ZIO8TAT) was irradiated with ions of ■ and e to inspect the presence or absence of any disturbance in the letters and numbers within the liquid crystal panel. We also compared the transparency of the packaging. The results are shown in the table below.

In addition, ○...No disturbance at all.

×...Very disturbed.

As is clear from the results in the table, when this ψJ electronic component packaging film is used, there is no disturbance in the letters and numbers on the liquid crystal display, and compared to conventional products, the protection from static electricity is extremely significant. In addition to having excellent effects, the transparency is also extremely good.

Although the present invention is particularly useful for packaging electronic parts, it can also be used as a general antistatic film for purposes other than packaging electronic parts.

[Brief explanation of drawings]

FIG. 1 is a partially enlarged sectional view showing one embodiment of the electronic component packaging film of the present invention, and FIG. 2 is a partially enlarged sectional view showing an example of the electronic component packaging film of FIG. It is a partially cutaway perspective view. In the figure, 1...Transparent plastic film 2...
...Thin metal film 6...Transparent resin film 4...Joint part Patent applicant Co., Ltd.] Figure

Claims (1)

[Claims] A thin metal film is provided on one side of a transparent plastic film under the conditions of a light transmittance of 25 cm or more and an electrical resistance of 108 Ω or less per unit area, and the metal is used as an electronic component packaging film.