JPS5864964A - Bag for packing - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a packaging bag, and more particularly to a bag for packaging electronic components.

Electronic components that are sensitive to static electricity, such as semiconductors, are easily damaged by static electricity before they are attached to an electronic circuit, and even after they are attached to an electronic circuit, which poses a major problem.

Therefore, in order to protect electronic components from static electricity, conventional companies
Plastic films and metal foils mixed with conductive substances such as carbon and metal powder are used as packaging materials for electronic components. However, all of these are opaque, so
It is impossible to confirm the presence and damage of electronic components inside the forest, or to identify the type.On the other hand, there are also plastic films mixed with antistatic agents, but this The electrical resistance of the antistatic agent is quite high, making it completely inadequate for protecting electronic components, and depending on the type of antistatic agent, it is easily affected by moisture and lacks stability.

The present invention eliminates the above-mentioned drawbacks and provides a bag for packaging electronic components that allows the electronic components contained in the package to be seen through and is sufficient to protect the electronic components from static electricity.

That is, in this invention, a thin metal film is provided on one side of a transparent plastic film under conditions of a light transmittance of 25% or more and an electrical resistance of 108 Ω or less per unit area, and the metal thin film is heat-sealable. A bag for packaging electronic parts, characterized in that a packaging film is formed using a packaging film provided with a transparent resin film, and the package is formed with the transparent plastic film on the outside and the heat-sealable transparent resin film on the inside. .

The following description will be made with reference to the drawings. Figures 1 and 2 are partially enlarged sectional views showing an example of the packaging film used in the electronic component packaging bag of the present invention. The figure shows one embodiment of the present invention, and is a partially cutaway perspective view when a package is formed using the packaging film of FIG. 1.

In the figure, 1 is a transparent plastic film, 2 is a metal thin film,
3 indicates a heat-sealable transparent resin film, and 4 indicates a □ heat-seal μ section. The transparent plastic film 1 includes a polyester film, an acrylic film, a vinyl chloride film, a fluororesin film, a styrene film, a polypropylene film, Polyethylene film and all other materials that can be used as color covering materials can be used.

The transparent plastic film 1 preferably has a thickness of 4μ to 100μ. Transparent plastic film 1 is 4μ
If it is thin, it is extremely thin and extremely weak, so it is useless as a packaging material. ◎Transparent plastic film 1 is 100%
If it is too thick, it will be too stiff and have a strong repulsive force, making it extremely inconvenient to handle during heat sealing and after packaging is formed.

The metal thin film 2 can be provided on one side of the transparent differential film 1 by a conventionally known thin film production method such as a vacuum evaporation method, a sputtering method, an ion blating method, or an electron beam evaporation method. ◎What is a metal thin film? In this specification, all thin films of metal compounds such as simple metals, alloys, and metal oxides are included.

The metal thin film 2 includes Cr, AI, Ni, Fe, Ni, A9.
, Au.

cu, sn, Zn, Ti, Ni-Cr, engineering n2o
Single metal such as 5.5no2, In-Eln-02 system,
Metal compounds such as metal oxides and any other material capable of forming a thin film can be used. The metal thin film 2 must satisfy the conditions of a light transmittance of 25 cm or more and an electrical resistance per unit area of 108 Ω or less. These conditions of light transmittance and electrical resistance are essential to achieving the purpose of this invention.

That is, if the light transmittance is lower than 254, it will be difficult to see through the electronic components inside the package. Also, the electrical resistance is 101
If it is higher than IΩ, the conductivity is poor and it is insufficient to protect electronic components from static electricity charging.゛The heat-sealable transparent resin film 5 can be provided by laminating polyethylene or other heat-sealable films on the metal thin film 2, extruding a polyethylene or other resin, laminating it, or coating it. Possible resins include, for example, polyethylene, soft vinyl chloride, modified polyester, E'VA, and various other heat-fusible resins.

The heat-sealable transparent resin film 3 can be provided on the entire surface of the metal thin film 2, as shown in FIG. 1, or a curtain can be provided on the part where heat sealing is actually performed, as shown in FIG. Possible - According to the present invention, a package is formed with the transparent plastic film 1 on the outside and the heat-sealable transparent resin film 3 on the inside, and electronic components are packaged in the package.

4 in the figure is the heat sea y part.

In this invention, since the metal thin films 2 and 9 are conductive with an electrical resistance of 1♂Ω or less per unit area, electronic components can be sufficiently protected from static electricity generated inside and outside the packaging. As the transparent defstick film 1, a film containing an antistatic agent is used, or a layer containing an antistatic agent can be appropriately formed on one or both sides of the transparent defstick film 1. The containing layer can also be provided at other suitable locations.

In this invention, when the package is formed, the metal thin film 2 is placed on the inside of the transparent differential film 1, so the weather resistance is extremely good.

Note that this invention can naturally be colored as appropriate. Example 1 One side of a 58μ thick transparent polyester film (Diafoil/L/ manufactured by Diafoil Co., Ltd.) was coated with a vacuum of 8 x 1O.
Under the condition of -5 Torr, Cr was deposited at a deposition distance of 201 cm to form a Cr deposited film with a light transmittance of 27 inches, a resistance per unit area of 4Ω, and a film thickness of 220A. By laminating transparent polyethylene film,
Further, a package was formed by heat-sealing this with the transparent polyester film on the outside and the transparent polyethylene film on the inside. Guiahoi fi-/
) has a light transmittance of 67 cm and a resistance of 1 cm per unit area.
Next, EVA (ethylene-vinyl acetate copolymer) was coated on the Al vapor-deposited film. Furthermore, a cationic antistatic agent is coated on the non-evaporated surface of the polyester film, and then a heat-sealed package is formed with the transparent polyester film on the outside and the EVA on the inside, thereby forming the bag for packaging electronic components of the present invention. 〇Example 3゜25μ thick transparent polyester film (Diaho
A combination of argon + oxygen a gas (2 x 10 Torr) was applied to the surface of Diafoil (manufactured by Diafoil) by magnetron sputtering.
In the atmosphere, In is targeted and the discharge power is 0.
・Reactive sputtering at 5KV x 1.0m, light transmittance 80cm, resistance per unit area 3 x 1♂Ω, film thickness 500
On top of this indium oxide film, polyethylene is coated only on the necessary parts, and then a package is formed by heat-sealing with a transparent polyester film on the outside and polyethylene on the inside. As a result, a bag for packaging electronic components of the present invention was obtained.

Next, a comparison example with conventional products is shown.

Using the electronic component packaging bag of the present invention obtained in each example, a conventionally commercially available heat-sealable non-static polyethylene packaging (pink plastic bag manufactured by Tokyo Denki Kagaku Kogyo Co., Ltd.) was used as a comparative example. /1, and 9 pieces were packaged by laminating a polyester film and a polyethylene film with a thickness of 25μ, and this was adopted as a sump /L/2.

Each of the above packages contained a liquid crystal plate.

Next, a static electricity generation of 8000V to 1oonov was applied from a distance of 101 to each package containing the liquid crystal panel.
Z-1eRO8TAT) was irradiated with ■ and θ ions to inspect the presence or absence of irregularities in letters and numbers within the liquid crystal panel.The transparency of the packaging was also compared. The results are shown in the table below.

In addition, O: No disturbance at all.

×...Very disturbed.

As is clear from the results in the table, when the electronic component packaging bag of the present invention is used, there is no disturbance in the letters and numbers on the liquid crystal display, and compared to conventional products, it provides extremely significant protection from static electricity. It is effective◇

[Brief explanation of drawings]

Both FIG. 1 and FIG. 2 are partially enlarged cross-sectional views showing an example of a packaging film used in an electronic component packaging bag of the present invention, and FIG. Show, first
In Figure 0, which is a partially cutaway perspective view when a package is formed using the packaging film shown in the figure, 1...Transparent plastic film 2...Metal thin film 3...Heat Sealable transparent resin film 4...
・Heat seal part patent applicant Reiko Co., Ltd.';? 1 figure, 2 circles

Claims (1)

[Claims] 1) A thin metal film on one side of a transparent plastic film,
Light transmittance 25% or more, electrical resistance 1CP per unit area
Ω or less, and on the metal thin film,
For packaging electronic parts, using a packaging film provided with a heat-sealable transparent resin film, and forming a package with the transparent plastic film on the outside and the heat-sealable transparent resin film on the inside. bag. 2) The electronic component packaging bag according to claim 1, wherein the transparent plastic film is provided with a layer containing an antistatic agent on one or both sides.