JPS58193272A - Bag for packing - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a packaging bag, and more particularly to a bag for packaging electronic components. Even if it is inserted into an electronic circuit, it is easily damaged by static electricity, which is a big problem.Therefore, in order to protect electronic components from static electricity, conventional methods have been used to protect electronic components from static electricity.
Plastic films and metal foils mixed with conductive substances such as carbon and metal powder are used as packaging materials for electronic components.

However, since these are all opaque, it is impossible to confirm the existence and damage of the electronic components inside, or to identify the type.

On the other hand, there are plastic films mixed with antistatic agents, but these have considerably high electrical resistance per unit area and are completely inadequate for protecting electronic components, and depending on the type of antistatic agent. is easily affected by moisture and lacks stability.

The present invention eliminates the above-mentioned drawbacks and provides a bag for packaging electronic components that allows the electronic components contained in the package to be seen through and is sufficient to protect the electronic components from static electricity.

That is, the present invention provides a method in which a thin metal film is provided on one side of a transparent plastic film under conditions of a light transmittance of 25 coefficients or more, an electrical resistance of 108 Ω or less per unit area, and a film thickness of 20X to 250A. A packaging film is used on which a transparent protective layer is provided with an ultra-thin thickness of 2μ or less on the thin film, and a package is formed with the planutic film on the outside and the transparent protective layer on the inside. This is a bag for packaging electronic components.

This will be explained below with reference to the drawings.

FIG. 1 is a partially enlarged sectional view showing an example of the packaging film used in the electronic component packaging bag of the present invention, and FIG. 2 is a partially enlarged sectional view showing an example of the packaging film of the present invention. FIG. 3 is a partially cutaway perspective view of a package formed using the film for use in the packaging.

Examples of the transparent plastic film 1 include polyester film, acrylic film, vinyl chloride film, fluororesin film, styrene film, polypropylene film, polyethylene film, nylon film, ionomer resin film, ethylene-vinyl acetate copolymer film, and other color coating materials. You can use whatever is available.

The transparent plastic film 1 preferably has a thickness of 4 to 150 microns. Transparent plastic film 1 is 4μ
If it is too thin, it will be extremely thin and extremely weak, making it useless as a packaging material. Transparent plastic film 1 is 150
If it is thicker than μ, it will be too stiff and have a strong repulsive force, making it extremely inconvenient to handle during and after forming the package.

The transparent plastic film 1 is not necessarily a single layer, but may also be a film laminated with various planutic films.
It is also possible to form two or more layers by extruding or coating a single plastic film with an appropriate resin.

The metal thin film 2 can be provided on one side of the transparent plastic film 1 by a conventionally known thin film production method such as a vacuum evaporation method, a sputtering method, an ion blating method, or an electron beam evaporation method.

The metal thin film 2 contains Cr, A6t Ni, Fe, n%
AIF, Au.

Single metals such as Cu, Sn, Zn, Ti, and Ni-Cr, alloys, and other metals capable of forming a thin film can all be used.

The metal thin film 2 must satisfy the following conditions: a light transmittance of 25 - or more, an electrical resistance per unit area of 1♂Ω or less, and a film thickness of 20 or 250λ. These conditions are essential to achieving the objectives of this invention.

In other words, if the light transmittance is lower than 25 inches, it will be difficult to see through the electronic components inside the package.
If it is higher than Ω, the conductivity is poor and it is insufficient to protect electronic components from static electricity. It also shows the relationship.

If the film thickness is outside the range of 20A to 250A, it will not be possible to meet the requirements of light transmittance of 25% or more and electrical resistance per unit area of 108Ω or less. The electrical resistance tends to be higher than 108Ω, and the protection of electronic components becomes insufficient. If the film thickness is more than 250 λ, the light transmittance will be lower than 25 λ, making it difficult to see through the electronic components inside.

In this way, the light transmittance, electrical resistance per unit area, and film thickness of the metal thin film 2 are closely related to each other, and the metal thin film 2 is formed to satisfy all of these three conditions. There is a need.

The thickness of the metal thin film 2 is also the same as that of the transparent plastic film 1.
It is of critical importance in forming the packaging as the outer layer. That is, when forming a package, when bonding packaging films with the transparent protective layer 3 on the inside, the transparent protective layer 3 is extremely thin with a thickness of 2μ or less, so the transparent protective layers 3 are substantially bonded to each other. The transparent plastic film 1 is not integrated with the metal thin film 2 and the transparent protective layer 3.
However, if the thickness of the metal thin film 2 is 250A or less,
Since this is extremely thin, it does not particularly affect the bonding of the plastic film 1 with the plastic film 1 on the outside and the transparent protective layer 3 on the inside, and the bonding performance is the same as in the case where the metal thin film 2 is not present. . However, if the metal thin film 2 exceeds 25 OA, it is no longer possible to sufficiently bond the plastic film 1 with the plastic film 1 on the outside.

For the transparent protective layer 3, acrylic resin, cellulose resin such as cellulose acetate or cellulose butyrate, urethane resin, epoxy resin, polyester resin, wax, and other appropriate resins can be used.

The transparent protective layer 3 needs to be formed on the metal thin film 2 with an extremely thin thickness of 2μ or less.The thickness of the transparent protective layer 3 is 2μ.
If it is extremely thin, the electrical resistance of the metal thin film 2 will not be significantly impaired, and the surface of the transparent protective layer 3 will conduct electricity,
It has almost no effect on the removal of static electricity. This is presumed to be because the protective layer 3, which has an extremely thin thickness of 2 μm or less, is probably in a porous state and has countless pores. On the other hand, if the thickness of the protective layer 3 exceeds 2 μm, the electrical resistance of the surface becomes large depending on the resin used, and the removal of static electricity becomes insufficient.

An antistatic agent can also be mixed into the transparent protective layer 3, and in this way, static electricity can be removed even more completely.

In this invention, a package is formed with a transparent plastic film 1 on the outside and a transparent protective layer 5 on the inside, and electronic components are packaged in the package.

The packaging is formed using the transparent plastic film used.
Accordingly, heat sealing, impulse sealing,
This may be carried out by conventionally known plastic film bonding methods such as ultrasonic bonding and high frequency bonding.

4 in the figure is a joint. Note that the joint portion 4 may be formed continuously over the entire circumference of the package as shown in FIG. 2, or may be formed partially in a dotted line shape or the like.

In addition, the packaging can also be formed using an appropriate adhesive, pressure-sensitive adhesive, or the like.

In this invention, the electrical resistance per unit area of 20 metal thin films is 1.
Since it has a conductivity of 0.8Ω or more, electronic components can be sufficiently protected from static air generated inside and outside the package.In particular, the inside of the package has a transparent layer 5 that is as thin as 2μ or less. Therefore, the influence of static electricity can be completely eliminated, almost in the same way as when the metal thin film 2 is present on the surface.

In addition, despite its presence, the transparent protective layer 3 not only provides the same static electricity removal and antistatic effect as when the metal thin film 2 is present on the surface, but also acts as a protective layer on the metal thin film 20 surface. This protects the surface of the metal thin film 2 and improves its surface slipperiness and abrasion resistance, thereby preventing damage to the metal thin film 2 due to contact with electronic parts, especially when electronic parts are packaged.

In the present invention, a film containing an antistatic agent may be used as the transparent plastic film 1, or a layer containing an antistatic agent may be appropriately formed on one or both sides of the transparent plastic film 1. In this way, the antistatic effect becomes even more effective. The layer containing the antistatic agent can also be provided in other suitable locations.In this invention, when the package is formed, the metal thin film 2 becomes the inside of the transparent plastic film 1, so the weather resistance is extremely good. ◇ Note that this invention can naturally be colored or printed as appropriate. Example 1 A heat-sealable polyester film (modified Holieste Jv layer is provided on one side of a 25μ thick polyester film). Using Melinex type φ850 (manufactured by C Kosha) as a carrier sheet, the degree of vacuum was 2 x 10' by vacuum evaporation method.
Under the conditions of rr, Cr was deposited for about 20 seconds at a deposition distance of 25 el+, and the light transmittance was 72 cm and the resistance per unit area was 1
A Cr vapor-deposited film having a thickness of 50× and a thickness of 105 Ω was formed on the modified polyester layer of the carrier sheet. Next, a transparent protective layer with a thickness of 0.6 μm is formed using an acrylic resin on the Cr vapor-deposited film, and a package is formed using a heat roll with the polyester film on the outside and the transparent protective layer on the inside.
A bag for packaging electronic parts according to the present invention was obtained.

Example 2 One side of a polyester film (Diafoil v) with a thickness of 25 μm was coated with a vacuum degree of 1 by vacuum evaporation method.
Under the condition of x10' TOrr, N1 is 25
Vapor deposition was performed at a deposition distance of α to form an N1 vapor-deposited film having a light transmittance of 50q6, a resistance per unit area of 2×10′Ω, and a film thickness of 70×. Next, 0.3μ of cellulose acetate was applied to the N1 vapor-deposited film.
A bag for packaging electronic parts of the present invention was obtained by forming a transparent protective layer having a thickness of 100 ml, and then forming a package by ultrasonic bonding with the polyester film on the outside and the transparent protective layer on the inside.

Next, a comparison example with conventional products is shown.

Using the electronic component packaging bag of the present invention obtained in each example, as a comparative example, heat-sealable non-static polyethylene packaging (Tokyo Denki Kagaku Sample 1 was a pink plastic bag manufactured by Kogyo Co., Ltd., and the packaging was a 30μ thick polyethylene film laminated with JJ foil, which was adopted as sample v2. Each of the above packages contained a liquid crystal panel. did.

Next, insert a liquid crystal panel into each package (10 ctx).
A static electricity generator of 8000V to 10000V from a distance of (
ZERO8TAT) was irradiated with ions of ■ and e to inspect the presence or absence of irregularities in letters and numbers within the liquid crystal panel. We also compared the transparency of the packaging. The results are shown in the table below. ○: No disturbance at all; ×: Very disturbance.

As is clear from the results in the table, when the electronic parts packaging bag of the present invention is used, the characters and numbers on the liquid crystal display are not disturbed at all, and compared to conventional products, it has better protection from static electricity.
It has a very remarkable effect and also has very good transparency.

Although the present invention is particularly useful for packaging electronic parts, it can also be used as a general antistatic bag for purposes other than packaging electronic parts.

[Brief explanation of drawings]

FIG. 1 is a partially enlarged sectional view showing an example of the packaging film used in the electronic component packaging bag of the present invention, and FIG. 2 is a partially enlarged sectional view showing an example of the packaging film of the present invention. FIG. 3 is a partially cutaway perspective view of a package formed using the film for use in the packaging. 1...Transparent plastic film 2...
Metal thin film 6...Transparent protective layer 4...Joint part Patent applicant Reiko Co., Ltd.

Claims (1)

[Claims] 1) A thin metal film on one side of the transparent plastic film, having a light transmittance of 25 cm or more and an electrical resistance per unit area of 10 cm.
8Ω or less and a film thickness of 20λ to 250; using a packaging film having an extremely thin transparent protective layer of 2μ or less on the metal thin film,
A bag for packaging electronic parts, characterized in that the packaging is formed with the plastic film on the outside and the transparent protective layer on the inside. 2) A bag for packaging electronic components according to claim 1, wherein the transparent plastic film is provided with a layer containing an antistatic agent on one or both sides; 3) The transparent protective layer contains an antistatic agent. ◇