JPS58210763A - Supporting body for solid state image pickup element - Google Patents

Abstract

PURPOSE:To hold the sufficient perpendicularity of the surface of a solid-state image pickup element to the optical axis of an image pickup lens without any adjustment by providing the solid-state image pickup element onto a fitting surface where a photographic lens barrel, a camera body, etc., are fitted to a main body part. CONSTITUTION:The solid-state image pickup element 6 such as a charged coupled device is supported on a plate piece 4'. The plate piece 4' has parts projecting to both left and right sides as fitting parts to the main body. The lens barrel 13' holding lens groups 11 and 12 is provided with element fitting parts 13' at, for example, three places, and a supporting body 1 is fitted to the lens barrel 13' by a clamping member 16. When the image pickup element supporting body 1 is fitted to the lens barrel 13', the fitting parts 13'a1-13'a3 of the lens barrel 13' are aligned to holes 4'b1-4'b3 of the fitting parts 4'a of the plate piece 4' and the both are fixed. The surface of the element 6 is completely on the same plane with the plate piece 4', so while the plate piece 4' is at right angles to the optical axis, the perpendicularity of the surface of the element 6 to the optical axis is secured. Then, the plate piece 4' is fitted to the lens barrel 13' on the plane formed in the fitting surface, so the work precision of the fitting surface is improved so that the plane is at right angles to the optical axis, thereby securing the perpendicularity of the image pickup element surface to the optical axis.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a carrier for a solid-state image sensor, and a structure capable of maintaining sufficient perpendicularity of the surface of the solid-state image sensor with respect to the optical axis of a photographing lens without adjustment when mounted on a main body. It is characterized by Note that in this specification, the main body section refers to, for example, a photographic lens barrel or a camera body.

Regarding conventional technology, Ceramic Package Co., Ltd., which mounts a solid-state image sensor in a conventional camera using a solid-state image sensor, for example, a home video camera, is made of a laminate, as will be described later with reference to FIGS. 1 to 3. Therefore, since the parallelism of the surface is poor when mounting it to the image sensor, it is necessary to reduce one-sided blur,
In order to reduce optical axis tilt, it was necessary to make adjustments using a three-point adjustment mechanism. For this reason, the mounting of the solid-state image sensor carrier has disadvantages such as a complicated structure, a large size, and the need for adjustment.

It is an object of the present invention to provide a carrier for a solid-state image sensor that can maintain sufficient perpendicularity of the solid-state image sensor surface to the optical axis of the imaging lens without adjustment when attached to a main body. Furthermore, it is an object of the present invention to provide a carrier for a solid-state imaging device that can achieve the above-mentioned objects with a simple configuration, thereby making it possible to reduce the size and weight of a camera that uses a solid-state imaging device. shall be.

Structure of the Invention The present invention is characterized by a solid-state imaging device carrier having a solid-state imaging device on its surface, which is attached to the main body.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the drawings, a conventional solid-state image sensing device carrier will be described first, and then a carrier embodying the present invention will be described.

Regarding the carrier of a conventional solid-state image sensor (Figures 1 to 3) Figure 1 shows a carrier of a conventional solid-state image sensor, in which 1 is a carrier, and 2, 3, and 4 are made of ceramic or the like. The carrier l is formed by layering the plate pieces 2.3 and 4ta.

Among these plate pieces, 2 holds the protective glass 5, 4 supports the solid-state image sensor 6 by pasting or other means, and 3
has a wiring pattern connected to a plurality of external terminals 7 by wire bonding or the like. These plate pieces are attached with adhesive or the like. Note that 2a is a surface for attachment to the main body, and 2b is a hole for positioning or screw attachment.

FIG. 2 shows a modification of the conventional carrier, in which reference numeral 8 denotes a wiring board, and the carrier 1 is fixed to the wiring board 8 by soldering. 8a is a surface for attachment to the main body, and 8b is a hole for attachment.

In these carriers, the parallelism of the surfaces 2a and 8a is extremely low when mounting the solid-state image sensor 6 by pasting or soldering, and the plates 2 to 4tj: Since it is a laminated body, it is difficult to ensure that the solid-state image sensor 6 is perpendicular to the optical axis of the photographing lens with the accuracy of the parts of the carrier 1. Therefore, in order to guarantee this perpendicularity, an adjustment mechanism shown in FIG. 3 was used.

In FIG. 3, lens groups 11, 12ti lens barrel 1
3, and the base plate 14 of the image pickup element carrier 1 is attached to the lens barrel 13.

The supporting body 1 soldered to the wiring board 8 is a cushioning material of 15 tons.
- It is attached to the base plate 14 by the fastening member 16 through □. Jin's device normally adjusts at three points to reduce optical axis tilt and maintain the perpendicularity of the solid-state image sensor surface 1 with respect to the optical axis 10, but the adjustment mechanism is complex and large, and the adjustment operation is complicated. As mentioned above, there is a drawback that the above-mentioned perpendicularity cannot be guaranteed unless the process is performed.

Regarding the carrier of the solid-state image sensor embodying this invention (
(Figs. 4 to 6) Therefore, in this invention, the mounting of the carrier to the main body is achieved by providing a solid-state image sensor +'' on the surface, so that the perpendicularity of the solid-state image sensor surface to the optical axis can be maintained sufficiently without adjustment. Fig. 4 is a side view of a carrier for a solid-state image sensor embodying the present invention, Fig. 5 is a side view of a lens barrel to which this carrier is attached, and Fig. Fig. 6 is an exploded perspective view of the main part in Fig. 5. In these figures, members designated by the same reference numerals as in Figs. 1 to 3 basically have the same structure as those described above.

In FIG. 4, reference numeral 6 denotes a solid-state imaging device such as a charge-coupled device, and plate piece 4' supported by plate piece 4' is plate piece 2.3.
It protrudes in the plane direction, for example, on both the left and right sides as shown in FIG. 6, and this protruding portion 4'a is the part that is attached to the main body. In FIG. 5, a lens barrel 13' that holds lens groups 11° 12 is provided with element mounting portions 13'a at three locations, for example, and the carrier 1 is attached to the lens barrel 13' by a fastening member 16. It is attached.

In Figure 6, 13'al, 13'a, 1
3'a indicates the installation part of the above three doors, and "bt"
*13'b2.

13'b and 13'b, respectively, indicate the opposite side of the carrier IK of the part. The surfaces 13'b and 13'b are made, for example, by plastic molding, and the plane including these surfaces has a perpendicularity to the lens optical axis to the extent that no one-sided blurring occurs. °Also, when molding with aluminum die casting) K, when post-processing the inner diameter of the lens barrel etc. that requires precision using a lathe, the mounting is done on the surfaces 13'b1 to 13'b.
, can also be processed to further improve the perpendicularity. On the other hand, 4'b1. 4'bt and 4'bs are holes provided in the above-mentioned mounting section 4'a, and the mountings on the lens barrel 13' side are holes 13'a, 13'a, . . .
13'a. In the above, the mounting provided on the lens barrel 13' is the part 13'a1 etc., the surface 13'b+ etc. facing the carrier 1, and the mounting of the plate piece 4' is the part 4'a.
The number of holes 4'b1 etc. provided in the hole 4'b1 is not limited to three, but may be any number greater than or equal to one. Reference numeral 17 denotes a pin provided on the lens barrel 13', and a pin 17 provided on the plate piece 4' of the carrier 1.
8 to position the carrier 1. Furthermore, if the hole 18 is used for positioning when attaching the solid-state image sensor 6, the accuracy of the relative position between the image sensor 6 and the optical axis can be improved when attaching the carrier 1 to the lens barrel.〇 Lens barrel 13 To attach the image pickup element carrier 1 to the lens barrel 13', attach the lens barrel 13' to the section 13' a HH13' a
t g13'al and the plate piece 4' is attached through the hole 4'b of the part 4'a.

4'by and 4'bi should be matched with each other, and fixed with screws 16 via wave washers 19.

In the above configuration, the surface of the solid-state image sensor 1 is completely on the same plane as the plate piece 4', so if the plate piece 4' is perpendicular to the optical axis, the surface of the solid-state image sensor 1 is also perpendicular to the optical axis. guaranteed. The plate piece 4' is mounted on the surface 13'bl,
Since it is attached to the lens barrel 13' on the plane formed by 13'b, , 13'b3, the attachment is done on the plane 1a'bl, 13'b* so that this plane is perpendicular to the optical axis.
* By increasing the processing accuracy of 13'bs, it is possible to guarantee the perpendicularity of the optical axis and the image sensor surface.

Although the example in which the solid-state image sensor carrier 1 is attached to the lens barrel 13' side has been described above, the present invention can also be implemented in an embodiment in which the carrier 1 is attached to the camera body side. In that case, if a surface is provided for mounting the lens barrel on the camera body side and a surface for mounting the image sensor that can maintain sufficient parallelism, the same accuracy as described above can be maintained.

Effects of the Invention Since the present invention has the above-described configuration and operation, when the solid-state image sensor carrier is attached to the main body, sufficient perpendicularity of the solid-state image sensor surface to the optical axis can be realized without adjustment. Furthermore, since a solid-state image sensor supporting body that exhibits the above-mentioned effects can be obtained with a simple structure, it greatly contributes to miniaturization and weight reduction of cameras using solid-state image sensors.

[Brief explanation of the drawing]

Figures 1 and 2 are side views of a conventional solid-state image sensor carrier, Figure 3 is a side view of a lens barrel to which a conventional solid-state image sensor carrier is attached, and Figure 4 is a side view of a conventional solid-state image sensor carrier. A side view of a solid-state image sensor carrier; FIG. 5 is a side view of a lens barrel to which a solid-state image sensor carrier embodying the present invention is attached;
6 is an exploded perspective view of the main parts of FIG. 5. FIG. In the figure, 1 is a solid-state image sensor carrier, 2.3.4.4' is a plate thereof, and 4'a is a part for attaching the plate 4' to the main body. II, 12 is made by the lens, 13.13' is the lens barrel,...
t3'aI to 13'a are mounting parts provided on the lens barrel, and 13'b to 13'bs are mounting parts 13'a to 13'a relative to the solid-state image sensor carrier 1. 0 84 No. □ Figure 5

Claims (1)

[Claims] A carrier for a solid-state image sensor, characterized in that the solid-state image sensor is mounted on a surface of the main body.