JPH0122291Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a mounting adjustment device for aligning the focal plane of a photographing lens and the imaging plane of a solid-state image sensor in a video camera, an electronic still camera, or the like.

[Background of the idea]

2. Description of the Related Art In recent years, semiconductor solid-state imaging devices have come to be used instead of image pickup tubes in video cameras, electronic still cameras, and the like in order to make the cameras smaller and lighter. In order to obtain a desired clear image using this solid-state image sensor, the focal plane of the photographing lens and the imaging plane of the solid-state image sensor must be aligned with high precision. Therefore, one of the photographic lens and the solid-state image sensor is moved relative to the other so that the focal plane and the imaging plane are within a range of 0.045 mm for a photographic lens with an F value of 1 or 2, for example. It is necessary to adjust and make both sides match. Furthermore, after the adjustment is completed, it is necessary to ensure that the distance from the photographing lens mounting surface of the lens mount to the imaging surface of the solid-state image sensor, that is, the flange back, does not become out of order.

By the way, the solid-state image sensor used in the above camera is generally held on the back by a reinforcing plate, and the circuit board on which the circuit used for the solid-state image sensor is printed is superimposed on the reinforcing plate. The camera body is directly or indirectly attached to the camera body, and is covered with a shield case for electromagnetic and mechanical protection. Therefore, in a conventionally known solid-state image sensor mounting and adjusting device that adjusts the relative position between the photographing lens and the solid-state image sensor by operating from the shield case side, a plurality of adjustment devices penetrate through the circuit board and the shield case. It is necessary to provide a hole and use the adjustment hole to adjust the flange back and the inclination of the imaging surface of the solid-state image sensor with respect to the focal plane of the photographic lens. Therefore, adjustment work is difficult, and the effective area of the circuit board is reduced, resulting in a larger board, and furthermore, the electromagnetic shielding effect is reduced. Moreover, since there are usually other boards and mechanical parts behind the circuit board, there is a drawback that it is very difficult to adjust the mounting of the solid-state image sensor after the circuit board is mounted and assembled.

[Purpose of invention]

The present invention solves the above-mentioned drawbacks of the conventional device, makes it possible to easily adjust the tilting and flange back of the solid-state image sensor even after assembling the parts around the image pickup section of the camera, and also makes it possible to easily adjust the tilting and flange back of the solid-state image sensor. It is an object of the present invention to provide a solid-state image sensor mounting and adjusting device that does not require an adjustment hole.

[Summary of the idea]

In order to achieve the above object, the present invention vertically fixes at least three mutually parallel support shafts each having a threaded portion at one end on the solid-state image sensor mounting surface of a reinforcing plate that holds the solid-state image sensor. , the support shafts are slidably fitted into the through holes provided in the lens mount that holds the photographic lens, and the adjustment nuts are screwed into the threaded portions of the support shafts that pass through the photographic lens side, and , it is technically possible to provide a spring means between the lens mount and the reinforcing plate so that the respective support shafts are moved in the direction of the optical axis of the photographing lens by the biasing force of the spring means and the rotational operation of the adjustment nut. This is the main point.

〔Example〕

Embodiments of the invention will now be described in detail as illustrated in the accompanying drawings.

FIG. 1 is a sectional view of an embodiment of the present invention, in which a lens mount 1 that holds a photographic lens L is fixed to a camera body B. As shown in FIG. On the other hand, the solid-state image sensor 2
is connected to the circuit board 4 via a reinforcing plate 3 provided on the opposite side of the lens mount 1 from the photographing lens L.
The circuit board 4 is soldered to the machine screw 5.
It is fixed to the reinforcing plate 3 by. In addition, code 2
a indicates the imaging surface of the solid-state imaging device 2. Further, a shield case 6 is fixed to the lens mount 1 with machine screws 7, covering the solid-state image sensor 2, reinforcing plate 3, and circuit board 4.

Furthermore, the solid-state image sensor mounting surface 3a of the reinforcing plate 3
, three support shafts 9 which are slidably fitted into through holes 8 formed in the lens mount 1 are fixed perpendicularly to the mounting surface 3a and parallel to the optical axis of the photographing lens. . At the tip of each support shaft 9 protruding from the front surface of the lens mount 1 on the photographing lens side,
A threaded portion 9a is provided, and three adjustment nuts that press against the front surface of the lens mount 1 are screwed into the threaded portion 9a. Further, three compression springs 11 are provided between the rear surface of the lens mount 1 and the reinforcing plate 3, surrounding the outer peripheries of the three supporting shafts 9, respectively. It is constantly biased by a compression spring 11 so as to be displaced to . Although the adjusting nut 10 is formed as a hexagonal nut 10A in FIG. 1, it may have a spanner groove on one side as shown in A in FIG. It may be a grooved nut 10B, 10C, or a slotted nut 10D having a large number of small holes on the outer periphery as shown in C.

Since the embodiment shown in FIG. 1 is constructed as described above, when the three adjustment screws 10 are rotated from the photographing lens side of the lens mount 1, the support shaft 9 moves in the optical axis direction, and the support shaft 9 is connected to the lens mount 1 for reinforcement. The distance d between the plate 3 is expanded by the biasing force of the compression spring 11,
It also shortens against the biasing force of the compression spring 11. Furthermore, by rotating any two of the three adjusting nuts 10, the inclination can be corrected so that the reinforcing plate 3 is perpendicular to the optical axis.
Therefore, by simply rotating the adjustment nut from the photographing lens side of the lens mount 1 using an appropriate spanner, the imaging surface 2a of the solid-state image sensor 2 can be adjusted from the flange surface (photographing lens mounting surface) 1a of the lens mount 1 to the imaging surface 2a of the solid-state image sensor 2.
distance (flange back) l and its imaging surface 2
The inclination of a can be adjusted at the same time.

At this time, since the adjustment nut 10 is strongly compressed against the lens mount 1 by the biasing force of the compression spring 11, it will not loosen even if the camera vibrates. Furthermore, since the support shaft 9 is precisely fitted into the through hole 8, the reinforcing plate 3 is not displaced in the direction perpendicular to the optical axis of the photographing lens. Therefore, after the adjustment is completed by rotating the adjustment nut 10, the position of the solid-state image pickup device 2 will not be misaligned due to vibration of the camera. Note that since at least three sets of the support shaft 9, adjustment nut 10, and compression spring 11 are arranged at positions apart from each other, the inclination of the solid-state image sensor can be finely adjusted.

[Effect of idea]

As described above, the present invention not only solves the problem of loss of effective area of the circuit board and reduction of the shielding effect of the shield case as in conventional devices, but also allows the adjustment nut to be placed on the photographing lens side of the lens mount. Since the adjustment operation is made possible even after assembly, the structure is simple and the cost can be reduced.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a perspective view of another adjusting nut having a shape different from that used in the embodiment of FIG. Explanation of symbols of main parts, 1... Lens mount, 2... Solid-state image sensor, 3... Reinforcement plate, 4...
Circuit board, 8... Through hole, 9... Support shaft, 10
(10A, 10B, 10C, 10D)...Adjusting nut, 11...Compression spring (spring means), L...Photographing lens.

Claims (1)

[Scope of utility model registration request] a reinforcing plate that holds at least a solid-state image sensor;
At least three mutually parallel support shafts fixed perpendicularly to the solid-state image pickup device mounting surface of the reinforcing plate and having a threaded portion at one end hold the photographic lens and each of the support shafts is slidably fitted. a lens mount having a through hole, an adjustment nut screwed into each of the threaded portions of the support shaft passing through the through hole and protruding toward the photographing lens side of the lens mount, the lens mount and the reinforcing plate. and a spring means provided between the lens and the lens, and each of the support shafts is configured to move in the direction of the optical axis of the photographing lens by the biasing force of the spring means and the rotational operation of the adjustment nut. Solid-state image sensor mounting adjustment device.