JPS582050A - Heat radiating device - Google Patents

Heat radiating device

Info

Publication number
JPS582050A
JPS582050A JP9951181A JP9951181A JPS582050A JP S582050 A JPS582050 A JP S582050A JP 9951181 A JP9951181 A JP 9951181A JP 9951181 A JP9951181 A JP 9951181A JP S582050 A JPS582050 A JP S582050A
Authority
JP
Japan
Prior art keywords
heat
radiator
generating body
heat generating
substance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9951181A
Other languages
Japanese (ja)
Inventor
Takeshi Sasaki
毅 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP9951181A priority Critical patent/JPS582050A/en
Publication of JPS582050A publication Critical patent/JPS582050A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To excellently conduct the heat generated by a heat generating body to a radiator by a method wherein a gel-formed substance which was formed by mixing metal powder is interposed between the heat generating body and the radiator which performs a heat radiating function by attaching the heat generating body. CONSTITUTION:The gel-formed substance 4, formed by mixing metal powder, is interposed between the heat generating body 2 and the radiator 1 which performs a heat radiating function by attaching the heat generating body 2. As a result, the heat generated by the heat generating body 2 is excellently conducted to the radiator 1 through the substance 4 and the metal powder contained therein, thereby enabling to increase the heat radiation by the radiator 1.

Description

【発明の詳細な説明】 本発明は電気機器におけるパワーＩＣ等の発熱体の放熱
装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat dissipation device for a heat generating element such as a power IC in an electrical device.

一般にラジオ受信器等ではパワーＩＣ等の発熱体を金属
板から成る放熱器に取着するに当り、両者の密着性を良
くする為にシリコングリース等のゲル状物質を上記発熱
体と放熱器との間に介在させている。Generally, when attaching a heat generating element such as a power IC to a heat radiator made of a metal plate in a radio receiver, etc., a gel-like substance such as silicone grease is applied between the heat generating element and the heat radiator to improve the adhesion between the two. It is interposed between.

斯るシリコングリースは一応熱伝導性は良いも゛の＼、
本来これは潤滑剤として機能するものであって放熱効果
を助長発揮させるものとしては今一つ不充分であった。Although such silicone grease has good thermal conductivity,
Originally, this functioned as a lubricant, but it was insufficient in promoting and exhibiting a heat dissipation effect.

本発明はこのような問題点に鑑みて発明されたものであ
り、以下、その一実施例を添附図面に従って詳細に説明
する。The present invention was invented in view of these problems, and one embodiment thereof will be described in detail below with reference to the accompanying drawings.

第１図は本発明に係る放熱装置の一実施例を示す側面図
であり、第２図はその要部拡大図である。FIG. 1 is a side view showing an embodiment of a heat dissipation device according to the present invention, and FIG. 2 is an enlarged view of the main parts thereof.

これらの図において、１はＵ字状の金属板から成る放熱
器、２はこの放熱器１にビス３にて取着されたパワーＩ
Ｃ等の発熱体である。In these figures, 1 is a heatsink made of a U-shaped metal plate, and 2 is a power I attached to this heatsink 1 with screws 3.
It is a heating element such as C.

４は上記放熱器１と発熱体２との間において、これら両
者を密着させる為に上記放熱器１の表面に塗布されたシ
リコングリース等の熱伝導性の良いゲル状物質にして、
斯るゲル状物質にはアルミニウム又は銅等の金属の粉末
が混入されている。4 is a gel-like substance with good thermal conductivity, such as silicone grease, applied to the surface of the heat radiator 1 between the heat radiator 1 and the heating element 2 in order to bring them into close contact;
Such a gel-like substance is mixed with powder of metal such as aluminum or copper.

本発明ではこのように・ゲル状物質４に金属の粉末を混
入させている為、発熱体２の発する熱がゲル状物質４と
その中の金属の粉末を介して放熱器１に良好に伝導され
、放熱器１による放熱を増大させることができる。In the present invention, as described above, since metal powder is mixed in the gel material 4, the heat generated by the heating element 2 is well conducted to the radiator 1 via the gel material 4 and the metal powder therein. Therefore, heat dissipation by the heat radiator 1 can be increased.

尚、実験によると、第３図の如く、常温付近において単
にシリコングリースのみの場合には熱伝導率が１．８　
（ｃａｌ／ｃｒｒｒ　ｓｅｃ’ｃ）であるのに対し、ア
ルミニウム粉末を３０％混入した場合には２．１（ｃａ
ｌ／ｃｍ−ｓｅｃ′ｃ　）、又、銅粉末を３０％混入し
た１ 場合には２．５　　（ｃａｌ／ａｍ−ｓｅｃ’ｃ）とな
って、シリコングリースにアルミニウム又は銅の粉末を
混入することによりパワーＩＣ部の温度上昇を単にシリ
コングリースのみの場合に比べて５〜１０％低く押えら
れることが分かった。According to experiments, as shown in Figure 3, the thermal conductivity of silicone grease alone at room temperature is 1.8.
(cal/crrr sec'c), whereas when 30% aluminum powder is mixed, it is 2.1 (cal/crrr sec'c).
l/cm-sec'c), or in the case of 30% copper powder mixed in, it becomes 2.5 (cal/am-sec'c), and aluminum or copper powder is mixed into silicone grease. It was found that the temperature rise in the power IC section can be suppressed 5 to 10% lower than when using only silicone grease.

本発明は狭止のように発熱体とこれを取着して放熱作用
を為す放熱器との間に金属粉末を混入して成るゲル状物
質を介在させたものであるから、発熱体の発する熱を良
好に放熱器に伝えてこれより放熱させることができ、従
って、放熱器を小型にすることができるので、機器その
もの＼コンパクト化も計れる優れた発明である。In the present invention, a gel-like substance made of metal powder is interposed between a heating element and a heat radiator that radiates heat by attaching the heating element to the heat generating element. It is an excellent invention that can effectively transmit heat to the radiator and dissipate the heat from the radiator, and therefore, the radiator can be made smaller, making the equipment itself more compact.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明に係る放熱装置の一実施例を示す側面図
、第２図は第１図の要部拡大図、第３図は本発明の作用
効果の説明に供する説明図である。 １：放熱器、２：発熱体、４ニゲル状物質。 代理人　弁理士　福　士　愛　彦 第２図 第３丙FIG. 1 is a side view showing an embodiment of a heat dissipation device according to the present invention, FIG. 2 is an enlarged view of the main part of FIG. 1, and FIG. 3 is an explanatory diagram for explaining the effects of the present invention. 1: Heat radiator, 2: Heating element, 4 Nigel-like substance. Agent Patent Attorney Aihiko Fukushi Figure 2, Figure 3 C

Claims (1)

【特許請求の範囲】[Claims] １、発熱体とこれを取着して放熱作用を為す放熱器との
間に金属粉末を混入して成るゲル状物質を介在させて成
る放熱装置。1. A heat radiating device in which a gel-like substance made of metal powder is interposed between a heating element and a radiator that radiates heat by attaching the heating element.
JP9951181A 1981-06-25 1981-06-25 Heat radiating device Pending JPS582050A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9951181A JPS582050A (en) 1981-06-25 1981-06-25 Heat radiating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9951181A JPS582050A (en) 1981-06-25 1981-06-25 Heat radiating device

Publications (1)

Publication Number Publication Date
JPS582050A true JPS582050A (en) 1983-01-07

Family

ID=14249276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9951181A Pending JPS582050A (en) 1981-06-25 1981-06-25 Heat radiating device

Country Status (1)

Country Link
JP (1) JPS582050A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003103044A1 (en) * 2002-05-31 2003-12-11 Parker Hannifin Corporation Thermally or electrically conductive gap filler

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5372465A (en) * 1976-12-08 1978-06-27 Mitsubishi Electric Corp Mounting method of semiconductor to radiator

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5372465A (en) * 1976-12-08 1978-06-27 Mitsubishi Electric Corp Mounting method of semiconductor to radiator

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003103044A1 (en) * 2002-05-31 2003-12-11 Parker Hannifin Corporation Thermally or electrically conductive gap filler
US7208192B2 (en) 2002-05-31 2007-04-24 Parker-Hannifin Corporation Thermally or electrically-conductive form-in-place gap filter

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