JPS58204197A - Vertical type electroplating device - Google Patents

Abstract

PURPOSE:To decrease the loss in electric power of a titled device, to reduce an equipment cost and to improve operability, by disposing electricity conducting rolls over a metallic plate conducted by deflector rolls disposed in a vertical electroplating cell so as to face the deflector rolls. CONSTITUTION:Respective unit electroplating cells of vertical type 1',1'- are disposed in a large-sized plating cell and are dipped in a plating soln. 3. Steel deflector rolls 20 of a large diameter coated with ruber or the like are provided on the lower side of a traveling material 4 and the lower parts of the rolls 20 are dipped in the soln. 3. Electricity conducting rolls 30 of a small diameter are disposed so as to face the deflector rolls on the outside of the material 4 with the material 4 as a boundary whereby the distance between the position where electricity is conducted by the rolls 30 and the surface of the soln. 3 is reduced and the loss of electric power is decreased.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a vertical electroplating device for metal plates such as steel plates. A vertical electroplating device requires less installation space than a general horizontal electroplating device. This has great advantages in that it is sufficient to use An example of this will be explained with reference to FIG. 1. A plurality of vertical plating tanks 1.1, in the illustrated example two vertical plating tanks 1.1, are arranged in tandem in the line direction, and a zinc roll 2.2 is provided in the lower part of the tank. I'm here. Further, above the plating tank 1, a large-diameter current-carrying roll 5 is arranged at a distance from the plating solution 3 to guide a passing material 4 made of a metal plate such as a steel plate and to energize the passing material 4. A hold-down roll 6 is provided opposite to the current-carrying roll 5 for bringing the threading material 4 into close contact with the current-carrying roll 5. On the other hand, in the plating tank 1, an anode 7 is arranged opposite to the threading material 4 at the lowering part and the rising part of the threading material 4. However, such a conventional plating apparatus has the following problems. There is. The first problem is that power loss is large. That is, when plating liquid droplets adhere to the current-carrying roll 5 or when the current-carrying roll comes into contact with the rippled surface of the plating liquid, the plating metal contained in the plating bath is deposited on the surface of the current-carrying roll. As a result, the plated metal partially deposited on the current-carrying roll causes indentation scratches on the metal plate to be plated, and sometimes sparks fly between the metal plate and the current-carrying roll (usually called arc spots), causing damage to the metal plate and the current-carrying roll. This may cause fatal flaws in the roll. Therefore, as shown in the figure, an energizing roll 5 is placed above the surface of the plating solution 3 and above the pinion. However, when the distance between the energization position and the surface of the plating solution 3 is long, there is a power loss due to the inherent electric resistance of the metal plate itself due to the length, and this loss is quite large as will be described later.

The second problem is that the diameter of the current-carrying roll is large, which increases the manufacturing and repair costs of the current-carrying roll. The current carrying capacity of the current carrying roll varies depending on the size of the current carrying roll diameter and the contact pressure between the current carrying roll and the metal plate. It is also necessary to have a diameter that does not cause work hardening noise on the metal plate. In this sense, a current-carrying roll with a large diameter of about 600 to 11,000 iφ is generally used.

On the other hand, in recent electrogalvanizing lines, the plating bath tends to be highly corrosive. In other words, in the insoluble anode method, the bath temperature is increased and the pH is lowered in order to dissolve the metal powder or lumps to be replenished at a sufficient rate.In the n1 soluble anode method, the electrical conductivity is also improved. A chloride bath is often used to As a result, in order to withstand such corrosive conditions, the current-carrying roll is made of a material lined with gold such as Hastelloy or titanium instead of the conventional 5841 class steel roll plated with Ni or Cr. In addition, the current carrying capacity of the current-carrying roll can be increased by increasing the contact pressure with the plate material and by adopting an internal water-cooling system for the current-carrying roll. For example, even if the diameter is about 300 to 400 mm, 1
It has actually improved to about 20-40KA. However, in a vertical plating tank, the minimum diameter of the energizing roll is determined by the dimensions of the anode system, and if the thickness of the passing material increases, it is inevitable to increase the diameter. Therefore, there is a limit to the reduction in the diameter of the current-carrying roll, and it is necessary to use a compact and expensive current-carrying roll.

The third problem is that since the current-carrying roll is disposed below the carrying material, not only does it take a lot of effort to replace the roll, but it is also troublesome in terms of maintenance. As shown in FIG. 1, conventionally, the current-carrying roll is located below the threaded material. As a result, if an arc spot occurs or a foreign object gets caught and causes a flaw in the energizing roll, when replacing the energizing roll, the line must be stopped, the threaded material must be completely cut, and then removed. Must be n.

The present invention solves the above-mentioned problems at once, and its main purpose is to provide a vertical electroplating device with extremely low power loss, low equipment costs, and excellent operability. .

In order to achieve this object, the present invention disposes an energizing roll above the metal plate and entirely inside the deflector roll (4), and further immerses the deflector roll in a plating solution to determine the energized position and the plating solution level. The structure is such that the distance between the two is as close as possible.

Next, the present invention will be explained using a specific example shown in FIG.
The basic difference from the conventional example shown in FIG. 1 is that each unit plating tank 1' is provided in a large plating tank.

1"... are placed and immersed in the jLi plating solution 3, and a large diameter deflector roll 20 is placed below the threading material 4.
The entire lower part of the deflector roll 20 is preferably immersed in the gold plating solution 3, and a small-diameter current-carrying roll 30 is placed oppositely to the outside of the sheet-carrying material 4 across the entire surface of the sheet-carrying material 4. The reason for this is that the distance between the energized position and the surface of the plating solution 3 is shortened. Here, the deflector roll 20 may be made of, for example, a steel roll coated with rubber or the like that will not be corroded by the plating solution 3. The diameter is determined by taking into consideration the dimensions of the anode system, the adhesion of the plate material, work hardening, etc., but generally 600 to 1000 mmφ is suitable. In contrast, the material of the energizing roll 30 may be a conventional steel roll lined with Hastelloy, but its diameter is 500 mm, considering the cost reduction of the energizing roll itself, which is one of the objectives of the present invention. ~200mmφ, especially 400~300
mmφ is desirable. Moreover, the deflector roll 20 is
Although it may be floated from the plating solution 3, there is no problem with the conductivity even if it is partially fully immersed in the plating solution 3 as in the above example. 3. Because it can be placed close to the surface,
The specific resistance of the threaded material 4 is reduced, and power loss is reduced.

In this way, by arranging the deflector roll on the inside of the running material and the current-carrying roll on the outside, the diameter of the current-carrying roll can be reduced, which is not only economically advantageous, but also prevents the current-carrying roll from forming due to the occurrence of indentation flaws. If it becomes necessary to completely replace the sheet, you can simply remove all the current-carrying rolls upwards and reinstall them in a short time without having to cut the entire sheet material.
Furthermore, if the flaw is mild, the surface of the energized roll can be polished using a grinder or the like even during line operation. In addition, since the energizing roll is placed outside the plate material, there is no chance of plating liquid splashes adhering to it, and as a result, the energizing roll can be close to the entire plating solution, and in particular, it is possible to immerse the deflector roll in the plating solution. This makes it possible to minimize power loss based on the specific resistance of the metal plate.

On the other hand, as shown in FIG.
In order to bring the material into close contact with the energizing roll 30, a roll 40 may be provided to press the entire energizing roll 30, or a plurality of energizing rolls 30' with extremely small diameters may be provided as shown in FIG. can. Furthermore, if there is a possibility that the plating liquid may adhere to the energizing roll 30, a squeeze roll 41 is provided in front of the energizing roll 30 to remove the plating solution, as shown in FIG. 5, or as shown in FIG. It is preferable to provide a plating liquid scraper 42 to prevent corrosion of the energizing roll due to adhesion of the plating liquid.

Here, the extent to which the electrical resistance of the threaded material differs between the conventional example and the example of the present invention will be numerically examined. FIG. 7 shows an example of a conventional arrangement, and FIG. 8 shows an example of an arrangement according to the present invention. Electrical resistance R, R″tXw of running plate material
It can come as tXw.

2Φ, ρ: specific resistance of the metal plate, t: plate thickness, W: plate width.

For example, the specific resistance ρ is 16 μΩ·a and the plate thickness t is 0.
When passing a steel plate with a thickness of 8 mm and a plate width of 100 crfL using a conventional energized roll with a diameter of 80 Cr/L and assuming that 11 is 100 crfL, R is calculated as follows: R=3.26X 10"-'(Ω).

For this steel plate, the diameter of 80 crf, which is an example of the present invention, is
Using L deflector roll, lls”r15cn
When L, R'= 1.56 x 10-' (Ω).

This result also shows that the device of the present invention has a remarkable effect on reducing power loss.

As described above, in the present invention, the deflector roll is placed inside the sheet material, and the current-carrying roll is placed outside (8), which reduces power loss and greatly reduces equipment costs due to the reduction in the diameter of the current-carrying roll. This has a significant effect on reducing the amount of energy used, as well as facilitating operation and maintenance. Particularly, by immersing a portion of the deflector mouth in the plating solution, there is an advantage that the total amount of power used can be saved.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram of a conventional plating device, FIG. 2 is a schematic diagram showing an example of the plating device of the present invention, FIGS. 3 to 6 are schematic diagrams showing different roll arrangement structures, and FIG. 7 and 8 are explanatory diagrams used for calculating electrical resistance using the conventional apparatus and the apparatus of the present invention. 1. Vertical plating tank 2. Zinc roll 3. Plating solution 4. Current-carrying material 5-i-type roll 6. Halttown roll 7
...Anode 20...Deflector roll 30, 30'...Electrifying roll Patent applicant Sumitomo Metal Industries Co., Ltd., agent patent attorney
Yoshihisa Nagai '-4 Figure 5 Figure 6 30 Figure 7 Figure 8 514-

Claims (2)

[Claims] (1) A current-carrying roll that energizes the metal plate is placed above the metal plate guided by the deflector rolls placed in the vertical electroplating tank, facing all the deflector rolls. Vertical electroplating device. (2) Above the metal plate guided by the deflector roll arranged in the vertical electroplating tank, an energizing roll for energizing the metal plate is arranged opposite to the deflector roll, and Vertical electroplating device 0 characterized in that the entire lower part of the deflector roll is immersed in the plating solution