JPS5820414A - Molding method for resin - Google Patents

Abstract

PURPOSE:To obtain a resin molded article with high accuracy, by a method wherein a photosensitive resin in a thick plate form is exposed to light through a photo-mask placed in close contact with the resin or by projecting light thereon, is subjected to etching development, and the thus shaped article is used as a mold in which a predetermined resin is molded. CONSTITUTION:Numeral 1 denotes a photosensitive resin, and numeral 2 denotes the photo-mask, the parts of which faced to the part 3 to be left after etching is light-transmitting, while the other part 4 is opaque. The resin 1 is supported on a base plate 5. The resin is exposed to light through the photo-mask 2 placed in close contact with the resin 1 or by projecting light thereon. In this case, the light entering the resin 1 through the light-transmitting part 3 is gradually diffused in the interior of the resin 1 as indicated by broken lines. Then, development is conducted by etching away the resin part faced to the opaque part 4 of the photo-mask 2. A resin 7 is poured into the etched part 6 and is hardened. Accordingly, since the exposure through the photo-mask 2 and the development are highly accurate, it is possible to obtain a molded article with high accuracy.

Description

[Detailed description of the invention] This invention relates to a resin molding method.

Recently, a processed product with excellent insulating properties (14) has been used in stacked equipment, and depending on the type of telegraph equipment, a large number of grooves can be lined up to eliminate narrow IJTL intervals. For example, an electrode holder force is used to support a large number of thin electrodes in parallel. Conventionally, this thin electrode holder was manufactured using highly insulating materials such as glass,
1. Cut the surface of the quartz plate or ceramic plate using a diamond cutter or wire saw. According to the force required to mechanically cut 11 grooves to a depth of 05 to 2 mm, for example, a depth of 10 mm (6 degrees of machining is possible) 0^ 1.Groove spacing force (0.1mm In the case of 171, the partial force between the groove and 7111'1);; Yes, 1. Tajaku's machining method uses this method, and the accumulated force is extremely high (c. ■ Machining the groove one by one [/-1], so -) X + time required for machining ≠ X invasion ≠ E < There are 18 disadvantages≠.

When using resin as a light insulating material or LL, use a mold 1. The force that can be considered (the force used here is 7rt 2111'ft) - the force used here is 7rt 2111' ft - in the case of the production process, the cutting process of this machine will yield a roughness, this) - Kike 11
[Statement 1. Due to the same reason as above, there are problems in terms of yield, processing time, etc.

This invention relates to the improvement of a method for obtaining molded products by resin molding using a convenient cedar mold.17 In particular, by manufacturing a mold with a surface precision If, resin h with high precision can be obtained.
The purpose is to collect 4 videos.

This research is based on a book in which a mold is fabricated using a photosensitive resin with a 1° deviation, and this is exposed and developed using a photomask according to the required pattern to make a groove according to the pattern described above. and put this into the mold and 1
- It is characterized by resin molding.

When exposed and developed using a photomask, Mori can produce a photomask pattern with an accuracy of □mm or more; it is possible to achieve a precision of 0.0000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000000, Teru. 1. Using a photomask with a photosensitive resin. If exposed and developed, a mold as fine and highly accurate as L* can be obtained.

If you expose and develop photosensitive resin using a photomask as described above, you will be able to perform microscopic and daytime-accurate processing. The photosensitive resin processed product is used in the mold.
It is possible to use it in

1. However, if the 112-shaped product to be obtained is extremely thin, this will not be a problem, but if the thickness is less than about 75X, α5 mm, the following disadvantages will occur.

That is, using a photomask 1. When exposing the photosensitive resin to light, as it progresses in the thickness direction of the photosensitive resin, light scatters around it as it progresses. As a result, the exposed area will spread out and become distorted.

Therefore, even if the unexposed area is etched 1- and developed 1-,
The width of the resulting groove becomes narrower towards the bottom. Insert the electrode into this groove 1. Yorato 1. However, the groove spacing force 5 cannot be obtained and it is difficult to support f4 and fx. 1. Therefore, it is advantageous for actual use to directly mold products using photosensitive resin.

In this respect, the present invention has 12 points (according to the above-mentioned method), if the 4-factor photosensitive resin is exposed to light using a photomask and developed, the resulting resin is formed into a resin by form using a mold and 1-. The groove formed in the 21 molded product has a wide open surface and a groove that hangs against itself at the bottom and narrows the I distance. The groove spacing can actually be obtained.

An embodiment of the invention will be described with reference to the drawings 1-. 1 is a photosensitive resin ('ft is about 1 mm thick), and here a negative type A is used. 2 is the part facing the part 6 to be etched in the first step with a photomask. 3
One part is translucent, and the other part is opaque'#: I4. ．． L-
has been done. 5 is a substrate that supports the photosensitive resin 1 and 17; Using a photomask 2, adhere it to the photosensitive resin 1. Full exposure or projection exposure. As the light enters from the part 3 of the J-^ translucent 1, as it progresses, it is internally diffused 11, and as shown by the line in Fig. It is.

Then, the non-exposed area, that is, the area facing the non-light-transmitting area 4, is etched and developed using an etching solution manufactured by Tokoro. At the end of this development, the lying position is 1. power; Figure 2.

As can be understood from this figure, the non-etched part 1' It is natural that the culm width of the rod becomes wider by 5 from the bottom.

As shown in FIG. 2, the processed skin shape is placed in a mold 12
7 fl of resin is poured into the etched portion 6 and hardened. A substrate 8', 2 is provided on the cured resin 7 (see Figure 7r).As will be understood from now on, a portion 71 corresponding to the non-etched portion 5 is formed.
grooves 9 and 1. This means that this groove 9
is formed so that the opening width μ is 1/-1 and the bottom is gradually narrowed by 1-1 force from the surface.

1. Therefore, if the electrode is inserted into the groove 9 with a width that matches the width of the bottom + thickness, the electrode will be inserted with the bottom width of the groove 9). You will definitely be held in and supported.

In this case, the width of the bottom of the groove 9 matches the width of the translucent portion 30 of the photomask 2 in FIG. Since the various precisions of G are possible, 00 Ij? -hf and the width of the bottom of the groove 7 7'1i is maintained at a high degree of clarity b7. I don't want to be shaped. Similarly, the above 1- or exposure.

By development. L-can also has fine patterns of several microns! For the purpose of application, the width of the groove 9 and the interval between the grooves can be formed and shaped to the same degree as that of the groove.

In addition, the resin frame used here is shrinkage force 5.
Using a small book with Hitomi 1. Finally, my father will need a detailed insulating car, so it is a must to use an insulating book. I am completely satisfied with these bindings and 1
．． Then, epoxy resin, silicone tAflllL polyester resin, acrylic resin, styrene resin, and reinforced products of these resins are not suitable for φKfψ. Also, for the board 8 and j, this requires an insulating material ≠ 5, right?
Glass, phenolic resin.

Polyimide resin, epoxy resin, hexaramic, etc. are suitable.

The photosensitive secondary resin used in this invention is not limited to positive type books, but can also be used for negative type books. However, if you use an inverted version of the photomask shown in the figure, you won't get dandruff IA.

FIG. 4 shows an example of the use of the molded product obtained by this invention. Kodeke bv Kageshinzu Z'#! is a pole holder 10, and the two of them are mutually subjected to a directional force h1. Insert the end of the 11 into the 1-2 groove 9 and hold it. In this case, pour a suitable resin into the groove 9 to make it stick to the L side (8.

As described in detail below, according to the present invention, a product with a high-precision and deep-blue resin film 1 can be manufactured at φ. Maybe the wife and child will definitely be responsible for the production.

[Brief explanation of the drawing]

FIG. 3 is a cross-sectional view showing steps related to an embodiment of the present invention, and FIG. 4 is a cross-sectional view showing an example of how a molded product is used. 1...Photosensitive resin, 2...Photomask,
5...Non-etched part, 6...Etched part, 7...Molded resin, 9...Groove Patent applicant: Shimadzu Manufacturing Co., Ltd. Agent: Yoshinori Nakazawa □, [

Claims (1)

[Claims] A photomask is closely attached to a thick photosensitive resin at 1°, total light or projection exposure is performed, and the molded product is molded. Tosufuki 11tj molding method.