JPS58201336A - 半導体装置における配線層幅の測定方法 - Google Patents

半導体装置における配線層幅の測定方法

Info

Publication number
JPS58201336A
JPS58201336A JP8432582A JP8432582A JPS58201336A JP S58201336 A JPS58201336 A JP S58201336A JP 8432582 A JP8432582 A JP 8432582A JP 8432582 A JP8432582 A JP 8432582A JP S58201336 A JPS58201336 A JP S58201336A
Authority
JP
Japan
Prior art keywords
wiring
wiring layer
test
width
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8432582A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6226178B2 (enrdf_load_stackoverflow
Inventor
Akira Morikuri
森栗　章
Eitaro Sugino
杉野　栄太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8432582A priority Critical patent/JPS58201336A/ja
Publication of JPS58201336A publication Critical patent/JPS58201336A/ja
Publication of JPS6226178B2 publication Critical patent/JPS6226178B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP8432582A 1982-05-19 1982-05-19 半導体装置における配線層幅の測定方法 Granted JPS58201336A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8432582A JPS58201336A (ja) 1982-05-19 1982-05-19 半導体装置における配線層幅の測定方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8432582A JPS58201336A (ja) 1982-05-19 1982-05-19 半導体装置における配線層幅の測定方法

Publications (2)

Publication Number Publication Date
JPS58201336A true JPS58201336A (ja) 1983-11-24
JPS6226178B2 JPS6226178B2 (enrdf_load_stackoverflow) 1987-06-08

Family

ID=13827357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8432582A Granted JPS58201336A (ja) 1982-05-19 1982-05-19 半導体装置における配線層幅の測定方法

Country Status (1)

Country Link
JP (1) JPS58201336A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002286780A (ja) * 2001-03-23 2002-10-03 Nippon Sheet Glass Co Ltd 金属配線の検査方法および検査に適した半導体デバイスの構造

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02146980U (enrdf_load_stackoverflow) * 1989-05-10 1990-12-13

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002286780A (ja) * 2001-03-23 2002-10-03 Nippon Sheet Glass Co Ltd 金属配線の検査方法および検査に適した半導体デバイスの構造

Also Published As

Publication number Publication date
JPS6226178B2 (enrdf_load_stackoverflow) 1987-06-08

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