JPS58196848U - IC pad - Google Patents

IC pad

Info

Publication number
JPS58196848U
JPS58196848U JP9535682U JP9535682U JPS58196848U JP S58196848 U JPS58196848 U JP S58196848U JP 9535682 U JP9535682 U JP 9535682U JP 9535682 U JP9535682 U JP 9535682U JP S58196848 U JPS58196848 U JP S58196848U
Authority
JP
Japan
Prior art keywords
pad
hole
base
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9535682U
Other languages
Japanese (ja)
Inventor
均 今井
茂 三宅
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP9535682U priority Critical patent/JPS58196848U/en
Publication of JPS58196848U publication Critical patent/JPS58196848U/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図イはＩＣをプリント基板に実装させた状態の従来
のＩＣ用パッドを示す側面図、第１図口は第１図イに示
すＩＣ用パッドの上面図、第２図イはＩＣをプリント基
板に実装させた状態のこの考案に係るＩＣ用パッドの一
実施例を示す側面図、第２図口は第２図イに示すＩＣ用
パッドの側面図、第２図ハは第２図イに示すＩＣ用パッ
ドの上面図、第３図イはＩＣをプリント基板に実装させ
た状態のこの考案に係るＩＣ用パッドの他の実施例を示
す側面図、第３図口は第３図イに示すＩＣ用パッドの側
面図、第３図ハは第３図イに示すＩＣ用パッドの上面図
、第４図イはＩＣをプリント基板に実装させた状態のこ
の考案に係るＩＣ用パッドのさらに他の実施例を示す側
面図、第４図口は第４図イに示すＩＣ用パッドの側面図
、第４図ハは第４図イに示すＩＣ用パッドの上面図であ
る。 図において、各図中同一部分には同一符号を付しており
、１はＩＣ用パッド、１０１は基台、１０２は貫通孔、
１０３は溝、１０４は孔、２はＩＣ，２０１はピン、３
はプリント基板である。Figure 1A is a side view showing a conventional IC pad with an IC mounted on a printed circuit board; Figure 1A is a top view of the IC pad shown in Figure 1A; A side view showing an embodiment of the IC pad according to the invention mounted on a printed circuit board, FIG. 2 opening is a side view of the IC pad shown in FIG. 2 A, and FIG. A is a top view of the IC pad shown in FIG. Figure 3C is a top view of the IC pad shown in Figure 3A, and Figure 4A is the IC pad according to this invention with the IC mounted on a printed circuit board. FIG. 4 is a side view of the IC pad shown in FIG. 4A, and FIG. 4C is a top view of the IC pad shown in FIG. 4A. In the figures, the same parts in each figure are given the same symbols, 1 is an IC pad, 101 is a base, 102 is a through hole,
103 is a groove, 104 is a hole, 2 is an IC, 201 is a pin, 3
is a printed circuit board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板上に設置される絶縁物からなる基台、前記
基台の一表面から他表面にかけて貫通して設けられ一表
面側から前記プリント基板に接続されるＩＣのピンを貫
通挿入する貫通孔、及び前記基台の外周表面に穿設され
前記貫通孔に連通ずる孔もしくは溝または切欠きを備え
たＩＣ用パッド。a base made of an insulator installed on a printed circuit board; a through hole provided penetrating from one surface of the base to the other surface and into which a pin of an IC to be connected to the printed circuit board is penetrated and inserted from the one surface side; and an IC pad comprising a hole, groove, or notch formed in the outer peripheral surface of the base and communicating with the through hole.
JP9535682U 1982-06-23 1982-06-23 IC pad Pending JPS58196848U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9535682U JPS58196848U (en) 1982-06-23 1982-06-23 IC pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9535682U JPS58196848U (en) 1982-06-23 1982-06-23 IC pad

Publications (1)

Publication Number Publication Date
JPS58196848U true JPS58196848U (en) 1983-12-27

Family

ID=30227756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9535682U Pending JPS58196848U (en) 1982-06-23 1982-06-23 IC pad

Country Status (1)

Country Link
JP (1) JPS58196848U (en)

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