JPS58192342A - Inspecting method of pattern - Google Patents

Abstract

PURPOSE:To decide a critical degree of a defect appropriately by calculating distances up to picture elements at specific positions from the boundaries of the patterns about sample and standard patterns according to a specific rule and comparing them. CONSTITUTION:Distance converting value is shown as a position (i, j) in F(i, j) and the sample and standard patterns in f(i, j) and g(i, j) and these value and patterns are processed by a formula F1(i, j)=[F1(i, j-1)+f(i, j)].g(i, j) in the most fundamental case when the sample pattern extends in the longitudinal (i) direction and there is the defect in the orthogonal (j) direction. The patterns are scanned in the (i) direction, and a formula FK(i, j)=FK(i, j-1) is formed in a defect section of f=0 and g=1, but f=1 and g=1 and a formula FK(i, j)=FK(i, j-1)+1 are formed in a normal section, and a formula FK(i, j)=0 is formed when g=0 holds. Accordingly, the value of the lowermost sections of the patterns indicates pattern width by sequential propagation, and compared with a reference value, and the critical degree can be determined. A position to be compared j8 is obtained by a foromula D(i, j)=g(i, j).[1-g(i, j+1)] from the standard pattern (g). When width in the plural directions is measured independently and decided at every direction, the critical degrees can be determined about defects of every kind.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for inspecting patterns such as wiring patterns of printed circuit boards and semiconductor integrated circuits.

Conventionally, methods for detecting defects in wiring patterns of printed circuit boards and semiconductor integrated circuits include (1) a method of comparing the pattern to be inspected with a standard pattern, and (2) a method of identifying a part with a specific characteristic in the butter 7 to be inspected as a defect. There are ways to do this. In both of these methods, only two dimensions of the position of the defect can be determined, and the criticality of the defect pattern cannot be determined.

In order to completely solve this problem, a method has recently been devised in which the line width of a pattern is examined and if it is smaller than a fixed reference value, it is determined to be a fatal defect. However, in general, the degree of fatality given to a defective pattern is determined not by the line width of the pattern itself but by the ratio of the width of the defective pattern to the width that the pattern should have under normal conditions. Therefore, with conventional methods, it has been impossible to determine defective patterns in consideration of criticality.

SUMMARY OF THE INVENTION An object of the present invention is to provide a pattern inspection method that solves the problems of the conventional methods described above and can more appropriately determine the criticality of defects in wiring patterns and the like.

In order to accomplish this goal, the present invention detects the width of the pattern to be inspected, and at the same time detects the width of a standard pattern prepared in advance from the design data of the object, and calculates the ratio of these widths. Determine the degree of fatality. According to this method, unlike the method of comparing with a fixed reference value, even if the H@ of the defective pattern is the same, the smaller the line width of the original normal pattern, the more fatal it becomes. This will come close to human judgment standards. The width of the pattern is determined by special distance conversion processing. This distance conversion process is
This is a conversion that calculates the distance in picture element 1 at each position from the pattern boundary according to a certain rule. Therefore, the widths of the patterns can be compared based on the distance conversion values of picture elements at specific boundaries of the standard pattern.

Hereinafter, the present invention will be explained in detail with reference to Examples.

FIG. 1 shows the overall configuration of an inspection device that can employ the pattern inspection method of the present invention. 7 is a computer that controls the whole, and the control signal 7 from the inspection object 1oFi meter 7
It is placed on a stage 9 whose position is controlled by a.

The pattern of the inspection object 1o is determined by the synchronization signal 6 by the imaging device l.
Rask scanning is performed in synchronization with a and becomes the Eirin signal 1s. This video signal IS is sampled by a basic clock signal 6d by a pattern extraction circuit 2 consisting of a binarization circuit, etc., and is binarized to produce a pattern to be inspected signal 2S.
is converted to -10,000, pattern generation circuit 4 is memory circuit 5
The standard pattern data representing the inspection pattern when there are no defects stored in
, j) in synchronization with the pre-test pattern signal 2S. The determination circuit 3 is related to non-invention, and processes the pattern to be inspected 2S and the standard pattern 48t in parallel to determine the fatality of the defect, and if the defect is fatal, an image outputted from the synchronization signal generation circuit 6 The X and Y coordinate signals 6cf of the screen are stored at that point. After the memorized scan of the XY locus 113S with the fatal flaw is screened, it is read by the computer 7 and displayed on the display device 8.
is displayed as defect inspection result 1b.

First, the basic principle of the pattern inspection method in the determination circuit 3 will be explained. FIG. 2 depicts the basic case of the direction of the pattern of yarn placement and the direction of defects. The longitudinal direction of the pattern to be inspected (in the case where the direction is predetermined in one direction and there is a defect extending in a direction perpendicular to the longitudinal direction (for example, A in Fig. 2,
, A4 or Bl - B4 or C, , C4 or D+,
For D4), the width of the pattern can be determined by performing one of the following distance conversion processes to determine the distance in one direction.

Here, Fb (j, j) (k=1 to 4) is (i+j
) coordinates, f(i+'j) is the pattern to be inspected, and g(i, j) is a standard pattern that corresponds to '(is j) by one. These distance conversion processes are effective when the scanning direction of the pattern photographing device 1 is the i direction. FIG. 3 shows the case of 81 to explain the above equation. In the figure, f (is j)=Ot g(
is j)=1, that is, in the defective part, Fk ('*
J)"Fk(1+J1), and the above distance conversion value is transmitted as is.

f (is j) = 1s g (is j) = t, -r, so in the normal part FiFh (j, j = Fh (31J
1) It becomes +1 and is added to the above distance conversion value.

When g(i,j)=O, the distance conversion value is always 0. The value at the bottom of the Fh (i, j) pattern (the part marked by arrow j in the figure) resulting from such processing represents the width of the pattern, and by comparing it with the standard value, it is possible to determine whether it is fatal or not. can be determined. Note that in order to know the position J@'t7 to be compared, data D (i, N) indicating whether each picture element (i, j) belongs to this position may be stored in advance, but standard It can also be determined from the pattern g(i, j) as follows.

Figure 3 shows the case of A, , A, and g(i, j
)=1 and g(i, j+1)=0 is the location to be determined. In addition, if the reference value to be compared is not a constant and the width of the standard pattern differs depending on the location, in the same way as the previous distance conversion, the standard pattern g(i, j ), the width of the standard pattern, that is, the reference value, may be sequentially determined and compared with the width of the pattern to be inspected.

In the above explanation, we have taken up the case where the wiring pattern has one direction and there are only defects in the direction perpendicular to the pattern, but in reality, Fig. 2A, , As , A,
, A6 and tlB, , B, , B, .

Bs or Ct, Cs, Cs, Cs or Dt
*D, @Ds = Da, even if the direction of the pattern is fixed, the directions of the defects may vary.

In such a case, independently measure the distance propagation in multiple directions, that is, the width in multiple directions, as shown in the following equation:
The determination may be made for each direction.

In order to treat Fs, Fa −F4, Bs ~
To deal with both,B,,F,,F,,F,.

In order to deal with any of C1 to C6, F.

In order to deal with all of F, , F, , D, to D6, it is necessary to perform all the distance transformations of Fl m FW + F4. For example, if the direction of the pattern is A
If it is known that I-A, throat extends to the left and right of the figure, perform distance conversion of the inspection pattern based on each of 2Fl * F's IF4, and among these results, the distance at the edge of the pattern The width of the inspection pattern is determined by the result that gives the minimum value among the values, or F,...
F,,F.

The test pattern is judged to have a fatal defect by comparing the results based on each of them with the normal pattern width to determine the fatality of the pattern. Then, it can be determined. The method for determining the degree of fatality will be described later.

Note that the positions at which the distance conversion values should be compared with the reference values can be determined as follows for horizontal patterns 81 to A6. In addition, if the reference value to be compared is not a constant but varies depending on the location, the input cover f
('t j), perform each distance conversion (three of F t to F4) on the standard pattern g ('* j), sequentially find the width in each direction of the standard pattern, and obtain the reference value. And it is sufficient.

In the explanation so far, a method has been described for the case where the wiring patterns are aligned in one direction in advance.Next, a method for the case where the wiring pattern has not one direction but a plurality of directions will be described. Basically, the direction of the input pattern and the direction of defects are not known at all, so firstly, Fs
+Ft*Fs+F4 All distance transformations may be performed on the input cover turn, and then the determination may be made selectively according to the direction of the input cover turn. The selection method is as follows by determining the position of the boundary of the pattern to be determined for each of the distance transformations F, , F, , F, , F4 from the standard pattern g(i, j) corresponding to the input cover turn. All you have to do is ask.

For example, when the incoming cover pattern is a horizontal pattern, ,D,,D, is 1 at the bottom boundary of the pattern, and a distance conversion value based on Ft, Fs, and F4 corresponding to that direction is determined. For vertical patterns, the right border is,
D, becomes 1, and the left boundary becomes 1, so Fy
The distance conversion of −Fs is determined on the right boundary, and the distance conversion of F4 is determined on the left boundary.

For an up-right pattern, the bottom-right border is.

Since D, ,D, is 1, FlsF, , at the lower right boundary
A distance transformation of F is determined. In the case of a downward-right pattern, the lower left boundary, ,D, becomes 1, and the upper right boundary, 1, so the distance conversion of F,,F4 is performed at the lower left boundary, and F at the upper right boundary. .

The distance transformation will be determined. Therefore, D1
~D, for those that become 1 at the same time, ~F4
Among the conversion results, the smallest one becomes the pattern width of the defective part. Therefore, by comparing this with the width of the t-standard pattern, the criticality can be determined. 1, I did not find the minimum value, and among the conversion results of Fl to F4, it became 1 among Dl to D4. If there is a fatality level in any comparison, it can be determined as fatal.By doing this, Fl, Ps, F4, Bt to B6 to deal with A and to A6 in Fig. 2 are automatically determined. The distance conversion of F, FL, F, C, C6 to deal with F, F, F, F, D1 ~ D6, and FL, F, F, F, F, F, F, F, F, F, F, F, F, F. It is valid for the pattern of .The width of the standard pattern to be compared (
If the reference value) differs depending on the position, use the standard pattern g (
It is sufficient to perform each distance transformation on i, j) and sequentially obtain the respective widths and use them as reference values.

FIG. 4 shows an example where the defect extends not in one direction with respect to the wiring pattern but in roughly 45 directions with respect to that one direction. In order to deal with such defects, it is possible to change the distance conversion of Fl + Fl +F, , F4 as follows, so that the value of the distance conversion can be transmitted from two directions. . Here, Ml of the following formula,
() indicates the minimum value among the numbers in parentheses.

Figure 5 (a) to (d) are the above formulas F, ~F 4 't'' g
This is to clarify the contents. The lattice diagram part of the figure is Fh (
'y j) t= indicates the distance value to the other two picture elements used to find it, and the multiple arrows written under the grid diagram section indicate the basic propagation direction of each distance transformation. Therefore, each distance transform can propagate distance transform values in four directions. Figure 6 is Figure 4A, 1°t3tt
Distance conversion Fl * F4 of equation (6) for e C11
This shows specifically how the distance IIt propagates when each of *F is applied, and it can be seen that the remaining dimension l of the pattern is propagated to the 10,000 boundaries according to each distance transformation. . As can be deduced from this figure, all the defects in FIGS. 4 and 2 can be addressed by the four distance transformations Fl e Ft e Fl *F4. That is, Fl and FS for defects A, ~A,, Ao''-A, 1! in the horizontal pattern, and defects B1 to f in the vertical pattern.
3s t t3ts ~ For B
+-F for Da1.

It is sufficient to perform the distance conversion of F4 and F4, and make a determination for each at the boundary position of the next standard pattern.

(For F) If we do this, only the functions D1 ('* J ) and Ds ('* J) are 1 at the bottom boundary of the horizontal pattern, 3 at the right boundary of the vertical pattern, and the left At the boundary of the function Dt, only is 1, at the lower right boundary of the upper right pattern
, Da is 1, and only the lower left boundary function of the turn, , D, is 1, and it is possible to selectively determine the results of the distance transformation required for each pattern defect described above.

If the reference value to be compared differs depending on the position, it is sufficient to sequentially apply the same distance conversion to the standard pattern to obtain the width and use it as the reference value.

Figure 7 shows the basic principle explained above, that is, a principle that can be applied to the more defects shown in Figures 2 and 4 when the direction of the wiring pattern, the direction of the defect, and the standard pattern width are not constant. This is a concrete example. In the following, distance conversion is performed based on equation (6), and the judgment boundary position is determined by equation (
5).

In the figure, 2S is a binary test pattern signal that is output in time series from the pattern extraction path 2, and a standard pattern signal that is output from the 4SL pattern generation circuit 4 in synchronization with the test pattern. . The distance judgment circuits 1, 2, and 3.4 each use the functions Fs,
Functions D1, D, which are subjected to distance transformation based on F't, Fs, F4, and created from the stretch rate pattern.

D3. Compare the distance conversion values at the determination boundary where D is l, and if there is a fatal defect, the signal is 11. If there is no fatal defect, the signal is 0.
Is, 3028, 3038.3048. It should be noted that these signals indicating the presence of a fatal defect are synchronized so that the one with the longest delay in the distance determination circuits 1, 2, 3.4 is used as a reference. After ORing these signals, only if this signal is 1, the XY coordinate 4t16c from the synchronization signal generation circuit 6 at that time
is stored in the storage circuit 305. By doing so, the position of the fatal defect can be memorized.

For this reason, the distance determination circuits 301 to 304 are configured to process the signals 28 and 4S' at the same time so as to output determination results for the same picture element (it j). Additionally, the X and Y coordinates 6c are signal 3.
The synchronizing signal generating circuit 6 is configured to output the current scanning position coordinates of the imaging device 1 with a delay of the processing time so that 018 to 3048 are the addresses of the corresponding picture elements.

FIG. 8 is a pattern diagram showing the process of processing the inspected pattern 2S and the standard pattern 4S in the distance determination circuit 3.

In the figure, T6 and So are the lateral direction (i direction) on the object 10
It extends to

This shows a part of the wiring pattern, where To is the pattern to be inspected, that is, the butter / represented by signal 2S in Figure 1, and So is a standard pattern stored in advance, which corresponds to signal 4S in Figure 1. . Here, we have already reduced the function representing the presence or absence of a pattern for each pixel (i, j) of the inspected pattern and the standard pattern <, f (i+
j) s g('* j). The point (ilj) is the coordinate of one picture element and corresponds to the x+Y coordinate described above. Therefore, for f(i, H, f (i-it j) + g
u-1,j> is 1, before the basic clock, f(i.

j-1) is the signal 2 input before the raster scanning period.
Corresponds to 8.48. However, it is assumed that these functions only take a value of 0.1, and 1 represents the entire existence of the actual wiring pattern. T,,S.

is a pattern that represents the distance of each picture element (i, j) 1 from the upper boundary of the wiring pattern 'ro, S, and these distances are expressed by the following relationships already stated in equations (6) and 9 and equation (7). It is determined by the formula.

Here, Fs (1, J) − Os (', J)
is a multivalued function. S3 is a pattern representing a function indicating the determination position of the standard pattern S0, and this function is
As mentioned above, from the standard pattern g(i, j), equation (7)
is the function Ds(!, j).

Ds(i, j)”g(i, j) g(f 1. j
)"(1g(i, j+1))(9) T,,S, is for each pattern Tt-8t,
This pattern is constructed by extracting picture elements corresponding to 1 of pattern S, and is expressed by the following equation.

The patterns Tt and Ss are the original patterns So and T.

When the width is around , the information is expressed as multivalued information.

Therefore, by comparing both St and Ttk, the fatality of the defect can be determined. For example, if the width of the pattern to be inspected is 1/α or less of the width of the standard pattern and it is a fatal defect, then the fatal defect function Ho(iej) may be calculated using the following formula.

C0 is a pattern after determination, where 1 represents the presence of a fatal defect, and α=2. In addition, upper 5 Yu-9° care a... Yoo. , □yo (I. According to this method, the width of each position of the standard pattern can be found sequentially, so even if the width of the pattern differs at each location, the criticality can be determined accordingly.

FIG. 9 shows a distance determination circuit 3 for realizing the above process.
This figure shows an example of a specific 15J road configuration. In the figure, 2S is a binary test pattern signal output in time series from the pattern extraction circuit 2, and 4Sti is a standard pattern signal output from the pattern generation circuit 4 in synchronization with the test pattern signal 3S. Test pattern signal zs
While referring to the n, m quasi-pattern color code 4S, the distance conversion circuit 31 converts f(i, j) to Fs(i
, j). This [7te pattern T, (
A signal 318 representing r is applied to d. In synchronization with this, the force separation conversion circuit 3 and the boundary oil field circuit 33 perform conversion from the formulas %j) and g(i,j) to Ds(i,j), respectively. In this way, the signals 328, 338? representing the signals G3 (ie J )e Ds (i, J) of each picture element of the patterns S, , S, respectively? Output. 34°3
5 is a gate circuit consisting of an AND gate, and Fm
('s J )s Gm ('t J ) For each bit of the multi-value pattern signals 318 and 328, D
By ANDing with the binary signal 338 representing a (ie J ), Fs'('s J L Gs' (
'+J) multi-value pattern signals 348, 358
are obtained respectively. The pattern for these signals is
This corresponds to T's and St in the figure. 36 ke, p,'(t.

This is a comparison circuit for comparing Gs' (led) with Gs' (led), and outputs 1 as a signal 303S only when Gs'('+ j )/α-F's' (i, j) is positive. signal 30
38fl, function H6(i.

j) no i [represents wo. And this Ha (”* J
) is 1, where a fatal defect exists.

FIG. 10A shows a specific configuration of the distance conversion circuit 31, which is composed of a shift register 312, a logic circuit 311, and a delay circuit 313.

As will be detailed later, the logic circuit 311 receives the signal 28°4S.
are both signals f(i, j) for picture elements (i, j).

j) When t g(i, j), a signal 311S representing the distance F3 (1, J) to the picture element (j, j) is output.

The shift register 312 has a width equal to the number of effective picture elements in one raster scan of the imaging device plus one pixel, has L bits in the depth direction, and receives a distance signal 311S outputted from the logic circuit 311. Therefore, if L=8, distances up to 255 picture elements can be stored. The shift register 312 has a period t equal to the period for the imaging device 1 to scan one pixel.
ri clock 6eK and performs shift operation.

Therefore, the output 31 of the final stage of the shift register 312
2b is the current input signal 28.48 to the logic circuit 311 when it is a picture element (i, j), the distance Fs (i 1.j
-1), and the output 312a of the shift register 312 one stage before the final stage represents the picture element (i, j-1) before the -raster.
) represents the distance Fs(i, j 1). The configuration of the logic circuit 311 is shown in FIG. 10(B). In the figure, 31
11 is a comparator, and only when 312a is large, 31
118 becomes 1. On the other hand, 3112 is a selection circuit;
If 1118 is 1, 312b is selected; if 1118 is 0,
312a is selected. Therefore, 31128 is 312
The smaller of a and 312b will always be left behind. Therefore, the signal 311s is the signal Fm (i-x, j-
x) and Fs (is J 1) represent the infertile ten thousand.

3113 is an adder which adds power to the multi-level signal 31128 and the binary signal 2S to form a signal 31138. 3114 is a gate circuit consisting of an AND gate, and each bit of 31138 is ANDed with the binary signal 4S, and the 3118
The signal of ° is output. The correspondence between signals and expressions is 3112
8 is MI.

(Fa (i-1, j-t), Fa (i, j-
1) L31138 is MI-(Fs(i 1 ,
J 1) * Fs (dish.

"-1))+r<i, j>, 3118 is "s(
'+j)=[M Im (F s (11t J 1
) + F s (t l J i ) ) + f(
i, jl·g(i, j). With such a configuration, the distance Fs(!, j) of the pattern to be inspected with respect to f(i, H) is found.The delay circuit 313
j゛Distance conversion pattern Fm (i-j) and size f
The timing can be completely synchronized with the boundary Ds(i+j) at f', and a shift register with a length equal to the number of effective picture elements in one raster of the imaging device can be used for 1! to be accomplished. Therefore, when signal 28.48 corresponds to picture element (i, j), output 318 will represent the distance Fs(t, J 1) to -raster previous picture element (i, j-1). The distance conversion circuit 32 receives the input signal 2 in FIGS.
It is only necessary to set S to 48, and the other configuration is completely the same as that of the distance conversion circuit 31.

FIG. 11(A) shows a specific configuration of the boundary extraction circuit 33, which includes a shift register 331 and a logic circuit 3.
Consists of 32. The shift register 331 has the same structure as the shift register 312, and responds to the clock 6e (g
No. 48'jklli primary shift. As a result, signal 4
When the value of S corresponds to picture element (i, j), the final stage output 331C and the output 331b from one stage before the final stage are picture elements (i-1, j-1) and (i, j-), respectively. It can correspond to the standard patterns g(i-1, j-1) and g(i, j-1) for 1). FIG. 5(B) Fi is a specific configuration example of the logic circuit 332. D3(i,j-13"g(i,j-1) by one inverter and AND gate
- Realize g (i-1, j-1) (1-g (i+j)). This formula is based on the principle twilight Ds ('I
J) is changed to j-j-1, and the result is the same, but when g(+, j) is rarely input, Ds(j, J 1) - raster minutes earlier is determined. That will happen. Therefore, Fs (1* J )eGs ('l
A delay circuit 313 was required to synchronize with J).

With the above circuit, the distance determination circuit 3 can be realized according to FIG. 9.

Note that in order for the distance judgment circuit 3 to synchronize with the other distance judgment circuits 1゜2.4 and output judgment results for the same picture element (i, j), the output of the comparison circuit 36 is delayed appropriately. Although a shift register for output may be used, this shift register is not shown for simplicity.

Note that the distance determination circuits 1, 2.4 in FIG.
t, Ft, and Fa, and the specific circuit configuration is basically the same as that in FIG. 9, and is simply the case of cutout and distance determination circuit 1 of the shift register circuit in FIGS. 10 and 11. , Fl ('13-1), F, (in
1t j −1)e g(i, j)l g(in1.
j), g(i, in1) In the case of distance determination circuit 2, Fz('
L J ) + Ft(i L J IL g (
'+j), g(i, j-1), g(in1.j) For distance determination circuit 4, F4(' +113 11+ F4(1
+l+ J)g(it jL g(i, j-IL
It is good to make it substantially like g(i-11j).

12(A) to (H) are examples in which the defect in FIG. 4 has a direction change of 45 degrees, whereas the defect shown in FIG. 12 has a direction change of 90 degrees in two directions. In the case of such a defect, the value propagation during distance conversion cannot be changed from a 45-degree direction as shown in FIG. 5, so the value may not be propagated all the way. Therefore, for such defects, the following pre-processing is performed on the pattern to be inspected f(i.

j) and converts it into patterns as shown in FIG. 12 (A') to (H').

f'(i,j)=f(i,jl+(1-f(i,j))
・”(' II j)・”('IJ 1) where f
' (in j) is the pattern after conversion.

In this process, as shown in FIG. 12, the shape of the defect is modified so that the value of the shortest distance propagates to the boundary with only a 45 degree direction change without changing the shortest distance of the pattern. A specific example of a circuit configuration for this preprocessing is shown in FIG. In the figure, the 9osFi test pattern f (i, j), 938 is the converted pattern f (i, N. 91 is a delay circuit for the signal 938, which is made up of a shift register. The signal 938 is A one-stage latch 94 for outputting as the delayed signal 91b, and a shift register section 9 with stages equal to the number of effective picture elements in one raster plus 1 for delaying the signal 938 by -raster and outputting as the signal 91c.
Consists of 5. Therefore,゛・°”sail”′“−”・eyes・
″(”・[j-1), and the output 91a of the inverter 96 is 1-f(i, j), so it is applied to the AND gate 92 and becomes (1-f (i, j))・f'
(i-], j)・f'(it j-13 is determined, and the final output f'(is j) is determined by the OR gate 93. With the circuit explained above, the defect as shown in FIG. 12 can be solved. The principle of the method can be transformed into an applicable form.

In the fc embodiment described above, only the case where the wiring pattern itself becomes thin due to a defect has been mentioned, but when the wiring pattern becomes thick, it is sufficient to check the spacing between the wiring patterns. That is, the pattern to be inspected f (i
, j )'kl-f (i, j), and the standard pattern g(i, j)tl-g(i, j), it is possible to inspect between wiring patterns.

As explained above, the present invention prepares in advance a standard pattern corresponding to the pattern to be inspected, synchronizes this with the pattern to be inspected, and measures the entire distance at each position 1 from each boundary. Since the width at each position is compared, the fatality of the defect can be determined based on changes in the width of the standard pattern at each position. This is an effective method.

[Brief explanation of drawings]

Fig. 1 shows the overall configuration of an inspection device that can employ the pattern inspection method of the present invention, and Fig. 2 shows a basic combination of wiring patterns and defect directions when the defect direction is single. Figure 3 is a diagram for fully explaining the distance conversion when there is a vertical defect in a horizontal wiring pattern, and Figure 4 is a diagram showing the lock line pattern and defect when the direction of the defect changes by 45 degrees. A diagram showing the basic combinations of directions, FIG.
A diagram for explaining the distance conversion process 1c that changes the propagation of the value, FIG. 6 is a diagram showing the route in which the actual distance conversion value propagates, and FIG. 8 is a diagram showing a pattern of the processing process in the distance judgment circuit 3 of the judgment circuit 3, and FIG. 9 is a diagram showing the specific structure of the distance judgment circuit 3. Figure 1 showing
0 (A) is a diagram showing a specific configuration of the distance conversion circuit 31 in FIG. 9, (B) is a diagram showing a specific configuration of the logic circuit 311 in (A), and FIG. 11 (A) is Figure 7 of Figure 9-207- Figure 3/-(j・J)
1) (4,7) vi 4 Figure 5 (Good) Cb)
<, C) (cl ji/ \
l - 箭 子 fig θ T 7 fig. 8 fig. Figure 11 (A and CB) γ 1? Figure'#l 13 Figure 2

Claims (1)

[Claims] 1. Store in advance a standard pattern corresponding to a defect-free pattern to be inspected, measure the distance from the pattern boundary at a certain position ff1l for any pattern to be inspected and the standard pattern, and compare these values. By doing so,
A pattern inspection method characterized by determining defects.