JPS58190034A - Removal of semiconductor flash and roller for removing the same - Google Patents
Removal of semiconductor flash and roller for removing the sameInfo
- Publication number
- JPS58190034A JPS58190034A JP7388482A JP7388482A JPS58190034A JP S58190034 A JPS58190034 A JP S58190034A JP 7388482 A JP7388482 A JP 7388482A JP 7388482 A JP7388482 A JP 7388482A JP S58190034 A JPS58190034 A JP S58190034A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- flash
- rollers
- roller
- semiconductor flash
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 239000006061 abrasive grain Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 11
- 238000005498 polishing Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 abstract description 12
- 229920005989 resin Polymers 0.000 abstract description 12
- 239000013013 elastic material Substances 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/02—Deburring or deflashing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3406—Components, e.g. resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、砥粒を混入した弾性ローラーによる半導体
フラッシュの除去方法と、この発明方法に使用する半導
体フラッシュ除去用のローラーに関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for removing semiconductor flash using an elastic roller mixed with abrasive grains, and a roller for removing semiconductor flash used in the method of the present invention.
ところで、樹脂モールディング加工後の半導体樹脂封入
成形品は、第１図に示すように、リードフレームＡにお
けるタイバーＢ等の不要個所を切断して所要複数本のリ
ードＣを残すと共に、該す行ｆ、ｆうようにしている。By the way, as shown in FIG. 1, the semiconductor resin-filled molded product after the resin molding process is made by cutting off unnecessary parts such as tie bars B on the lead frame A to leave the required plurality of leads C, and also cutting off unnecessary parts such as the tie bars B in the lead frame A, and cutting off unnecessary parts such as the tie bars B in the lead frame A, and also cutting off unnecessary parts such as the tie bars B in the lead frame A. , f.
ととろが、樹脂モールデインク加工時（こおいて、樹脂
の高流動性或は型締め不１８等に起因して、キャビティ
部内に加圧注入された溶融樹脂の一部がパーティングラ
イン面から流出し、この流出樹脂がリードフレームＡの
表面に薄１１位状に同化固着してフラッシュ（パリ）］
）を形成することがある。従って、上記リードＣの表面
にフラッシュＤか固着していると、該リード表面の半田
メッキ処理が不完全若しくは不能となって製品の品質低
下を招来するといった弊害があるため、従来は、フラッ
シュＤが固着したリードフレームＡの表面を金属ブラシ
を回転させる方法番こより、上記フラッシュ１）の除去
＋ Ｉｇｌるようにしていた。然して、このような従来
の７ラノシユ除去方法においては、リードフレームの表
面］−を回転する金属ブラシが回転力によって屈曲変形
するのみで、フラッシュの有効な除去作用が得られない
といった重大な欠点を有しており、従って、該従来方法
によるときは、フラッシュの除去工稈に隨時間を要する
と川に、これ（こ１ｆ用する金１．慎フラジは比較的大
径に形成されているため、半導体樹脂封入成形品が小型
製品であることとも相俟って、フラッシュ除去作業を簡
易に行ない知い弊害かあった。During resin mold ink processing (in this case, due to high fluidity of the resin or poor mold clamping, a portion of the molten resin injected under pressure into the cavity may leak away from the parting line surface). This spilled resin assimilates and adheres to the surface of lead frame A in a thin 11-position shape and flashes (Paris)]
) may form. Therefore, if the flash D is stuck to the surface of the lead C, the solder plating process on the lead surface becomes incomplete or impossible, resulting in a deterioration in product quality. By rotating the metal brush on the surface of the lead frame A to which the lead frame A was stuck, the above-mentioned flash 1) was removed + Igl. However, in such a conventional flash removal method, the metal brush rotating on the surface of the lead frame is only bent and deformed by the rotational force, and has a serious drawback that an effective flash removal action cannot be obtained. Therefore, when using the conventional method, it takes a long time to remove the flash, and this (the gold used for this 1f) is formed with a relatively large diameter. Coupled with the fact that the semiconductor resin encapsulated molded product is a small product, the flash removal work is easy and has some disadvantages.
この発明は、砥粒を′ｉ［を人しｆこ弾性ローラーを用
いて、リードフレームの表面に固着したフラッシュを研
削除去することを特徴とする半導体フラッシュの除去方
法と、所要形状の弾性体に、所要階の砥粒子ｉｌｌ在住
体化せたことを特徴とする半導体フラッシュ除去用のロ
ーラーに係るものであり、半導体フラッシュの除去を効
串良く行なうことにより全体的な作業能率の回」−を図
ると共に、半導体フラッシュの除去”ＪｆｆＲを小型化
することによって、該除去作業の簡易省力化を図ること
を目的とするものである。The present invention provides a method for removing semiconductor flash, which is characterized in that the flash adhered to the surface of a lead frame is removed by applying abrasive grains to the surface of the lead frame using an elastic roller, and an elastic body having a desired shape. The invention relates to a roller for removing semiconductor flash, which is characterized by having abrasive particles resident on the required floor, and improves overall work efficiency by removing semiconductor flash more effectively. The purpose of this invention is to simplify and save labor by reducing the size of the semiconductor flash removal "JffR".
以■、本発明の詳細を実施例図に基ついて説明する。Hereinafter, details of the present invention will be explained based on embodiment figures.
図において、■はリードフレームＡｌｌに半導体素子を
樹脂封入成形した樹脂成形品、２は一１１記リードフレ
ームＡの一ヒ下両面に配設された該リードフレームの固
定具であり、該固定具（こはＩ−記樹脂成形品１の−１
−面及び−Ｆ面の両面に対して嵌脱自在に形成された固
定部２ａ・２ｂ が設けられている。In the figure, ■ is a resin molded product in which a semiconductor element is resin-encapsulated in a lead frame All, and 2 is a fixture for the lead frame, which is disposed on both sides of the bottom of the 111th lead frame A. (This is I-Resin molded product 1-1
Fixing portions 2a and 2b are provided which are removably fitted to both the - plane and -F plane.
３は−に記す−ドフレームＡの表面に固着した半導体フ
ラッシュＤの除去装置であり、該装置には適宜動力によ
って回転される同転軸３ａと、該回転軸の軸端部に固着
された半導体フラッシュ除去用のローラー ３ｂとが設
けられている。然して、」−記ローラー３ｂは、例えは
、ゴム等の弾性素材から形成された弾性体に、所要量の
砥粒が混在一体化されている。また、該ローラーの形状
は、図には円柱形状に形成されている場合を示したが、
ローラー３ｂにおける研削作用面４に、例えば、該ロー
ラーの回転輔心線方回と平行するスプライン或はセレー
ション等の溝から成るＪｉｌ当な凹凸形状を形成しても
よい。また、上記除去装置３は、その＋ｔａ＋転軸３ａ
の両軸端部にローラー３１）が夫々固着されて、この両
ローラー３ｂ・３ｂ か隣り合う樹脂成形品ｌ・１間に
突設された状態にある複数本のり−ドＣの表面を摺動す
るように構成されている場合を図示したが、上記ローラ
ー３ｂは回転軸３ａ 上に一個のみ固着させたもので
あってもよい。3 is a device for removing the semiconductor flash D adhered to the surface of the frame A shown in -, and this device includes a co-rotating shaft 3a which is rotated by appropriate power, and a rotary shaft 3a fixed to the shaft end of the rotary shaft. A roller 3b for removing semiconductor flash is provided. The roller 3b is, for example, made of an elastic body made of an elastic material such as rubber, in which a required amount of abrasive grains are mixed and integrated. In addition, although the shape of the roller is shown in the figure as being formed into a cylindrical shape,
The grinding surface 4 of the roller 3b may be formed with an irregular shape consisting of grooves such as splines or serrations parallel to the rotation axis of the roller. Further, the removing device 3 has +ta+rotating axis 3a.
Rollers 31) are fixed to both shaft ends of the rollers 3b and 3b, respectively, and these rollers 3b slide on the surface of a plurality of slides C protruding between adjacent resin molded products l and 1. Although a case in which the roller 3b is configured to do so is shown in the figure, only one roller 3b may be fixed on the rotating shaft 3a.
また、上記除去装置３におけるローラー３ｂは、固定し
たリードフレームＡ （７） 、１：下向表面を同時に
研削することが可能となるように複数個配設してもよい
。即ち、第２図に鎖線にて示すように、適宜動力によっ
て回転可能に設けられｆこローラー３ｂ’を、リードフ
レームＡの」１下両表面のフラッシュＤの固着位置に夫
々摺接させた状態で、そのローラ−３ｂ’ｉ同時に回転
させながら該表面上を摺動させるように構成してもよい
。Further, a plurality of rollers 3b in the removing device 3 may be provided so that the downward surface of the fixed lead frame A (7) , 1 can be simultaneously ground. That is, as shown by the chain lines in FIG. 2, the rollers 3b', which are rotatably provided by appropriate power, are in sliding contact with the fixing positions of the flashes D on both lower surfaces of the lead frame A. The roller 3b'i may also be configured to slide on the surface while rotating at the same time.
次に、上記ローラー３１）・３ｂ’による半尊体フラノ
シュＤの除去作用を説明する。Next, the action of removing the hemispherical flanouche D by the rollers 31) and 3b' will be explained.
１−、イ１−１．ローラー３［）・３１）′は砥粒をｔ
ｗ人した弾性体により形成さイ１ているため、リードフ
レームＡの表面に対するローラー３ｂ・３ｂ’の摺接状
態は弾性接触となること、ローラー３ｂ・３ｂ’には砥
粒が混在一体化されて、該砥粒がローラー回転時にフラ
ツシユＤを研削することから、このようなローラー ３
ｂ・３ｂ’をリードフレームの７ラソシユＤ附着面十を
同転させながら摺動させることにより、或は、リードフ
レームＡの表面を、回転させたローラー３ｂ・３ｂ’の
研削作用面上を摺動させることにより、Ｌ記フラッシュ
ＤをリードフレームＡの表向から効率良く研削除去し得
るものである。なお、−に記砥粒は、前記したリードＣ
の表面をも研削するように作用するが、該砥粒はリード
Ｃの表面に弾性接触することになるため、該リードの表
面を必要以上に研削して該表面を損傷するといった弊害
を未然に防止できるのである。史に、−ト記り一ドＣの
表面に砥粒による僅かな傷あとが残ったと仮定しても、
その部分を含むリードＣの全表面には半田メッキ処理か
施されるため、製品の耐久性を低下させる等の不都合は
何等生じないものである。1-, a1-1. The rollers 3[) and 31)' move the abrasive grains
Since the rollers 3b and 3b' are formed of a thin elastic body, the sliding contact state of the rollers 3b and 3b' with the surface of the lead frame A is elastic contact, and the rollers 3b and 3b' are integrated with abrasive grains. Since the abrasive grains grind the flash D when the roller rotates, such a roller 3
b and 3b' while simultaneously rotating the attachment surface 7 of the lead frame D, or by sliding the surface of the lead frame A on the grinding surface of the rotated rollers 3b and 3b'. By moving the lead frame A, the L flash D can be efficiently polished off from the front surface of the lead frame A. The abrasive grains marked with - are the lead C mentioned above.
However, since the abrasive grains come into elastic contact with the surface of the lead C, the problem of damaging the surface by grinding the lead surface more than necessary is avoided. It can be prevented. Historically, even if we assume that there are slight scratches left on the surface of the C from the abrasive grains,
Since the entire surface of the lead C including that portion is subjected to solder plating, no problems such as deterioration of the durability of the product occur.
また、ト記ローラー ３１〕・３ｂ’の研削作用面に凹
凸形状を形成した場合は、リードフレームＡの表面側と
該ローラーとの摩擦抵抗を減少化し得る利屯か有る。Furthermore, if an uneven shape is formed on the grinding surface of the rollers 31] and 3b', there is an advantage that the frictional resistance between the surface side of the lead frame A and the rollers can be reduced.
以」二のように、本発明方法によるときは、前述したよ
うな従来方法と較べて、短時間によるフラッシュ除去作
業が可能と１ｊす、従って、全体的な作業能率の回」二
を図ることかできると共に、本発明方法に使用するロー
ラーは従来のフランと較べて小径状に形成し得るため、
該ローラーの回転機構その他の形状を小型化することに
よって、フラッシュ除去作業の簡易省力化を図ることが
できる等の浸れた効果を券するものである。As described below, when using the method of the present invention, it is possible to perform flash removal work in a shorter time than with the conventional method as described above, and therefore, the overall work efficiency can be improved. In addition, the rollers used in the method of the present invention can be formed to have a smaller diameter than conventional flans.
By reducing the size of the rotating mechanism and other parts of the roller, the flash removal work can be simplified and labor-saving.
図は本発明の実施例を示すもので、第１図は半・算体素
子を樹脂封入成形したリードフレームの一部を示す平面
図、第２図は半導体フラッシュの除去作用説明図、第３
図は本発明方法に使用する半導体フラッシュ除去用ロー
ラーの一例を示す斜視図である。
Ａ・・リードフレーム、Ｄ−フラッシュ、３ｂ・３ｂ’
ローラー、４ 研削作用面。
第１図
第２図
３−、、、
第５図The drawings show an embodiment of the present invention, in which Fig. 1 is a plan view showing a part of a lead frame in which a semi-arithmetic element is sealed and molded in resin, Fig. 2 is an explanatory diagram of the removal operation of semiconductor flash, and Fig. 3
The figure is a perspective view showing an example of a roller for removing semiconductor flash used in the method of the present invention. A...Lead frame, D-Flash, 3b/3b'
Roller, 4 Grinding surface. Figure 1 Figure 2 Figure 3-... Figure 5
Claims (5)
レームの表面に耐着したフラッシュを研削除去すること
を特徴と下る半導体フラッシュの除去方法。(1) A method for removing descending semiconductor flash, which is characterized by using an elastic roller loaded with abrasive grains to remove flash adhered to the surface of a lead frame.
ードフレームの表面上を摺動させて、該ツー１’フＬ／
−ムの表面に耐着したフラッシュを研削除去することを
特徴とする特許請求の範囲第（１）項記載の半導体フラ
ッシュの除去方法。(2) A rational roller mixed with abrasive grains is rotated and slid on the surface of the lead frame, and the tool 1'f L/
- A method for removing semiconductor flash according to claim (1), characterized in that the flash adhering to the surface of the semiconductor flash is removed by polishing.
、リードフレームの表面を上記弾性ローラーの研削作用
面上を摺動させて、該リードフレームの表面に耐着した
フラッシュを研削除去することを特徴とする特許請求の
範＋７１’１Ｎｆ１１項記載。 の半導体フラッシュの除去方法。(3) While rotating an elastic roller mixed with abrasive grains, the surface of the lead frame is slid on the grinding surface of the elastic roller to remove flash adhering to the surface of the lead frame. Characteristic claim +71'1Nf11. How to remove semiconductor flash.
化させたことを特徴とする半導体フラッシュ除去用のロ
ーラー。(4) A roller for semiconductor flash removal characterized by integrating an elastic body ζ of a desired shape and a desired amount of abrasive grains.
徴とする特許請求の範１７１’ｌ第（２）項記載の半導
体フラッシュ除去用のローラー。(5) A roller for removing semiconductor flash according to claim 171'l (2), characterized in that the grinding surface is formed into a suitable uneven shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7388482A JPS58190034A (en) | 1982-04-30 | 1982-04-30 | Removal of semiconductor flash and roller for removing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7388482A JPS58190034A (en) | 1982-04-30 | 1982-04-30 | Removal of semiconductor flash and roller for removing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58190034A true JPS58190034A (en) | 1983-11-05 |
Family
ID=13531077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7388482A Pending JPS58190034A (en) | 1982-04-30 | 1982-04-30 | Removal of semiconductor flash and roller for removing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58190034A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0866415A (en) * | 1994-08-26 | 1996-03-12 | Kazuki Tsutsumi | Suction device for dental therapy |
| US6629880B1 (en) * | 2000-12-14 | 2003-10-07 | National Semiconductor Corporation | Rotary mechanical buffing method for deflashing of molded integrated circuit packages |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56144567A (en) * | 1980-04-14 | 1981-11-10 | Toshiba Corp | Method and apparatus for removing resin burr from semiconductor device |
-
1982
- 1982-04-30 JP JP7388482A patent/JPS58190034A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56144567A (en) * | 1980-04-14 | 1981-11-10 | Toshiba Corp | Method and apparatus for removing resin burr from semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0866415A (en) * | 1994-08-26 | 1996-03-12 | Kazuki Tsutsumi | Suction device for dental therapy |
| US6629880B1 (en) * | 2000-12-14 | 2003-10-07 | National Semiconductor Corporation | Rotary mechanical buffing method for deflashing of molded integrated circuit packages |
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