JPS58189529U - ボンデイング装置 - Google Patents
ボンデイング装置Info
- Publication number
- JPS58189529U JPS58189529U JP1982087569U JP8756982U JPS58189529U JP S58189529 U JPS58189529 U JP S58189529U JP 1982087569 U JP1982087569 U JP 1982087569U JP 8756982 U JP8756982 U JP 8756982U JP S58189529 U JPS58189529 U JP S58189529U
- Authority
- JP
- Japan
- Prior art keywords
- bonding equipment
- bonding
- wedge
- recorded
- accommodating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図〜第３図は従来方式によるボンディングの説明図
、第４図は、本考案の一実施例を示す構成図である。 ４・・・ボンディングワイヤ、５・・・ウェッジ、６・
・・ウェッジに形成した溝。
、第４図は、本考案の一実施例を示す構成図である。 ４・・・ボンディングワイヤ、５・・・ウェッジ、６・
・・ウェッジに形成した溝。
Claims (1)
- ウェッジの一側面に、ボンディングワイヤを収容する逃
し溝を備えたことを特徴とするボンディング装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982087569U JPS58189529U (ja) | 1982-06-12 | 1982-06-12 | ボンデイング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982087569U JPS58189529U (ja) | 1982-06-12 | 1982-06-12 | ボンデイング装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58189529U true JPS58189529U (ja) | 1983-12-16 |
Family
ID=30096276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982087569U Pending JPS58189529U (ja) | 1982-06-12 | 1982-06-12 | ボンデイング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58189529U (ja) |
-
1982
- 1982-06-12 JP JP1982087569U patent/JPS58189529U/ja active Pending
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