JPS58187344A - Film for packing - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a packaging film, and more particularly to a film for packaging electronic components. After they are installed in electronic circuits, they are easily damaged by electrostatic charges, which poses a major problem.

Therefore, in the past, rounding was used to protect electronic components from static electricity.
Plastic films and metal foils mixed with conductive substances such as carbon and metal powder are used as packaging materials for electronic components.

However, since these are opaque, it is impossible to confirm the existence and damage of the electronic components inside, or the type of work.

On the other hand, there are plastic films mixed with antistatic agents, but these have considerably high electrical resistance per unit area and are completely inadequate for protecting electronic components. The present invention aims to eliminate the above-mentioned drawbacks, and allows the electronic components inside the package to be seen through, while at the same time protecting the electronic components from static electricity. The purpose of the present invention is to provide a film for packaging electronic components that is sufficient for packaging electronic components.

That is, in this invention, a thin metal film with a light transmittance of 25 tlb or more is provided on one side of a transparent plastic film, and a transparent protective layer is provided on the film with an extremely thin thickness of 2 μ or less, and the plastic film is used as the outside. 0 and below, which are electronic component packaging films for forming packaging with a transparent protective layer inside, will be explained with reference to the drawings.

FIG. 1 is a partially enlarged sectional view showing one embodiment of the electronic component packaging film of the present invention, and FIG. 2 is a partially enlarged sectional view showing an example of the electronic component packaging film of FIG. Transparent plastic film 1 includes polyethylene film, fluorine resin film, styrene film, polyethylene film, polyethylene film, body warmer/film, ionomer resin film, ethylene-vinyl acetate copolymer film, and other packaging materials. Any material that can be used as a transparent plastic film 1 can be used.It is desirable that the transparent plastic film 1 has a float of 4 to 150μ. Transparent plastic film, 1 is 4
If it is thinner than μ, it is extremely thin and extremely weak, and is useless as a packaging material. Transparent plastic film 1 is 15
If it is thicker than 0μ, the elasticity will be too strong and the repulsive force will be strong, making it extremely inconvenient to handle during and after packaging formation.The transparent plastic film 1 is not necessarily a single layer, but various plastic films. pasting or
It is also possible to form two or more layers by extruding a suitable resin onto a single glass film, laminating it, coating it, etc.

The metal thin film 2 can be formed on one side of the transparent plastic film 10 by a conventionally known thin film production method such as a vacuum evaporation method, a sputtering method, an ion blating method, or an electron beam evaporation method. , All
, Ni, Pe, In, Mu9, Mu1Cu%8n, Z
Metals such as n, Ti, Mi-Cr, etc., alloys, and any other metals that can be used to form a film can be used. The metal thin film 2 must have a light transmittance of 25 or more, an electrical resistance per unit area of 108Ω or less, and a film thickness. It is necessary to satisfy the conditions 20X to 2501.1. These conditions of light transmittance, electrical resistance, and film thickness are essential for achieving the purpose of the present invention.

That is, if the light transmittance is as low as 25 cm, it will be difficult to see through the electronic components inside the package. Also, the electrical resistance is 106
If it is higher than Ω, the conductivity is poor and it is insufficient to protect electronic components from static electricity. It also shows the relationship.

If the film thickness is outside the range of 20X to 25 oz, it will not be possible to meet the conditions of light transmittance of 25 or more and electrical resistance of 1♂Ω or less per unit area.0 If the film thickness is thinner than 201, it is common for some metals. In general, the electrical resistance tends to be higher than 1♂Ω, and the durability of electronic components becomes insufficient.・The film thickness is 2Ω.
If it is thicker than 501, the light transmittance will be lower than 25, making it difficult to see through the electronic components inside.

In this way, the light transmittance, electrical resistance per unit area, and film thickness of the metal thin film 2 are deeply related to each other, and the metal thin film 2 must be formed so as to satisfy all of these three conditions. The thickness of the thin metal film 2 is also of critical importance when forming a package with the transparent plastic film 1 as the outside. That is, when forming a package, when bonding the film of the present invention with the transparent protective layer 5 inside, the transparent protective layer 3 is a very thin book with a thickness of 2 μm or less, so the transparent protective layer 3 is substantially The transparent plastic films 1 are not bonded and integrated with each other through the metal thin film 2 and the transparent protection 1i3 to provide sufficient bonding strength, but if the thickness of the metal thin film 2 is 250X or less, If there is, this is extremely thin, so it does not particularly affect the bonding of the plastic film 1 with the plastic film 1 on the outside and the transparent protection 13 on the inside, and the bonding can be performed in the same way as when the metal thin film 2 is not present. It is. However, if the thickness of the metal thin film 2 exceeds 2501, it is no longer possible to sufficiently bond the film with the plastic film 1 on the outside. Cellulose resin, urethane resin, epoxy resin, polyester resin, wax, and other appropriate resins can be used.6 Transparent protective layer 3 is formed on metal thin film 2.
If the transparent protective layer 3, which needs to be formed with an extremely thin thickness of less than 2 μm, is extremely thin, less than 2 μm, the electrical resistance of the thin metal film 2 will not be significantly impaired, and the transparency will be maintained.
111]3 conducts electricity, and has almost no effect on the removal of static electricity.This is because if the layer 5 is extremely thin, less than 2μ, it is probably in a porous state. It is presumed that this is because there are countless holes in the protective layer 3.On the other hand, if the thickness of the protective layer 3 exceeds 2μ, the electrical resistance of the surface increases depending on the resin used, making it difficult to remove static electricity. It will be enough.

An antistatic agent can also be mixed into the transparent protective layer 3, and in this way, static electricity can be removed even more completely.

In this invention, a package is formed with a transparent plastic film 1 on the outside and a transparent protective layer 3 on the inside, and electronic components are packaged in the package.

The packaging may be formed by the method of joining the transparent plastic film used. 4 in the figure is the joining part. In addition, the joint part 4 may be formed continuously over the entire periphery of the package as shown in FIG. 2, or may be formed partially in the form of a dotted line.

Note that the packaging can also be formed using an appropriate adhesive, adhesive, or the like.

In this invention, the electrical resistance per unit area of 20 metal thin films is 1.
Since it has a conductivity of 0.8Ω or less, it can sufficiently protect electronic components from static electricity generated inside and outside the package.In particular, since the transparent protective layer 5 on the inside of the package is extremely thin at 2μ or less, it is possible to protect electronic components from static electricity generated inside and outside the package. In much the same way as when the thin film 2 is present on the surface, the effects of static electricity can be completely eliminated.

9. Despite the presence of the transparent protective layer 5, it not only provides the same static electricity removal and antistatic effect as when the metal thin film 2 is present on the surface, but also serves as a protective layer for the metal thin film 20. This invention improves the surface of the metal thin film 2 by improving its slipperiness and abrasion resistance, and prevents damage to the metal thin film 2 due to contact with electronic parts, especially when electronic parts are packaged. As the transparent plastic film 1, a film containing an antistatic agent may be used, or a layer containing an antistatic agent may be appropriately formed on one or both sides of the transparent plastic film 1. In this way, the antistatic effect becomes even more effective.The layer containing the antistatic agent can also be provided at other appropriate locations.

In this invention, when the package is formed, the metal thin film 2 becomes the inside of the transparent plastic film 1, so the weather resistance is extremely good. Possible Example 1 A heat-sealable polyester film (Melinex Taifuna 850, manufactured by Ko-C Kosha Co., Ltd.) with a polyester film having a thickness of 25μ and a di-modified polyester layer on one side was used as a carrier sheet, and the degree of vacuum was determined by vacuum evaporation method. 2X1(i""'T
Cr was deposited for about 20 seconds at a deposition distance of 25ts under the conditions of
A transparent protective layer of acrylic resin with a thickness of 0.6 μm is formed on the 0-order Cr vapor-deposited film formed on the modified polyester layer of the carrier sheet, and a transparent protective layer of 0.6 μm in thickness is formed on the modified polyester layer of the carrier sheet. Example 2 One side of a 25μ thick polyester film (Diafoil manufactured by Diafoil Co., Ltd.) was coated with a vacuum degree of I by vacuum evaporation.
N1 was deposited under the condition of
--formed. Next, a transparent protective layer with a thickness of 0.3 μm was formed using cellulose acetate on the N1 vapor-deposited film to obtain the electronic component packaging film of the present invention. Heat-sealable non-static polyethylene packaging formed from a film mixed with an antistatic agent that has been commercially available as (pink plastic bag manufactured by Tokyo Denki Kagaku Kogyo Co., Ltd.)
f11-Sanopur 1 is used as a package made by laminating a polyethylene film with a thickness of 30 μm and A4 foil, and this is used as Kenogle 2. 01 is the electronic component packaging of this invention obtained in Examples 1 and 2. using film for
Each package was formed by heat sealing or ultrasonic bonding using a 25 micron thick polynisdel film as the outside.

Each of the above packages contained a liquid crystal plate.

Next, a static electricity generator (Z
Ei'jOaTA'l') was irradiated with ■ and e ions to check for irregularities in letters and numbers within the liquid crystal panel. We also compared the transparency of the packaging. The results are shown in the table below.

×・・・Very disturbed.

As is clear from the results in the table, when the electronic component packaging film of the present invention is used, there is no disturbance in the characters and numbers on the liquid crystal display, and compared to conventional products, it is extremely effective in protecting against static electricity. It has a remarkable effect and has extremely good transparency.0 Although this invention is particularly useful for packaging electronic parts, it can also be used as a general antistatic film for packaging other than electronic parts. It is possible to use it as

[Brief explanation of the drawing]

FIG. 1 is a partially enlarged sectional view showing one embodiment of the electronic component packaging film of the present invention, and FIG. 2 is a partially enlarged sectional view showing an example of the electronic component packaging film of FIG. It is a partially cutaway perspective view. 1...Transparent plastic film 2...Metal thin film 6...Transparent protective layer 4...Joining part Patent applicant Reiko Co., Ltd. Drawing

Claims (1)

[Claims] 1) A thin metal film on one side of the transparent plastic film has a light transmittance of 25 or more and an electrical resistance per single area of 10.
It is provided under the conditions of 8Ω or less and a film thickness of 20A to 250μ.A transparent trowel layer is provided on the metal thin film with an extremely thin thickness of 2μ or less, and a plastic film is placed on the outside. A film for packaging electronic parts for packaging with a transparent protective trowel layer inside 02] A transparent plastic film is provided with a layer containing an antistatic agent on one or both sides of the patent claim. 3) Film for packaging electronic components according to claim 1, wherein the transparent protective layer contains an antistatic agent.