JPS58186946A - Wafer positioning device - Google Patents
Wafer positioning deviceInfo
- Publication number
- JPS58186946A JPS58186946A JP6982082A JP6982082A JPS58186946A JP S58186946 A JPS58186946 A JP S58186946A JP 6982082 A JP6982082 A JP 6982082A JP 6982082 A JP6982082 A JP 6982082A JP S58186946 A JPS58186946 A JP S58186946A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- roller
- guide
- driving roller
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Abstract
Description
【発明の詳細な説明】
この発明は、ＩＣなどを作るときに使うウエノ・の位置
決め装置についてのものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wafer positioning device used when manufacturing ICs and the like.
ウエノ゛は第１図のように外形が円状になっており、外
形の一部には位置決めの基準になるオリエンテーション
フラット２を設ける。As shown in FIG. 1, the wafer has a circular outer shape, and a part of the outer shape is provided with an orientation flat 2 that serves as a reference for positioning.
この工うなウエノ・の位置決め装置には種々のものが発
表さ【ているが、従来のものには構造が複雑になるなど
の問題がある。Various types of positioning devices have been announced, but the conventional ones have problems such as a complicated structure.
この発明は、駆動用ローラに対するガイド端面の位置設
定を主とした簡単な構造で正確な位置決めができる装置
を提供するものである。以下１図面にエリこの発明の詳
細な説明する。The present invention provides a device that can perform accurate positioning with a simple structure that mainly focuses on positioning the guide end surface with respect to the driving roller. The present invention will be explained in detail with reference to the following drawings.
まず、この発明による実施例の外観図を第２図に示す。First, an external view of an embodiment according to the present invention is shown in FIG.
図で、６は駆動用ローラ、４はガイド、５はガイド４の
端面、６と７は自由に回転するローラ、８はウェハ１゛
を載せる台、９はガイド、１０はガイド９の端面である
。In the figure, 6 is a driving roller, 4 is a guide, 5 is an end face of guide 4, 6 and 7 are rollers that rotate freely, 8 is a table on which wafer 1 is placed, 9 is a guide, and 10 is an end face of guide 9. be.
第２図仲ウェハ１を台８の上に載せ、ローラ６とローラ
７でウェハ１ｔ−駆動用ロー２６側ＫＨしつけながら、
駆動用ロー２３の回転でウェハ１を回転させている状態
を示したものである。FIG. 2: Place the intermediate wafer 1 on the stand 8, and while basting the wafer 1t-driving row 26 side KH with the rollers 6 and 7,
This figure shows a state in which the wafer 1 is being rotated by the rotation of the driving row 23.
次に、第２図の上面図を第６図に示す、ロー２６とロー
２７には友えずウェハ１を駆動用ロー２６＠に押しつけ
る力が加えらｎておシ、ウェハ１の回転につｎてローラ
６とローラ７は自由に回転する。Next, as shown in FIG. 6, the top view of FIG. The rollers 6 and 7 then rotate freely.
最初にウェハ１ｔ一台８に載せるときは、ローラ６とロ
ーシフを台８から遠ざける。ウェハ１會台８に載せると
、スプリングなど（図示を省略）でロー２６とローラ７
を駆動用−一部３＠に押しっけ、ウェハ１ｔ−駆動用ロ
ー２３に接触させる。When placing one ton of wafers on the stand 8 for the first time, the roller 6 and the low shift are moved away from the stand 8. When the wafer 1 is placed on the table 8, the row 26 and roller 7 are connected by a spring or the like (not shown).
is pushed into the driving part 3@, and the wafer 1t is brought into contact with the driving row 23.
なお、ウェハ１′ｔ−駆動用ロー２６に接触させるため
、２＠のロー２６・７を使用しているが、２１−以上の
ローラを使用しても工い。Although 2 @ rows 26 and 7 are used to bring the wafer 1't into contact with the driving row 26, it is also possible to use 21 or more rollers.
第３図では端面５と端面１０ｔ−同一縁上にあるように
配置する。そして、ウエノ・１に対し駆動用ローシロを
この−よりもわずか外輪にあるようにする。ウェハ１は
円形なので、駆動用ロー２３には接するが、ガイド４と
ガイド９には接触せずに回転する。In FIG. 3, the end face 5 and the end face 10t are arranged so as to be on the same edge. Then, for the Ueno-1, set the drive low end so that it is slightly closer to the outer ring than this -. Since the wafer 1 is circular, it contacts the drive row 23 but rotates without contacting the guides 4 and 9.
次に、第６図からウエノ・１がさらに回転したときの主
費部の部分拡大図を第４図と第５図に示す。Next, FIGS. 4 and 5 show partially enlarged views of the main part when Ueno-1 rotates further from FIG. 6.
第４図はウェハ１が回転し、オリエンテーションフラッ
ト２の部分が駆動用ローラ６に接している状態を示した
もので、この状態ではローラ６と【」−２７に押さｎて
いるので、ウェハ１はガイド９の端部に接触するように
なる。ウェハ１とガイド９が接触すると、摩擦力でウェ
ハ１の回転にブレーキがかかるが、駆動用−一２６の回
転力の方が強は扛ば、ウェハ１は回転音つづける。FIG. 4 shows a state in which the wafer 1 is rotating and the orientation flat 2 is in contact with the driving roller 6. In this state, the wafer 1 is pressed against the roller 6 and the drive roller 6. comes into contact with the end of the guide 9. When the wafer 1 and the guide 9 come into contact, the rotation of the wafer 1 is braked by frictional force, but if the rotational force of the drive unit 26 is stronger, the wafer 1 continues to make a rotating sound.
第５図はオリエンテーションフラット２の部分がガイド
４の端面５とガイド９の端面１０に接した状態を示した
もので、この状態では駆動用ローラ６とオリエンテーシ
ョンフラット２が離ｎるようＫ、端面５・１０と駆動用
ローラ６の位置を設定する。し友がって、第５図の状態
では駆動用ロー２６は空転し５ウエハ１はローラ６・７
と端面５・１０で固定さｎる。FIG. 5 shows a state in which the orientation flat 2 is in contact with the end surface 5 of the guide 4 and the end surface 10 of the guide 9. 5 and 10 and the positions of the driving roller 6 are set. Therefore, in the state shown in FIG.
and fixed with end faces 5 and 10.
なお、第２図〜第５図では端面５と端Ｉｆ１１０を配置
している。し友がって、端面５・１０がそ扛（’３オリ
エンテーシ四ンフラット２に接触すｎば、ウェハ１の回
転ｔ１１実にとめることができるが、ガイド４の端面５
またはガイド９の端面１０のどららか１つだけでも動作
させることができる。ガイドｔ−１つだけにする場合は
、ガイド４またはガイド９のどちらを使用してもよいが
、第２図〜第５図のように駆動用ロー２６を時計方向に
回転させているときはガイド４を使用し、駆動用ロー２
６を反時計方向に回転させるときはガイド９を使用する
方が第４図のような現象がなくなるので。In addition, in FIGS. 2 to 5, the end surface 5 and the end If110 are arranged. As a result, if the end faces 5 and 10 come into contact with the four orientation flats 2, the rotation t11 of the wafer 1 can be stopped, but the end face 5 of the guide 4
Alternatively, only one of the end faces 10 of the guide 9 can be operated. If only one guide t is used, either the guide 4 or the guide 9 may be used, but when the driving row 26 is rotated clockwise as shown in Figs. 2 to 5, Using guide 4, drive row 2
When rotating 6 counterclockwise, it is better to use guide 9 to avoid the phenomenon shown in Figure 4.
動作が確実になる。Operation becomes reliable.
以上のように、この発明によｒＲｆオリエンテーション
７２ット２が端面５・ＩＯＫ接触すると。As described above, according to the present invention, when the rRf orientation 72 contacts the end surface 5 and the IOK.
ウェハ１の回転がとまるので、ウエノ・１の位置を正確
にセットすることができる。Since the rotation of the wafer 1 is stopped, the position of the wafer 1 can be set accurately.
第１図はウェハの外観図、
第２図はこの発明による実施例の外観図、第６図は第２
図の上面図。
第４図と第５図は第６図からウエノ・１がさらに回転し
たときの主費部の部分拡大図。
１・・・・・・ウェハ、２・・・・・オリエンテーショ
ンフラット、６ 駆動用ローラ、４・・・・・・ガイ
ド、５・カイト４の端面、６・・・・・・ローラ、７・
・・・・ローラ。
８・ 台、９ ・−ガイド、１０・・・・ガイド９の端
面。
代理人 弁理士 小俣欽旬
第１１％５
第３図
第４図
０
第６図
０
手続補正書
昭和５７年 ５月ｚｙ日
昭和５７年特許願第６９８２０号
２、発明の名称
ウェハの位置決め装置
補正をする者
事件との関係 特許出願人
住 所 東京都大田区蒲田４丁目１９番７号名称 安
藤電気株式会社
代表者 大 城 俊 −
代理人 〒１４４
居 所 東京都大田区蒲田４丁目１９番７号補正の内
容 図面の第３図と第４図を差し換える。
添付書類の目録 図面 １通Fig. 1 is an external view of a wafer, Fig. 2 is an external view of an embodiment according to the present invention, and Fig. 6 is an external view of a wafer.
Top view of the figure. Figures 4 and 5 are partially enlarged views of the main part when Ueno-1 rotates further from Figure 6. 1... Wafer, 2... Orientation flat, 6 Drive roller, 4... Guide, 5. End face of kite 4, 6... Roller, 7.
····roller. 8. Base, 9 - Guide, 10... End face of guide 9. Agent Patent Attorney Kinjun Omata No. 11%5 Figure 3 Figure 4 Figure 6 Figure 6 0 Procedural amendment May zy, 1981 Patent Application No. 69820 2 Title of invention Wafer positioning device amendment Patent Applicant Address: 4-19-7 Kamata, Ota-ku, Tokyo Name: Ando Electric Co., Ltd. Representative: Shun Oshiro - Agent Address: 144 Address: 4-19-7 Kamata, Ota-ku, Tokyo Contents of the amendment: Figures 3 and 4 of the drawings will be replaced. List of attached documents: 1 drawing
Claims (1)
ーラ（６）・（７）とを備え、ローラ（６）とローラ（
力でウェハ（１）ｔ−駆動用ローラ（６）餞に押しつけ
るとともに駆動用ローラ（６）でウェハ（１）を回転さ
せ。 ウェハ（１）のオリエンテーションフラット（２）ｉ）
Ｅ 端面（５）に接するとウェノ・（１）と駆動用ロー
ラ（３）が−ｎてウェハ（１）の回転がとまるように駆
動用ローラ（６）と端面（５）の位置を設定すること１
特徴とするウェハの位置決め装置。 ２、 駆動用ローラ（６）と、 端面（５）をもつガイド（４）と、 端面（１０）をもつガイド責９）と、 自由回転するローラ（６）・（７′）とを備え、−一部
（６）とローラ（７）でウェハ（１）を駆動用ローラ（
５）Ｉｌｌに押しつけるとともに駆動用ローラ（６）で
ウェハ（１）を回転させ、 ウェハ（１）のオリエンテーションフラット（２）が端
面０）と端面（１０）に接するとウエノ・（１）と駆動
用ローラ問が離扛てウエノ（１）の回転がとまる工うに
駆動用ローラ（６）・端面（５）および端［！［１（１
０）の位置を設定することｔ−特Ｓとするウエノ・の位
置決め装置。[Claims] 1. A drive roller (6), an end face (5), a guide (4) with a t-t, and freely rotating rollers (6) and (7), the roller (6) and the roller (
The wafer (1) is pressed against the driving roller (6) by force, and the wafer (1) is rotated by the driving roller (6). Orientation flat of wafer (1) (2) i)
E Set the positions of the driving roller (6) and the end surface (5) so that when the wafer (1) comes into contact with the end surface (5), the wafer (1) and the driving roller (3) will stop rotating. Thing 1
Characteristic wafer positioning device. 2. Equipped with a driving roller (6), a guide (4) having an end face (5), a guide member 9) having an end face (10), and freely rotating rollers (6) and (7'), - Part (6) and roller (7) move the wafer (1) to the driving roller (
5) Press the wafer (1) against the Ill and rotate the wafer (1) with the driving roller (6), and when the orientation flat (2) of the wafer (1) touches the end surface 0) and the end surface (10), the wafer (1) and the wafer (1) are driven. The driving roller (6), the end face (5) and the end [! [1(1
0) Ueno positioning device for setting the position of t-special S.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6982082A JPS58186946A (en) | 1982-04-26 | 1982-04-26 | Wafer positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6982082A JPS58186946A (en) | 1982-04-26 | 1982-04-26 | Wafer positioning device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58186946A true JPS58186946A (en) | 1983-11-01 |
| JPS6211503B2 JPS6211503B2 (en) | 1987-03-12 |
Family
ID=13413773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6982082A Granted JPS58186946A (en) | 1982-04-26 | 1982-04-26 | Wafer positioning device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58186946A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60130217U (en) * | 1984-02-10 | 1985-08-31 | 株式会社精工舎 | Feeding device for indexed parts |
| JPS6238304A (en) * | 1985-08-14 | 1987-02-19 | Hitachi Denshi Syst Service Kk | Automatic positioning device for ic wafer |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3297134A (en) * | 1966-02-10 | 1967-01-10 | Ronald F Pastuszak | Orienting device for discs and the like articles |
| JPS50122879A (en) * | 1974-03-13 | 1975-09-26 | ||
| JPS5238905U (en) * | 1975-09-12 | 1977-03-18 | ||
| JPS5392667A (en) * | 1977-01-25 | 1978-08-14 | Tokyo Seimitsu Co Ltd | Device for positioning wafer |
-
1982
- 1982-04-26 JP JP6982082A patent/JPS58186946A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3297134A (en) * | 1966-02-10 | 1967-01-10 | Ronald F Pastuszak | Orienting device for discs and the like articles |
| JPS50122879A (en) * | 1974-03-13 | 1975-09-26 | ||
| JPS5238905U (en) * | 1975-09-12 | 1977-03-18 | ||
| JPS5392667A (en) * | 1977-01-25 | 1978-08-14 | Tokyo Seimitsu Co Ltd | Device for positioning wafer |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60130217U (en) * | 1984-02-10 | 1985-08-31 | 株式会社精工舎 | Feeding device for indexed parts |
| JPH0211369Y2 (en) * | 1984-02-10 | 1990-03-22 | ||
| JPS6238304A (en) * | 1985-08-14 | 1987-02-19 | Hitachi Denshi Syst Service Kk | Automatic positioning device for ic wafer |
| JPH0613962B2 (en) * | 1985-08-14 | 1994-02-23 | 日立電子株式会社 | IC wafer automatic positioning device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6211503B2 (en) | 1987-03-12 |
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