JPS5818419B2 - glass yohanda - Google Patents
glass yohandaInfo
- Publication number
- JPS5818419B2 JPS5818419B2 JP741875A JP187574A JPS5818419B2 JP S5818419 B2 JPS5818419 B2 JP S5818419B2 JP 741875 A JP741875 A JP 741875A JP 187574 A JP187574 A JP 187574A JP S5818419 B2 JPS5818419 B2 JP S5818419B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- solder
- brazing
- present
- bismuth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Joining Of Glass To Other Materials (AREA)
Description
【発明の詳細な説明】
本発明はガラス鑞付用ハンダの組成に関するものである
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the composition of solder for brazing glass.
従来ガラス、セラミックス等に鑞付する場合、これらに
溶着しやすい金属インジウムのような金属薄層を、メタ
リコンあるいは真空蒸着等により予め被着せしめた後、
一般金属と同様の方法で鑞付を行なっており、このため
工程が複雑化しコストが高くなる欠点があった。Conventionally, when brazing glass, ceramics, etc., a thin layer of metal such as metal indium, which is easily welded to these materials, is pre-deposited using metallicon or vacuum evaporation, and then
Brazing is done in the same way as general metals, which has the disadvantage of complicating the process and increasing costs.
本発明は、前記メタリコンあるいは真空蒸着等の前処理
工程を必要とせず直接ガラス面に鑞付を行なうことので
きる融点の低いガラス鑞付用ハンダを提供しようとする
ものであって、鉛を主体とし、これにビスマスおよび亜
鉛の一定量を加えたことを要旨とするものである。The present invention aims to provide a solder for glass brazing with a low melting point that can directly braze a glass surface without the need for pretreatment steps such as metallicon or vacuum evaporation. The gist is that certain amounts of bismuth and zinc are added to this.
只りち本発明の合金組成は鉛を主体とし、これにビスマ
ス７９〜５０％および亜鉛３８〜２０％を添加せしめた
こさを特徴とする鉛−亜鉛−ビスマス合金である。Tadarichi The alloy composition of the present invention is a lead-zinc-bismuth alloy characterized by its hardness, which is mainly composed of lead, with the addition of 79-50% bismuth and 38-20% zinc.
さらに本願のもう一つの発明は、前記鉛−亜鉛−ヒスマ
ス合金に０．７％以下のアンチモンヲ実質的に含有させ
たことを特徴とする鉛−亜鉛−ビス［マス−アンチモン
合金である。Furthermore, another invention of the present application is a lead-zinc-bis[mass-antimony alloy] characterized in that the lead-zinc-hismuth alloy substantially contains 0.7% or less of antimony.
次に本発明について詳細に説明する。Next, the present invention will be explained in detail.
鉛はハンダのベースとなるものであり、ハンダの加工性
、柔軟性、融点、および接着性に影響を及ぼす。Lead is the base of solder and affects the solder's processability, flexibility, melting point, and adhesion.
すなわち鉛−亜鉛−ビスマス合金においてＰｂの含有量
が多い程、ハンダの柔軟性が増加し線引加工および使用
時の取扱いが容易となるが、反面融点が高くなるため高
温加熱が必要となり、硝子に被着した場合に熱応力によ
る破損を生じやすく□なる。In other words, the higher the Pb content in the lead-zinc-bismuth alloy, the more flexible the solder becomes and the easier it is to handle during wire drawing and use. If it adheres to the surface, damage due to thermal stress is likely to occur.
またＰｂの含有量が非常に少なくなると接着能力が低化
する傾向が見られ、極端な例としてはＰｂ０％のＢ１−
Ｚｎ系のハンダをカラス面上に被着しても容易にガラス
面上から剥離してしまう。Furthermore, when the Pb content becomes extremely low, the adhesive ability tends to decrease, and as an extreme example, B1-
Even if Zn-based solder is applied on a glass surface, it easily peels off from the glass surface.
次に、ＺｎはＰｂに添加することにより、ガラスあるい
はセラミクス等への接着性を生せしめる効果を持つが、
含有量があまり多いと延性が低下し線引加工が難しくな
り、また同時に熱膨張率が増大するため、ガラスに接着
固化させた後にガラス側に残留する応力は大きなものと
なりガラスは破損し易くなる。Next, when added to Pb, Zn has the effect of creating adhesion to glass or ceramics, etc.
If the content is too high, the ductility decreases, making wire drawing difficult, and at the same time, the coefficient of thermal expansion increases, so the stress remaining on the glass side after adhering and solidifying to the glass becomes large, making the glass more likely to break. .
ガラス同士あるいはガラスと金属とを鑞付する場合、ガ
ラスの耐熱衝撃性及び鑞付冷却後ガラス゛に残留する熱
応力を考慮すると鑞付温度は低いことが望ましいが本発
明者は、ハンダのガラスあるいはセラミックス等への接
着性を損わず且つ融点を下げるのに効果をもつ成分とし
てビスマスが有効であることを見い出した。When brazing glass to glass or glass to metal, it is desirable that the brazing temperature be low, considering the thermal shock resistance of the glass and the thermal stress remaining in the glass after cooling during brazing. It has been discovered that bismuth is effective as a component that does not impair adhesiveness to ceramics and has the effect of lowering the melting point.
一般に使用されている金属鑞付用ハンダの代表的なもの
として鉛−錫合金があるが、得られる最も低融点のもの
でも１８３℃であるのに対し、鉛−ビスマス合金では融
点が１２５℃のものも得られ、ビスマス添加による融点
降下の効果がわかる。Lead-tin alloy is a typical solder for metal brazing that is commonly used, but the lowest melting point available is 183°C, while lead-bismuth alloy has a melting point of 125°C. The effect of the addition of bismuth on lowering the melting point can be seen.
しかしながら、あまりビスマスの含有量が多いとハンダ
としての接着性は低下し含有量が５０％以上でろガラス
あるいはセラミックスへの接着性の低下は特に著しくな
る。However, if the content of bismuth is too high, the adhesion as a solder will decrease, and if the content exceeds 50%, the decrease in the adhesion to filter glass or ceramics will be particularly significant.
またハンダ自体も展延性に乏しく、脆くなる傾向を示す
。Furthermore, the solder itself has poor spreadability and tends to become brittle.
以上に述べた理由により、本発明においては前述のごと
き各成分の組成範囲を行なうものである。For the reasons stated above, in the present invention, the composition ranges of each component are determined as described above.
本発明の組成範囲内であれはガラスあるいはセラミクス
への直接鑞付が可能であるが、さらに詳しく述べると本
発明の組成範囲内で且つ亜鉛の含有量を１としてビスマ
スの含有量が３を越えない範囲が特に好ましい。Direct brazing to glass or ceramics is possible as long as it is within the composition range of the present invention, but more specifically, it is possible to braze directly to glass or ceramics as long as it is within the composition range of the present invention and the bismuth content exceeds 3 when the zinc content is 1. Particularly preferred is a range in which there is no.
本発明のハンダをガラスに鑞付するに際しては、周知の
ハンダゴテを使用すればよいが特にハンダゴテに超音波
等による振動を与えつつ行なう方法が有効である。When applying the solder of the present invention to glass, a well-known soldering iron may be used, but it is particularly effective to apply vibration to the soldering iron using ultrasonic waves or the like.
また本発明のＰｂ−Ｚｎ−Ｂ１の三元合金半田に０．７
％以下のｓｂを実質的に添加した四元合金半田は耐候性
が一段と向上する。In addition, the Pb-Zn-B1 ternary alloy solder of the present invention has a
The weather resistance of the quaternary alloy solder to which sb of 5% or less is substantially added is further improved.
ｓｂを０．７％を越えて添加すると半田の展延性を減じ
、才だｓｂ添加の耐候性向上は微量で効果を生じるので
具体的に下限を定めることはできないが、通常に不純物
として混入する程度を越えた量と解すれはよい。If more than 0.7% of sb is added, the spreadability of the solder will be reduced.Since the effect of adding sb on weather resistance is effective with a small amount, it is not possible to set a specific lower limit, but it is usually mixed in as an impurity. It can be understood that the amount exceeds the limit.
次に本発明の実施例を示す。Next, examples of the present invention will be shown.
実施例
各構成成分の比率を種々変化させた場合における接着性
及びハンダの融点を表にして示す。EXAMPLE The adhesion properties and melting points of solder are shown in a table when the ratio of each constituent component is varied.
なお表中における接着性は、通常のガラス板面に約５ｃ
／Ｉｌ角の鑞付面をつくり、この面を鋭利なナイフで削
った際にガラス板面との間に全く剥離を生じなかったも
のを「良好」とし、極く部分的に剥離を生じたものを「
やや悪い」とし、この中間程度のものを「やや良好」と
している。The adhesion in the table is about 5c on a normal glass plate surface.
/Il angle brazed surface was created, and when this surface was scraped with a sharp knife, no peeling occurred between it and the glass plate surface.It was considered "good", and peeling occurred only partially. Things"
``Somewhat poor,'' and those in the middle are rated ``Somewhat good.''
Claims (1)
３．８〜２０％を含む組成を有するガラス用ハンダ。 ２ ｐｂ３０〜８５３％、’１３’ｉ７．９〜５０％
。 Ｚｎ３．８〜２０％に０．７係以下のｓｂを実質的に含
有させた組成を有するガラス用ハンダ。[Claims] 1 pb30-85.3%, Bi7.9-50%, ZZn
A glass solder having a composition containing 3.8 to 20%. 2 pb30-853%, '13'i7.9-50%
. A solder for glass having a composition substantially containing 3.8 to 20% Zn and sb of 0.7 or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP741875A JPS5818419B2 (en) | 1973-12-22 | 1973-12-22 | glass yohanda |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP741875A JPS5818419B2 (en) | 1973-12-22 | 1973-12-22 | glass yohanda |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5093248A JPS5093248A (en) | 1975-07-25 |
| JPS5818419B2 true JPS5818419B2 (en) | 1983-04-13 |
Family
ID=11513716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP741875A Expired JPS5818419B2 (en) | 1973-12-22 | 1973-12-22 | glass yohanda |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5818419B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52149176A (en) * | 1976-06-07 | 1977-12-12 | Fujitsu Ltd | Attachment of temperature detector for electronic device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4885459A (en) * | 1972-02-19 | 1973-11-13 |
-
1973
- 1973-12-22 JP JP741875A patent/JPS5818419B2/en not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4885459A (en) * | 1972-02-19 | 1973-11-13 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5093248A (en) | 1975-07-25 |
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