JPS58178584A - Flexible printed circuit board - Google Patents
Flexible printed circuit boardInfo
- Publication number
- JPS58178584A JPS58178584A JP6036482A JP6036482A JPS58178584A JP S58178584 A JPS58178584 A JP S58178584A JP 6036482 A JP6036482 A JP 6036482A JP 6036482 A JP6036482 A JP 6036482A JP S58178584 A JPS58178584 A JP S58178584A
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- soldering
- board
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔発明の属する技術分野〕 この発明はフレキシブル印刷配線基板に関する。[Detailed description of the invention] [Technical field to which the invention pertains] The present invention relates to a flexible printed wiring board.
従来、フレキシブル印刷基板を基板等に半田接続しよう
とする場合、その加熱方法や半田付は部付近の耐折曲げ
性に問題があった）
第１図は従来方法の例を示すものである。第１図（ａ）
、 （ｂ） 、 （匂においてｌはポリイミド等のベ
ース基材、２は鋼箔よりなる導体、３は鋼箔２を保護す
るカバーフィルム、４は被半田付は基板、５はベース基
材に明けた窓である。＃ｉ１図（ａ）の場合の半田付け
は通常ベース基材１＠より加熱して行なうが、一般にベ
ース基材ｌは熱伝導が悪く基材と鋼箔の接着強度にダメ
ージを与えやすい。また。Conventionally, when attempting to solder connect a flexible printed circuit board to a board or the like, there have been problems with the heating method and soldering in terms of bending resistance near the parts.) Fig. 1 shows an example of a conventional method. Figure 1(a)
, (b) , (In the case, l is a base material such as polyimide, 2 is a conductor made of steel foil, 3 is a cover film that protects the steel foil 2, 4 is a board to be soldered, and 5 is a base material) This is an open window.#i1 Soldering in the case of Figure (a) is usually done by heating the base material 1@, but the base material 1 generally has poor heat conductivity and has a negative effect on the adhesive strength between the base material and the steel foil. Easy to cause damage. Also.
半田付は部の不良を発見しにくい等の欠点がある。Soldering has drawbacks such as difficulty in detecting defects in parts.
第１図（ｂ）の場合、ベース基材ｌより鋼箔パター７の
一部をリードとして出し、直接加熱できる様にしたもの
であるが、半田付は後の耐折曲げ性が一部に悪い〇
第１図（Ｃ）の場合、半田付けする部分のベース基材に
廖を設けて直接半田付は出来る様にしたものであるが、
ｆａを設けるため若干大きくなる。またいずれの場合に
おいても耐折曲げ性に問題例えば２の６の部分が新線し
やすい等の問題があり、その使用Ｋｗ４隣を、受けてい
た。In the case of Fig. 1(b), a part of the steel foil putter 7 is taken out as a lead from the base material l so that it can be heated directly, but the soldering process is difficult due to the later bending resistance. Bad〇In the case of Figure 1 (C), a groove is provided in the base material of the part to be soldered so that direct soldering can be performed, but
It becomes slightly larger due to the provision of fa. Moreover, in either case, there were problems with bending durability, for example, the 6th part of 2 was prone to new lines, and the Kw4 adjacent to it was used.
この発明は上述した従来構造の欠煮を改良したもので、
半田付けが容易で確実にでき、半田付は後の耐折−げ性
の良好な７レキシプル印刷配線基板を提供することを目
的とする。This invention is an improvement on the conventional structure described above.
The object of the present invention is to provide a 7-lexiple printed wiring board that can be easily and reliably soldered and has good resistance to folding after soldering.
この発明はフレキシブル印刷配線基板の半田付は面側に
ある鋼箔を１から効率よく加熱するためフレキシブル基
板の半田付は部分を適当な長さに折り返して銅箔面を両
面に形成し、銅箔を直接加熱できる様にしたものである
。なお、この時折り返した部分の中にガラス基材エポキ
シ樹脂基板等よりなるリジッドボードを入れて接着する
。In order to efficiently heat the steel foil on the surface side from scratch when soldering a flexible printed wiring board, the soldering process for a flexible printed wiring board is performed by folding back the part to an appropriate length to form a copper foil surface on both sides. This allows the foil to be heated directly. Incidentally, a rigid board made of a glass-based epoxy resin substrate or the like is inserted into the turned-over portion and bonded.
１、半田付けが容易にで−る。 1. Easy to solder.
２、半田付は時の熱効率が良いので周囲に熱的影響を与
えない。2. Soldering has good thermal efficiency, so it does not have a thermal effect on the surrounding area.
３、外砿から半田付は性の良否判定が簡単にできる０ ４、半田付は後の耐折り曲げ性が良好となる。3. You can easily determine the quality of soldering from the outer metal0 4. Good bending resistance after soldering.
５、フレキシブル基板上に取付は穴が形成で傘、押え金
具等不明である。5. A hole is formed on the flexible board for mounting, and the umbrella, holding metal fittings, etc. are unknown.
以下に本発明の詳細な説明する。 The present invention will be explained in detail below.
第２図に本発明の実施例を示す。１はポリイミド材等よ
りなるベース基材、２は鋼箔等の導体、３はＩＩＩＩＭ
の保護用カバーフィルム、４は被半田付は基板である。FIG. 2 shows an embodiment of the present invention. 1 is a base material made of polyimide material etc., 2 is a conductor such as steel foil, 3 is IIIM
4 is a protective cover film, and 4 is a board to be soldered.
１〜３よりなるフレキシブル基板の半田付は部分を適当
な長さで折り返して７のりジッドボードと相互接着する
。このことにより、銅箔が半田付は面において両面に形
成され、加熱面８からの加熱においても鋼箔２を介して
容易だ半田付は部を加熱で傘、曳好な半田付けかで舞る
。For soldering of the flexible board consisting of 1 to 3, the part is folded back to an appropriate length and bonded to the glue board 7. As a result, the copper foil is formed on both sides of the soldering surface, and even when heated from the heating surface 8, it is easy to solder through the steel foil 2. Ru.
着たこの時、半田はリジン、ドボードの厚さ分の半田フ
ィレット９が形成され、半田付けが確実に行なわれるほ
か、半田付は良否の判定も容易にできるっ
〔発明の他の実施例〕
第３図（→（ｂ）に本発明の他の実施例を示す。リジッ
ドボードに取付は穴７ａｔ−設けたもの（その部分を７
′さして示しである）で、半田付は時の位置決めのほか
、半田付は後の相手方との固定穴として使用で轡、従来
必要だった押え金具等不用である。At this time, the solder is filled with lysine, and a solder fillet 9 of the thickness of the board is formed, which not only ensures the soldering but also makes it easy to judge whether the soldering is good or bad. [Another Embodiment of the Invention] Fig. 3 (→(b) shows another embodiment of the present invention. For mounting on a rigid board, a hole 7at- is provided (that part is
In addition to positioning, soldering can also be used as a fixing hole for later mating parts, eliminating the need for holding fittings that were previously required.
＃Ｉ１図は従来のフレキシブル印刷配線基板を示す）：
面図と断面図、第２図は本発明の一実施例を説明するた
めの上面図と平面図、第３図は本発明の他の実施例を説
明するための構成図である。
１・・・ベース＆材、２・・・鋼Ｗｉ、 ３・・カバ
ーフィルム４・・被半田付は基板、 ５・・・窓穴。
６・・・断線の発生する部分、７・・・リジッドボード
、７ａ・・・リジッドボードに設けた穴、７′・・・穴
７ｍを有するリジッドボード、８・・・半田加熱面、
９・・・半田フィレット。#I1 diagram shows a conventional flexible printed wiring board):
FIG. 2 is a top view and plan view for explaining one embodiment of the present invention, and FIG. 3 is a configuration diagram for explaining another embodiment of the present invention. 1... Base & material, 2... Steel Wi, 3... Cover film 4... Board to be soldered, 5... Window hole. 6... Portion where disconnection occurs, 7... Rigid board, 7a... Hole provided in rigid board, 7'... Rigid board with hole 7m, 8... Solder heating surface,
9...Solder fillet.
Claims (1)
て、鋼１ｌｌｉ面が両面になる様フレキシブル印刷配線
基板の一部を適当な長さく折り返しかつその折り返し部
分の内側にリジッドボードを入れて相互接着することを
特徴とするフレキシブル印刷配線等板。Soldering a flexible printed wiring board involves folding a part of the flexible printed wiring board to an appropriate length so that the steel surfaces are on both sides, inserting a rigid board inside the folded part, and bonding each other. A flexible printed wiring board featuring the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6036482A JPS58178584A (en) | 1982-04-13 | 1982-04-13 | Flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6036482A JPS58178584A (en) | 1982-04-13 | 1982-04-13 | Flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58178584A true JPS58178584A (en) | 1983-10-19 |
Family
ID=13140006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6036482A Pending JPS58178584A (en) | 1982-04-13 | 1982-04-13 | Flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58178584A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04502238A (en) * | 1989-10-02 | 1992-04-16 | ヒューズ・エアクラフト・カンパニー | Three-dimensional microcircuit structure and its manufacturing method from ceramic tape |
-
1982
- 1982-04-13 JP JP6036482A patent/JPS58178584A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04502238A (en) * | 1989-10-02 | 1992-04-16 | ヒューズ・エアクラフト・カンパニー | Three-dimensional microcircuit structure and its manufacturing method from ceramic tape |
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