JPS58176968A - Solid state image pick-up apparatus - Google Patents
Solid state image pick-up apparatusInfo
- Publication number
- JPS58176968A JPS58176968A JP57058127A JP5812782A JPS58176968A JP S58176968 A JPS58176968 A JP S58176968A JP 57058127 A JP57058127 A JP 57058127A JP 5812782 A JP5812782 A JP 5812782A JP S58176968 A JPS58176968 A JP S58176968A
- Authority
- JP
- Japan
- Prior art keywords
- sealing portion
- glass cap
- glass
- solid state
- state image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007787 solid Substances 0.000 title abstract description 5
- 239000011521 glass Substances 0.000 claims abstract description 13
- 239000000919 ceramic Substances 0.000 claims abstract description 6
- 238000003384 imaging method Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 abstract description 11
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- 239000000565 sealant Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000035515 penetration Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は固体１儂装置の封止に係り、特にガラス中ヤツ
プとセラミックパッケージヲ有機シール剤で封止する際
の耐湿性向上（関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the sealing of solid one-person devices, and particularly to improving moisture resistance when sealing glass containers and ceramic packages with an organic sealant.
従来の有機シール剤で封止され九固体撮儂装置は、信頼
性の面で戻ってかり、特に高温高温試験で水分の透過が
確認され丸。Nine solid-state imaging devices sealed with conventional organic sealants have made a comeback in terms of reliability, especially in high-temperature tests where moisture penetration has been confirmed.
し九がって、本発明の目的は、有機シール剤で封止した
固体１儂装置の耐湿性を向上することにある。Therefore, it is an object of the present invention to improve the moisture resistance of a solid one-member device sealed with an organic sealant.
有機シール紺上品の耐湿性（劣る原因には次の３通勤参
考えられる。（１）シール剤自体からの水分の侵入、Ｑ
）ガラスキャップとシール剤の界面からの水分の侵入、
（３） セラミックパッケージとシール剤の界面から
の水分の侵入。Moisture resistance of the organic seal navy blue product (there are three possible causes of inferiority: (1) Penetration of moisture from the sealant itself, Q
) Moisture intrusion from the interface between the glass cap and sealant,
(3) Intrusion of moisture from the interface between the ceramic package and the sealant.
そして、高温高温試験において、ガラスとシール剤間で
剥離が生じ九。したがって、上記（２）をまず対端する
必要かある。そのためには、この界面を水分が通過する
経路を長くシ、接着力を惜〈すればよい。During the high-temperature test, peeling occurred between the glass and the sealant9. Therefore, it is necessary to solve (2) above first. To achieve this, the path for moisture to pass through this interface should be made longer and the adhesive strength should be reduced.
以下、８発明。−実権列を第、僑ｅ Ｊｌｌ ｋ図３よ
り説明する。第１図は固体１儂装置のチップを収容した
セラミックパッケージを有機シール剤で鉗止するガラス
キャップの背面図、第２図はその五−ム断面図である。Below are 8 inventions. - The real power sequence will be explained with reference to Figure 3. FIG. 1 is a rear view of a glass cap for fixing a ceramic package containing a chip of a solid state device with an organic sealant, and FIG. 2 is a 5-meter sectional view thereof.
ガラスキャップ１の封止部分２は予め何らかの方法で線
面にされている。この封止部分２は、セラ建ツクパッケ
ージト襞着される部分であるため、固体撮像素子に重要
な光を麿断することはない。The sealing portion 2 of the glass cap 1 is previously made into a linear surface by some method. Since this sealing portion 2 is a portion that is folded into the ceramic package, it does not cut off important light to the solid-state imaging device.
本実ＩＩＩＡ列によれば、封止部分２のガラス表面は凸
凹であるため、ガラスキャップ１とシール剤の界面から
侵入する水分の経路が長くなる。また、接着資積−大自
くなるためく接着力零強１１になｐ気密性が増すことか
ら、水分が透過しく〈〈なり、耐湿性の向上が計れる。According to this series IIIA, since the glass surface of the sealing portion 2 is uneven, the path of moisture entering from the interface between the glass cap 1 and the sealant becomes long. In addition, since the adhesive strength is 11%, which increases the adhesive capacity, and the p-tightness is increased, moisture permeates through it, and moisture resistance can be improved.
本発明（よれば、有機シール剤で耐１性を向上させ九固
体ｍ（Ｉ装置ができるので、現在のキャップよ）も単価
の安いキャップが使用できて原価量減が計れるとともに
、作業工数も低減できる。According to the present invention, by improving the resistance to 1 with an organic sealant, it is possible to use a cap with a lower unit price than the current cap because the I device can be made, reducing the cost and man-hours. Can be reduced.
第１図は、本発明の一実悔列Ｋかけるガラス中ヤツプの
背面図、＊２図は第１図のムー九纏剛面図であるう
１ｅ・・・ガラス中ヤツプ、２ ＩＩ・・・封止部分。
第１図
第２図Fig. 1 is a back view of the penitential train K of the present invention, and 2. Fig. 2 is a rigid surface view of the mu-9 in Fig. 1.・Sealing part. Figure 1 Figure 2
Claims (1)
スキャップを封止してなる固体１儂装置において、ガラ
スキャップの封止部分を線面にしたことを特徴とする固
体撮像装置。1. A solid-state imaging device comprising a glass cap sealed in a ceramic package containing a solid-state imaging chip, characterized in that the sealed portion of the glass cap is a linear surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57058127A JPS58176968A (en) | 1982-04-09 | 1982-04-09 | Solid state image pick-up apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57058127A JPS58176968A (en) | 1982-04-09 | 1982-04-09 | Solid state image pick-up apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58176968A true JPS58176968A (en) | 1983-10-17 |
Family
ID=13075310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57058127A Pending JPS58176968A (en) | 1982-04-09 | 1982-04-09 | Solid state image pick-up apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58176968A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3446188A1 (en) * | 1983-12-21 | 1985-07-04 | Mitsubishi Acetate Co., Ltd., Tokio/Tokyo | SPIDER NOZZLE FOR ACETATE FIBERS WITH Y-SHAPED SECTION |
| EP1596438A3 (en) * | 2004-05-10 | 2006-09-20 | Sharp Kabushiki Kaisha | Semiconductor device, manufacturing method of semiconductor device and module for optical device |
-
1982
- 1982-04-09 JP JP57058127A patent/JPS58176968A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3446188A1 (en) * | 1983-12-21 | 1985-07-04 | Mitsubishi Acetate Co., Ltd., Tokio/Tokyo | SPIDER NOZZLE FOR ACETATE FIBERS WITH Y-SHAPED SECTION |
| EP1596438A3 (en) * | 2004-05-10 | 2006-09-20 | Sharp Kabushiki Kaisha | Semiconductor device, manufacturing method of semiconductor device and module for optical device |
| US7456483B2 (en) | 2004-05-10 | 2008-11-25 | Sharp Kabushiki Kaisha | Semiconductor device, manufacturing method of semiconductor device and module for optical device |
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