JPS58173269U - Divide device for assembled printed circuit boards - Google Patents
Divide device for assembled printed circuit boardsInfo
- Publication number
- JPS58173269U JPS58173269U JP7000082U JP7000082U JPS58173269U JP S58173269 U JPS58173269 U JP S58173269U JP 7000082 U JP7000082 U JP 7000082U JP 7000082 U JP7000082 U JP 7000082U JP S58173269 U JPS58173269 U JP S58173269U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- perforations
- circuit boards
- circuit board
- assembled printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例の分割装置を示す斜視図で、第２図は同
装置による集合プリント基板の分割説明図、第３図は本
考案に係る分割器具による分割状態を示す一部切断の正
面図で、第４図は第３図のｎ−ｎ線拡大平面図を示す。
１・・・・・・集合プリント基板、２ａ、 ２ｂ、
２Ｃ・・・・・・ミシン目孔、４ ａ、 ４ ｂ、
４ Ｃ・・・−カッタ、５・・・・・・ホルダ、６
ａ、 ６ｂ・・・・・・平面部。Fig. 1 is a perspective view showing a conventional dividing device, Fig. 2 is an explanatory diagram of dividing an assembled printed circuit board by the same device, and Fig. 3 is a partially cut front view showing the dividing state by the dividing device according to the present invention. In the figures, FIG. 4 shows an enlarged plan view taken along line nn of FIG. 3. 1... Collective printed circuit board, 2a, 2b,
2C... Perforation, 4 a, 4 b,
4 C...-Cutter, 5...Holder, 6
a, 6b... Flat part.
Claims (1)
に沿って集合プリント基板を複数個のプリント基板に分
割する集合プリント基板の分割方法において、上記のミ
シン目孔に対応した複数個のカンタをホルダに固定し、
各カッタを基部に行くに従ってミシン目゛孔の径より大
径となるテーパ形状に形成すると共に、各カッタの対応
する側面にはミシン目′孔の縦列方向と平行な平面部を
形成した集合プリント基板の分割器具。In a method for dividing a printed circuit board assembly in which perforations are made in the printed circuit board assembly and the printed circuit board is divided into a plurality of printed circuit boards along the perforations, a plurality of canters corresponding to the perforations are formed. Fix it in the holder,
Each cutter is formed into a tapered shape whose diameter becomes larger than the diameter of the perforations as it goes toward the base, and a set of printed parts is formed on the corresponding side of each cutter to form a flat part parallel to the vertical direction of the perforations and holes. Board dividing device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7000082U JPS58173269U (en) | 1982-05-13 | 1982-05-13 | Divide device for assembled printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7000082U JPS58173269U (en) | 1982-05-13 | 1982-05-13 | Divide device for assembled printed circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58173269U true JPS58173269U (en) | 1983-11-19 |
Family
ID=30079697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7000082U Pending JPS58173269U (en) | 1982-05-13 | 1982-05-13 | Divide device for assembled printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58173269U (en) |
-
1982
- 1982-05-13 JP JP7000082U patent/JPS58173269U/en active Pending
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