JPS59143062U - assembly printed wiring board - Google Patents
assembly printed wiring boardInfo
- Publication number
- JPS59143062U JPS59143062U JP3604883U JP3604883U JPS59143062U JP S59143062 U JPS59143062 U JP S59143062U JP 3604883 U JP3604883 U JP 3604883U JP 3604883 U JP3604883 U JP 3604883U JP S59143062 U JPS59143062 U JP S59143062U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- assembly printed
- base material
- punched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案に係る集合プリント配線基板の平面図、
第２図は上記集合プリント配線基板の部分斜視図、第３
図乃至第５図は分割容易線のそれぞれ異なる他の具体例
を示す集合プリント配線基板の平面図である。
１・・・プリント配線基板母材、２・・・プリント配線
基板、３・・・打抜き孔、４・・・分割容易線、５・・
・小孔、６・・・スリット。
＋ １１−−１−１
１ １ｌ−ｉ−ｉ １
１−１ １
１１′Ｂ Ｉ Ｉ
Ｉ Ｉ １FIG. 1 is a plan view of a collective printed wiring board according to the present invention;
Figure 2 is a partial perspective view of the above-mentioned collective printed wiring board;
5 to 5 are plan views of a collective printed wiring board showing other specific examples of easy-to-divide lines, respectively. DESCRIPTION OF SYMBOLS 1...Printed wiring board base material, 2...Printed wiring board, 3...Punching hole, 4...Easy division line, 5...
・Small hole, 6...slit. + 11--1-1 1 1l-i-i 1 1-1 1 11'B I I I I 1
Claims (1)
抜き形成すると共に、プリント配線基板、母材の各打抜
き孔間に分割容易線を形成し、これら打抜き形成された
プリント配線基板を上記プリント配線基板母材の各打抜
き孔にそれぞれ圧入嵌合して成る集合プリント配線基板
。A plurality of printed wiring boards are punched and formed from a printed wiring board base material, easy dividing lines are formed between each punched hole in the printed wiring board and the base material, and these punched printed wiring boards are inserted into the printed wiring board base material. An assembled printed wiring board that is press-fitted into each punched hole in the material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3604883U JPS59143062U (en) | 1983-03-12 | 1983-03-12 | assembly printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3604883U JPS59143062U (en) | 1983-03-12 | 1983-03-12 | assembly printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59143062U true JPS59143062U (en) | 1984-09-25 |
Family
ID=30166721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3604883U Pending JPS59143062U (en) | 1983-03-12 | 1983-03-12 | assembly printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59143062U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5829870B2 (en) * | 1977-09-09 | 1983-06-25 | 株式会社東芝 | Leak test equipment |
-
1983
- 1983-03-12 JP JP3604883U patent/JPS59143062U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5829870B2 (en) * | 1977-09-09 | 1983-06-25 | 株式会社東芝 | Leak test equipment |
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