JPS58170040A - Low temperature sealing member - Google Patents

Low temperature sealing member

Info

Publication number
JPS58170040A
JPS58170040A JP57053428A JP5342882A JPS58170040A JP S58170040 A JPS58170040 A JP S58170040A JP 57053428 A JP57053428 A JP 57053428A JP 5342882 A JP5342882 A JP 5342882A JP S58170040 A JPS58170040 A JP S58170040A
Authority
JP
Japan
Prior art keywords
melting point
point glass
low melting
sealing
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57053428A
Other languages
Japanese (ja)
Other versions
JPH0128504B2 (en
Inventor
Hiroaki Ohigata
大日方 弘明
Yoshio Konuma
小沼 良雄
Shinichi Wakabayashi
信一 若林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP57053428A priority Critical patent/JPS58170040A/en
Publication of JPS58170040A publication Critical patent/JPS58170040A/en
Publication of JPH0128504B2 publication Critical patent/JPH0128504B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/10Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Optical Filters (AREA)

Abstract

PURPOSE:To form a sealing member capable of sealing at a low temperature with high reliability of sealing characteristic in an excellent mass production by glazing a low melting point glass on one side surface of a supporting member and plating gold on the other side surface. CONSTITUTION:A supporting member 12 made of ceramic formed in a frame shape is formed at a sealing member 10. A metallized layer 14 made of metal such as tungsten, molybdenum or the like is baked on the lower surface of the member 12, a nickel is plated on the layer 14, and a low melting point glass 20 is glazed on the upper surface of the member 12. This glass 20 is coated and glazed on the surface after plated. In order to form a low melting point glass 20 layer, low melting glass powder is formed in a paste state with acryl resin and nitrocellulose as an organic binder and terpineol or the like as a solvent, and coated by a screen printing on the upper surface of the member 12. Subsequently, it is dried at 80-150 deg.C, and then glazed at 300-450 deg.C.

Description

【発明の詳細な説明】 本発明は低温封止用シール部材に関し、一層詳細には、
固体撮像素子を封じ込めるパッケージ等と光透過用窓部
材等の低温封止に用いて好適なシール部材に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a sealing member for low temperature sealing, and more specifically,
The present invention relates to a sealing member suitable for use in low-temperature sealing of a package for enclosing a solid-state image sensor and a light-transmitting window member.

エリアセンサ、すなわちCCD等の固体撮像素子に有機
質の色分解フィルターを被着したものは、熱に弱いため
、パッケージに封入するにはパッケージと光透過用窓部
材との間で、一般に200゜C以下の低温シールが要求
される。
Area sensors, that is, solid-state imaging devices such as CCDs coated with organic color separation filters, are sensitive to heat, so in order to encapsulate them in a package, the temperature between the package and the light-transmitting window member is generally 200°C. The following low temperature seals are required.

低温シールのシール材としては樹脂を用いるものがある
が、樹脂は透湿性があり好ましくない。
Although resins are used as sealing materials for low-temperature seals, resins are not preferred because they are moisture permeable.

また低融点ガラスを用いて窓部材をあらかじめ金属支持
枠に高温封着(400°C前後)させ、この金属支持枠
をパッケージに溶接するシームウェルド法があるが、シ
ームウェルド時の機械的応力および熱応力により低融点
ガラスおよび光透過用窓部材にクラックが発生しやすく
、気密性に不安があるばかりでなく、製造工程が複雑で
多数個同時封止が困離であるなど生産性が悪く、コスト
高となる難点がある。
There is also a seam welding method in which the window component is sealed at high temperature (around 400°C) to a metal support frame using low melting point glass, and this metal support frame is welded to the package. Cracks tend to occur in low-melting glass and light-transmitting window members due to thermal stress, which not only raises concerns about airtightness, but also has poor productivity, as the manufacturing process is complicated and it is difficult to seal multiple pieces at the same time. There is a drawback that the cost is high.

その他、窓部材としてサファイアを使用して高温でメタ
ライズし、軟ろうを用いてパッケージに融着するものが
あるが高価である。
In addition, sapphire is used as a window member, metallized at high temperature, and fused to the package using soft solder, but these are expensive.

本発明は上記難点を解消すべくなされ、その目的とする
ところは量産性に優れ、しかも封止特性の信頼度が高い
低温封止が可能なシール部材を提供することにあり、そ
の特徴とするところは支持部材の片面に低融点ガラスを
グレーズして光透過用窓部材の溶着部とし、もう片面に
は金メッキを施して軟ろうによる封止部としたことにあ
る。
The present invention has been made to solve the above-mentioned difficulties, and its purpose is to provide a sealing member that is excellent in mass production, has highly reliable sealing properties, and is capable of low-temperature sealing, and has the following characteristics: The problem lies in that one side of the support member is glazed with low melting point glass to form the welded part of the light transmitting window member, and the other side is plated with gold to form the sealed part by soft solder.

以下本発明の好適な実施例を添付図面に基づいて詳細に
説明する。
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

第1図はシール部材lOを示す。図において12は枠状
に成形したセラミックからなる支持部材である。
FIG. 1 shows a sealing member IO. In the figure, reference numeral 12 denotes a support member made of ceramic and formed into a frame shape.

14はタングステン、モ1ノプデン等の金属からなるメ
タライズ層であり支持部材12下面に焼成しである。
Reference numeral 14 denotes a metallized layer made of metal such as tungsten or monopden, which is fired on the lower surface of the support member 12.

16はメタライズ層14に施したニッケルメッキ層、1
8は金メッキ層である。
16 is a nickel plating layer applied to the metallized layer 14;
8 is a gold plating layer.

金メッキ層18の厚さは3〜5メm必要である。The thickness of the gold plating layer 18 is required to be 3 to 5 mm.

こ、れは後述するように低融点ガラスをグレーズする際
の処理温度が約400°Cという高温であるためニッケ
ル層16が金メッキ層18に拡散して酸化し、はんだ漏
れ性を悪化するため上記程度の厚さを必要とすることに
よる。なおニッケルメッキ厚は27層程度でよい。
This is because, as will be described later, the processing temperature when glazing low melting point glass is as high as approximately 400°C, so the nickel layer 16 diffuses into the gold plating layer 18 and oxidizes, worsening solder leakage. Depending on the thickness required. Note that the thickness of nickel plating may be about 27 layers.

20は低融点ガラスであり、支持部材12上面にグレー
ズしである。
20 is a low melting point glass, and the upper surface of the support member 12 is glazed.

この低融点ガラス2oは上述のメッキ処理の後に塗布、
グレーズされる。
This low melting point glass 2o is applied after the above plating process,
Glazed.

これは初めに低融点ガラス20を被着させた後メッキ処
理を行うと、低融点ガラス20が化学的に極めて不安定
なためメッキ洛中で変質してしまうこと、処理中に水分
を吸蔵するため封止後の固体撮像素子に悪影彎を及ぼす
こと、また、メッキ浴に不純物が混入するため浴寿命が
著しく低下し、実用化が困難なことによる。
This is because if the low melting point glass 20 is applied first and then plating is performed, the low melting point glass 20 is chemically extremely unstable and deteriorates during the plating process, and also because it absorbs moisture during the process. This is because it causes negative effects on the solid-state image sensor after being sealed, and because impurities are mixed into the plating bath, the bath life is significantly reduced, making it difficult to put it into practical use.

低融点ガラス20層を形成するには、まず低融点ガラス
粉末を有機バインダーとしてアクリル樹脂、ニトロセル
ロース等を用い、溶剤としてテルピネオール等を用いて
ペースト状にし、これをスクリーン印刷等によって上記
支持部材12上面に塗布する。
To form the 20 layers of low-melting point glass, first, low-melting point glass powder is made into a paste using acrylic resin, nitrocellulose, etc. as an organic binder and terpineol, etc. as a solvent, and this is pasted onto the supporting member 12 by screen printing or the like. Apply to the top surface.

次にこれを800C〜l 5000で乾燥した後300
°C〜450°Cでグレージング処理するものである。
Next, dry this at 800C~l 5000 and then
Glazing treatment is carried out at a temperature of 450°C to 450°C.

以上のように支持部材上に金メッキと低融点ガラスとを
被着してシール部材をあらかじめ形成することによって
、従来光透過用窓部材たる光学ガラス上にスクリーン印
刷によって低融点ガラスを塗布していたのに比し、光学
ガ喪スを治具上に塔載したりする必要がないため傷の発
生を防止でき、また光学ガラスの光透過部に低融点ガラ
ス粉末が飛び散り、そのままグレーズされるという不良
品の発生が阻止される。
As described above, by forming a sealing member in advance by depositing gold plating and low-melting point glass on the supporting member, the low-melting point glass was conventionally applied by screen printing onto the optical glass, which is a light-transmitting window member. Compared to conventional methods, there is no need to place optical gas molten gas on a jig, which prevents scratches, and low-melting glass powder scatters on the light-transmitting part of the optical glass, causing it to be glazed as it is. Generation of defective products is prevented.

第2図は他の実施例を示す。FIG. 2 shows another embodiment.

本実施例においては金メッキ18の下地としてニッケル
メッキ16上にさらにロジウムメッキ層17が形成しで
ある他は上記実施例と同様であるので説明は省略する。
This embodiment is the same as the embodiment described above except that a rhodium plating layer 17 is further formed on the nickel plating 16 as a base for the gold plating 18, so a description thereof will be omitted.

本実施例においても上述と同様の効果を有する他、金メ
ッキ厚を0.5%mN1.5メm程度にまで薄く形成で
き大幅なコストの削減が図れる。
In addition to the same effects as described above, this embodiment can also reduce the gold plating thickness to about 0.5% mN and 1.5 mm, resulting in a significant cost reduction.

また金メッキ層18が薄く形成されるから、後述のごと
くはんだ(Sn−Pb)を介してセラミックパッケージ
等に封止する際に機械的強度が低く、また熱に弱いS 
n −P b −A u合金が形成され難く強度的な面
で有利となる。
Furthermore, since the gold plating layer 18 is formed thinly, its mechanical strength is low when it is sealed into a ceramic package etc. via solder (Sn-Pb), as will be described later.
It is difficult to form an n-Pb-Au alloy, which is advantageous in terms of strength.

このように金メッキ層18が薄く形成できるのは、ロジ
ウムがニッケ鼻層の拡散、のバリアーとして有効に作用
し、またロジウム自体が金と金属間化合物を形成しに<
<、また酸化しにくいことによって上述のグレージング
時の高温条件下においても安定しているからである。
The reason why the gold plating layer 18 can be formed so thin is that rhodium acts effectively as a barrier to diffusion in the nickel nose layer, and rhodium itself forms intermetallic compounds with gold.
Furthermore, because it is difficult to oxidize, it is stable even under the above-mentioned high temperature conditions during glazing.

ロジウムメッキ厚は特に限定されないが0.1メm〜0
.5.Jm程度で有効である。
The rhodium plating thickness is not particularly limited, but is 0.1 mm to 0.
.. 5. It is effective at about Jm.

第3図は上記シール部材lOを光透過用窓部材たる光学
ガラス30に熱封着したものを示す。
FIG. 3 shows the sealing member 10 heat-sealed to an optical glass 30 serving as a light-transmitting window member.

この熱封着は400°C前後の高温をかけて、低融点ガ
ラスによって溶着するものである。
This heat sealing involves applying a high temperature of around 400° C. to weld with low melting point glass.

本発明はこの光学ガラス30にシール部材10を熱封着
した光透過用窓付き蓋体としても提供される。
The present invention is also provided as a lid with a light transmitting window in which the sealing member 10 is heat-sealed to the optical glass 30.

なおこのシール部材10の金メッキ層18にはんだ等の
軟ろうをあらかじめ被着した光透過用窓付き蓋体として
も提供できる。        −第4図はセラミック
パッケージ31の一例を示す。
Note that the sealing member 10 can also be provided as a lid with a window for light transmission, in which a soft solder such as solder is applied to the gold plating layer 18 of the sealing member 10 in advance. - FIG. 4 shows an example of the ceramic package 31.

32は固体撮像素子、34はその色分解フィルターであ
る。
32 is a solid-state image sensor, and 34 is its color separation filter.

このセラミックパッケージ31の上端面の封止部ニハメ
タライズ層36が形成され、このメタライズ層の上にニ
ッケルメッキ層38、さらにこの上に金メッキ層40が
形成される。
A sealing portion Nihametallized layer 36 is formed on the upper end surface of this ceramic package 31, a nickel plating layer 38 is formed on this metallized layer, and a gold plating layer 40 is further formed on this metallized layer.

1     しかして上記シール部材16の金メッキ層
18とこのセラミックパッケージ31の金メッキ層40
との間ではんだ等の軟ろうを介して低温封止されるもの
である。
1 Therefore, the gold plating layer 18 of the sealing member 16 and the gold plating layer 40 of this ceramic package 31
A low-temperature seal is applied between the two and a soft solder such as solder.

一ル部材の支持部材としてはセラミックの他に、低融点
ガラスとほぼ同一の熱膨張係数を有する部材、例えばコ
バール(F e−N i、−Co合金)。
In addition to ceramics, the support member for the aluminum member may be a member having a coefficient of thermal expansion almost the same as that of low-melting glass, such as Kovar (Fe-Ni, -Co alloy).

IF e −N i合金等を用いることもでき、また導
電性部材などであってその表面に直接メッキできるもの
であれば上述のメタライズ層は必ずしも形成することを
要しない。
An IF e -Ni alloy or the like may also be used, and the metallized layer described above does not necessarily need to be formed as long as it is a conductive member and can be directly plated on the surface thereof.

以上のように本発明によれば、シール部材としてあらか
じめ提供できるので、従来のごとく光透過用窓部材に低
融点ガラスを直接塗布するなどの操作が省け、光透過用
窓部材を傷付けたり汚したりすることがなく、またロジ
ウム層を設けたものにあっては上述の他に金メッキ層を
薄く形成できコスト的に極めて有利となる等の種々の著
効を奏する。
As described above, according to the present invention, since it can be provided in advance as a sealing member, operations such as applying low melting point glass directly to the light-transmitting window member as in the conventional method can be omitted, and the light-transmitting window member is not damaged or soiled. In addition to the above, the rhodium layer has various other advantages such as being able to form a thin gold plating layer, which is extremely advantageous in terms of cost.

以上本発明につき好適な実施例を挙げて種々説明したが
、本発明はこの実施例に限定されるものではなく、発明
の精神を逸脱しない範囲内で多くの改変を施し得るのは
もちろんのことである。
Although the present invention has been variously explained above with reference to preferred embodiments, the present invention is not limited to these embodiments, and it goes without saying that many modifications can be made without departing from the spirit of the invention. It is.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図は本発明に係るシール部材のそれぞれ異
なる実施例を示す断面図、第3図は光学ガラスにシール
部材を溶着した断面図、第4図はセラミックパッケージ
の一例を示す断面図である。 10.8.シール部材、12.、、支持部材。 149.、  メタライズ層、16.、、ニラナルメッ
キ層、18...金メッキ層、20.、、低融点ガラス
、17,0.ロジウムメッキ層。 30、 、、光学ガラス、31.、、セラミックパッケ
ージ、32,0.固体撮像素子。 341.1色分解フィルター、36.、、メタライズ層
、3B、、、 ニッケルメッキ層。 4’O1,、メッキ層。 特許出願人 新光電気工業株式会社 代表者光延丈喜夫 第4図 32   34
FIGS. 1 and 2 are cross-sectional views showing different embodiments of the sealing member according to the present invention, FIG. 3 is a cross-sectional view of the sealing member welded to optical glass, and FIG. 4 is a cross-sectional view showing an example of a ceramic package. It is a diagram. 10.8. Seal member, 12. ,,Supporting member. 149. , metallized layer, 16. , Niranal plating layer, 18. .. .. Gold plating layer, 20. , , low melting point glass, 17,0. Rhodium plated layer. 30. Optical glass 31. ,,ceramic package,32,0. Solid-state image sensor. 341.1 Color separation filter, 36. ,,metalized layer, 3B,,, nickel plating layer. 4'O1, plating layer. Patent applicant Shinko Electric Industry Co., Ltd. Representative Takekio Mitsunobu Figure 4 32 34

Claims (1)

【特許請求の範囲】 1、低融点ガラスを、この低融点ガラスとほぼ同程度の
熱膨張係数を有する支持部材の片面にグレーズし・支持
部材のもう一方の片面には金メッキを施して成る低温封
止用シール部材。 2、低融点ガラスを、この低融点ガラスとほぼ同程度の
熱膨張係数を有する支持部材の片面にグレーズし、支持
部材のもう一方の片面にはロジウム等の拡散防止材を下
地として金メッキを施して成る低温封止用シール部材。 3、低融点ガラスを、この低融点ガラスとほぼ同程度の
熱膨張係数を有する支持部材の片面にグレーズし、支持
部材のもう一方の片面には金メッキを施して成るシール
部材を、光透過用窓部材の適所に前記低融点ガラスで封
着したことを特徴とする光透適用窓付き蓋体。
[Claims] 1. Low-temperature glass made by glazing low melting point glass on one side of a support member having a coefficient of thermal expansion approximately equal to that of the low melting point glass and gold plating on the other side of the support member. Seal member for sealing. 2. Glaze low melting point glass on one side of a support member that has a coefficient of thermal expansion that is approximately the same as this low melting point glass, and plate the other side of the support member with gold using a diffusion prevention material such as rhodium as a base. A sealing member for low-temperature sealing made of 3. A sealing member made by glazing low melting point glass on one side of a support member having a coefficient of thermal expansion approximately equal to that of the low melting point glass and gold plating on the other side of the support member for light transmission. A lid body with a light-transmitting window, characterized in that the low-melting point glass is sealed at an appropriate position of a window member.
JP57053428A 1982-03-31 1982-03-31 Low temperature sealing member Granted JPS58170040A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57053428A JPS58170040A (en) 1982-03-31 1982-03-31 Low temperature sealing member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57053428A JPS58170040A (en) 1982-03-31 1982-03-31 Low temperature sealing member

Publications (2)

Publication Number Publication Date
JPS58170040A true JPS58170040A (en) 1983-10-06
JPH0128504B2 JPH0128504B2 (en) 1989-06-02

Family

ID=12942563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57053428A Granted JPS58170040A (en) 1982-03-31 1982-03-31 Low temperature sealing member

Country Status (1)

Country Link
JP (1) JPS58170040A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5532005U (en) * 1978-08-21 1980-03-01

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51132454A (en) * 1975-05-13 1976-11-17 Murata Manufacturing Co Method of mounting electronic parts with leads

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5532005U (en) * 1978-08-21 1980-03-01

Also Published As

Publication number Publication date
JPH0128504B2 (en) 1989-06-02

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