JPS58168163U - Grounding land for printed wiring board - Google Patents

Grounding land for printed wiring board

Info

Publication number
JPS58168163U
JPS58168163U JP1982066246U JP6624682U JPS58168163U JP S58168163 U JPS58168163 U JP S58168163U JP 1982066246 U JP1982066246 U JP 1982066246U JP 6624682 U JP6624682 U JP 6624682U JP S58168163 U JPS58168163 U JP S58168163U
Authority
JP
Japan
Prior art keywords
land
wiring board
printed wiring
grounding
grounding land
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982066246U
Other languages
Japanese (ja)
Inventor
健一 福田
Original Assignee
クラリオン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クラリオン株式会社 filed Critical クラリオン株式会社
Priority to JP1982066246U priority Critical patent/JPS58168163U/en
Publication of JPS58168163U publication Critical patent/JPS58168163U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図は、それぞれ従来技術を示しAは平
面図、Bは側面図である。第3図は本考案の実施例の平
面図である。 1・・・・・ゼス挿入孔、4・・・・・・第1のランド
部、5・・・・・・・第2のランド部、6・・・・・・
第3のランド部。
FIG. 1 and FIG. 2 each show the prior art, and A is a plan view and B is a side view. FIG. 3 is a plan view of an embodiment of the present invention. 1... Zess insertion hole, 4... First land part, 5... Second land part, 6...
Third land part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ビス締めによりアースするアース用ランドにおいて、ビ
ス挿入孔の周囲に小面積の複数の第1のランド部を設け
、この複数の第1のランド部に隣接して大面積の第2の
ランド部を設け、この第2のランド部と前記第1のラン
ド部との間および前記第1のランド部相互間を小径の第
3のランド部で連接したことを特徴とするプリント配線
基板のアース用ランド。
In a grounding land that is grounded by screw tightening, a plurality of small-area first land portions are provided around the screw insertion hole, and a large-area second land portion is provided adjacent to the plurality of first land portions. A grounding land for a printed wiring board, characterized in that the second land portion and the first land portion are provided, and the first land portions are connected by a third land portion having a small diameter. .
JP1982066246U 1982-05-07 1982-05-07 Grounding land for printed wiring board Pending JPS58168163U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982066246U JPS58168163U (en) 1982-05-07 1982-05-07 Grounding land for printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982066246U JPS58168163U (en) 1982-05-07 1982-05-07 Grounding land for printed wiring board

Publications (1)

Publication Number Publication Date
JPS58168163U true JPS58168163U (en) 1983-11-09

Family

ID=30076134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982066246U Pending JPS58168163U (en) 1982-05-07 1982-05-07 Grounding land for printed wiring board

Country Status (1)

Country Link
JP (1) JPS58168163U (en)

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