JPS58167171A - Manufacture of jet head - Google Patents
Manufacture of jet headInfo
- Publication number
- JPS58167171A JPS58167171A JP5203882A JP5203882A JPS58167171A JP S58167171 A JPS58167171 A JP S58167171A JP 5203882 A JP5203882 A JP 5203882A JP 5203882 A JP5203882 A JP 5203882A JP S58167171 A JPS58167171 A JP S58167171A
- Authority
- JP
- Japan
- Prior art keywords
- upper plate
- substrate
- fine grooves
- fine
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title description 6
- 238000003754 machining Methods 0.000 claims abstract description 14
- 238000005530 etching Methods 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 229910052737 gold Inorganic materials 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims abstract description 3
- 238000007740 vapor deposition Methods 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000004071 soot Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000005304 joining Methods 0.000 abstract description 4
- 239000003822 epoxy resin Substances 0.000 abstract description 2
- 229920000647 polyepoxide Polymers 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000009760 electrical discharge machining Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 238000005323 electroforming Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はインクをノズルから噴射して記録紙に印字する
インクジェットプリンタの噴射ヘッドの製造方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing an ejection head for an inkjet printer that prints on recording paper by ejecting ink from nozzles.
噴射ヘッドは管路部外側の位置決め窓に取付けられた圧
電素子の機械的変位によって管路部内のインクを加圧し
、微細溝部から噴射する構造になっている。噴射ヘッド
は微細溝の製造が極めて難しく、一般的には注射針の如
き引き抜き微細管を。The ejection head has a structure that pressurizes ink within the conduit section by mechanical displacement of a piezoelectric element attached to a positioning window on the outside of the conduit section, and ejects the ink from the fine groove section. It is extremely difficult to manufacture microscopic grooves in the injection head, so generally a microtube drawn out like a hypodermic needle is used.
用いる方法や電鋳による方法が考えられる。しかしなが
ら、前者は寸法精度の確保が難しく、且つ段付、テーバ
断面等圧対応できない。後者は母形が極めて小さくなる
ため、その製作および除去が殆んど不可能である。現実
的な方法として、基板片面にエツチング微細溝、管路部
、タンク部等を形成すると同時に外形加工し、同じくエ
ツチングによって加工された上部プレートと基板を接着
または溶接等により接合することもできる。しかしなが
ら接着の場合は接着剤が微細溝に入り込むおそれがある
し、接着剤が薄いと接着強度が弱くなる。溶接の場合は
各微細溝を完全に分離した状態での接合が難しく、且つ
熱変形を生じる。完全な接合が得られても、インクの噴
射特性を良好にするためには微細溝先端の端面仕上も良
好（数μｍＲｍａｘ）にしなければならない。したがっ
て従来は基板と上部プレートを接合する前に両者の端面
を研削加工し、この時に生じた研削ばりは顕微鏡によっ
て針先等を用いて各微細溝毎に除去する。Possible methods include using a method using electroforming and a method using electroforming. However, in the former case, it is difficult to ensure dimensional accuracy, and it is not possible to accommodate stepped or equal pressure on the Taber cross section. The latter has a very small matrix and is almost impossible to manufacture and remove. As a practical method, etching fine grooves, conduit sections, tank sections, etc., can be formed on one side of the substrate, and at the same time, the external shape is processed, and the upper plate, which has also been processed by etching, and the substrate can be joined by gluing or welding. However, in the case of adhesion, there is a risk that the adhesive will get into the fine grooves, and if the adhesive is thin, the adhesive strength will be weak. In the case of welding, it is difficult to join each fine groove in a completely separated state, and thermal deformation occurs. Even if perfect bonding is obtained, the end surface finish of the tip of the fine groove must also be good (several μm Rmax) in order to improve the ink jetting characteristics. Therefore, conventionally, before joining the substrate and the upper plate, the end faces of both are ground, and the grinding burrs generated at this time are removed from each microgroove using a needle tip or the like under a microscope.
しかし、はり取りは針先等によって微細溝Ｋｒきず」や
「だれ」 「ごみ」および変形を発生させるため、噴射
特性に極めて悪偽影響を与える結果となる。また微細溝
本綬が多い場合はばり取りに多くの工数を要する。より
以上の仕上面粗さを必要とする場合はラップ、パフ仕上
等を行なづが、接合面稜線でだれを生じる。さらには基
板と上部プレートの接合は端面合わせ後に行なっている
が、両者接合面が完全な平面になることはまれであり、
殆んどが接合面に段差を生じ、インクだれや噴射方向に
悪影響を及はす結果となる。また、従来のエツチング基
板方式によれば、基板片面に微細溝を形成し、上部フレ
ートを重ね合わせてヘッドとして接合しているが、高密
度化に対応するためには別のヘッドを一組用意し、基板
同志を背中合わせにして４片で接合しなければならない
。したがって基板両面にエツチング微ａ（溝が形成でき
れば良いが、タンク容量の関係から基板を厚くする必要
があり、この結果として基板形成をエツチングによって
行なうことはできない。したがって４片接合の結果、そ
れぞれの微細溝の高精度位置決めや端面合わせが極めて
難しくなる。However, deburring causes minute grooves, Kr scratches, drips, dirt, and deformation due to the needle tip, etc., which has a very negative effect on the injection characteristics. In addition, if there are many finely grooved main ribs, many man-hours are required for deburring. If a higher finished surface roughness is required, lapping, puff finishing, etc. are performed, but sagging occurs at the joint surface ridgeline. Furthermore, although the substrate and upper plate are joined after the end faces have been aligned, it is rare for the joining surfaces to be perfectly flat.
In most cases, a step is created on the joint surface, which adversely affects ink dripping and the ejection direction. In addition, according to the conventional etching substrate method, fine grooves are formed on one side of the substrate, and the upper plate is overlapped and bonded as a head, but in order to cope with higher density, a separate set of heads is prepared. However, the boards must be placed back to back and joined in four pieces. Therefore, it would be fine if etching grooves could be formed on both sides of the substrate, but the substrate needs to be thick due to the tank capacity, and as a result, the substrate cannot be formed by etching.Therefore, as a result of joining the four pieces, each High-precision positioning of fine grooves and end face alignment become extremely difficult.
本発明の目的はが＼る欠点を除去した噴射ヘッドの製造
方法を提供することにある。本発明によれば基板両面に
エツチング微細溝を形成し、基板外形およびタンク部を
機械加工や放電加工によって加工し、基板と上部プレー
トを金鍍金後、両者を拡散接合し、微細溝側端面を放電
加工によって仕上加工する噴射ヘッドの製造方法得るこ
とができる。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing an ejection head that eliminates the drawbacks described above. According to the present invention, etching fine grooves are formed on both sides of the substrate, the outer shape of the substrate and the tank part are processed by machining or electric discharge machining, the substrate and the upper plate are plated with gold, and the two are diffusion bonded, and the end surface on the side of the fine grooves is formed. It is possible to obtain a method for manufacturing an ejection head that is finished by electrical discharge machining.
以下図によって説明する。This will be explained below using figures.
図は本発明の一実施例を示す噴射ヘッドの分解図である
。図において、１は基板であり、両面に千鳥の位置でエ
ツチング微細溝２および管路部３を形成している。４は
タンク部であり、外形と同様に機械加工又は放電加工に
よって加工する。なお、同様の加工が可能であれば機械
加工および放電加工に限定するものではない。又エツチ
ング加工によりても可能かもしれないが、本ヘッドの場
合タンク容量の関係から基板厚さが数ＩＩ＋であり。The figure is an exploded view of an ejection head showing an embodiment of the present invention. In the figure, reference numeral 1 denotes a substrate, on both sides of which etched fine grooves 2 and conduit portions 3 are formed at staggered positions. 4 is a tank portion, which is machined by machining or electric discharge machining in the same manner as the outer shape. Note that the present invention is not limited to machining and electric discharge machining as long as similar machining is possible. It may also be possible to do this by etching, but in the case of this head, the substrate thickness is several II+ due to tank capacity.
精度、作業性、技術的な面で殆んど不可能である。It is almost impossible in terms of accuracy, workability, and technical aspects.
５ｉｉ上部プレートであり、基板ｌの管路部３に相当す
る位置決め窓６を有する。７は圧電素子であり、位置決
め窓６に貼り付ける。以・上の構成部品から成る噴射ヘ
ッドの震造手順を説明すると、先ず基板１と上部プレー
ト５に金属鍍金を施す。金属の種類については金、すす
、ニッケル等があるが特に限定するものではなく、また
金属の付着方法も鍍金に限定するものではない。すなわ
ち、金属付着され九基板１と上部グレート５を熱圧着に
より接合するものであり、接合の可能な金属で且つ仕様
に合致するものであれば何でも良い。金属付着について
も蒸着、焼付塗布等の様に種々の方法が考えられる。ま
た、基板１および上部プレート５の材質については非金
槁であっても可能であるし、金属にした場合は金属付着
を施さないでダイレクトに接合することも可能である。5ii upper plate, and has a positioning window 6 corresponding to the conduit section 3 of the substrate l. 7 is a piezoelectric element, which is attached to the positioning window 6. To explain the procedure for constructing an injection head made up of the above components, first, the substrate 1 and the upper plate 5 are plated with metal. The type of metal includes gold, soot, nickel, etc., but is not particularly limited, and the method of attaching the metal is not limited to plating. That is, the metal-attached substrate 1 and the upper grate 5 are bonded by thermocompression bonding, and any metal can be used as long as it can be bonded and meets the specifications. Various methods can be considered for metal attachment, such as vapor deposition, baking coating, and the like. Further, the material of the substrate 1 and the upper plate 5 may be non-metallic, and if metal is used, it is also possible to directly join them without applying metal adhesion.
次に、熱圧着接合された基板１と上部プレート５は微細
溝２側の端面を放電加工によって切断することにより、
段差のない仕上面の良好な端面を得ることができる。放
電加工によれば一般的には数μｍ Ｒｍａｘの仕上面粗
さであるが、条件の組み合わせや電極の方向によっては
１〜２μｍＲｍａＸ又はサフ″”１１ｍＲｍａＸの仕上
面粗さを得ることができる。したがって、仕上面粗さか
ら考えると十分使用に供することができるし、又、放電
加工によって微細溝２が塞がったり、「ぼり」「だれ」
「変形」の発生が無いことも確認された。Next, the end surface of the thermocompression bonded substrate 1 and upper plate 5 on the fine groove 2 side is cut by electrical discharge machining.
It is possible to obtain a good finished end face with no steps. According to electric discharge machining, the finished surface roughness is generally several μm Rmax, but depending on the combination of conditions and the direction of the electrode, it is possible to obtain a finished surface roughness of 1 to 2 μmRmax or as low as 11 mRmax. Therefore, considering the finished surface roughness, it can be used satisfactorily, and the fine grooves 2 are not clogged due to electrical discharge machining, and "bumps" and "slops"
It was also confirmed that no "deformation" occurred.
最後に、上部プレート５の位置決め、窓６に例えばエポ
キシ系樹脂を薄く塗布し、圧電素子７を貼り付ける。Finally, the upper plate 5 is positioned, the window 6 is coated with a thin layer of epoxy resin, and the piezoelectric element 7 is attached.
以上の様に本発明によればエツチング微細溝を形成した
基板に上部グレートを接合することによリ、電鋳や引き
抜き素管に比して高精度で且つ複雑形状の微細溝を供給
することができ、ピッチ間寸法を小さくすることによっ
て小型化にも対応で〜る。また接着の如く、微細溝に接
着剤が入り込んで溝を塞ぐこともないし、溶接と異なり
完全な接合を実現することができるため、各チャンネル
間が確実に分離独立される。微細ヘッド端面の仕上にお
いては前述の如く、放電加工によって行なうため、ばり
等が無く良好な面を得ることができる。さらに（１ヘッ
ド端面に段差を発生しないため、インクだれを防止し、
良好な噴射特性を得ることがでへた。また、基板両面に
微細溝を形成した結果、それぞれの溝の位置合わせおよ
び平行合わせが不要であり、ヘッド構成部品が、４片か
ら３片になり極めて経済的である。基板の外形およびタ
ンク部の加工は機械加工又は放電加工することによって
、ＮＣ化することができるため極めて便利である。As described above, according to the present invention, by bonding the upper grate to the substrate on which etched microgrooves have been formed, microgrooves with higher precision and complex shapes can be provided compared to electroforming or drawn tubes. It is also possible to reduce the size by reducing the pitch dimension. In addition, unlike adhesives, the adhesive does not enter the minute grooves and block them, and unlike welding, it is possible to achieve a perfect connection, so each channel is reliably separated and independent. As described above, since the end face of the fine head is finished by electric discharge machining, a good surface without burrs etc. can be obtained. In addition (no step is created on the end face of one head, preventing ink dripping,
I was able to obtain good injection characteristics. Further, as a result of forming fine grooves on both sides of the substrate, it is not necessary to align and align the respective grooves in parallel, and the number of head components is reduced from four pieces to three pieces, which is extremely economical. The outer shape of the substrate and the tank portion can be processed by NC by machining or electrical discharge machining, which is extremely convenient.
図は本発明の一実施例を示す噴射ヘッドの分解図である
。図において１は基板、２は微細溝、３は管路部、４は
タンク部、５は上部プレート、６は位置決め窓、７は圧
電素子である。The figure is an exploded view of an ejection head showing an embodiment of the present invention. In the figure, 1 is a substrate, 2 is a fine groove, 3 is a conduit section, 4 is a tank section, 5 is an upper plate, 6 is a positioning window, and 7 is a piezoelectric element.
Claims (1)
を形成し、前記基板のタンク部および外形を機械又は放
電加工等によって加工し、上部プレート−面に形成され
る前記管路部に相当する位置決め窓および外形をエツチ
ングによって加工し、前記基板および上部プレートに金
、すす、ニッケル等の金属を鍍金又は蒸着等によって数
μｍ〜数１０μｍ付加し、前記基板の両面に上部プレー
トを高精度に重ね合わせ加熱炉内において熱圧着接合後
、前記微細溝側の端面を僅か放電加工によって仕上げ、
前記位置決め窓に圧電素子を貼付けたことを特徴とする
噴射ヘッドの装造方法。Fine grooves and conduit portions are formed on both sides of the substrate in a staggered manner, and the tank portion and outer shape of the substrate are processed by a machine or electric discharge machining, which corresponds to the conduit portion formed on the surface of the upper plate. The positioning window and the outer shape are processed by etching, and a metal such as gold, soot, or nickel is added by plating or vapor deposition to several μm to several tens of μm to the substrate and the upper plate, and the upper plate is overlapped with high precision on both sides of the substrate. After thermocompression bonding in a heating furnace, the end face on the fine groove side is slightly finished by electric discharge machining,
A method for installing an ejection head, characterized in that a piezoelectric element is attached to the positioning window.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5203882A JPS58167171A (en) | 1982-03-30 | 1982-03-30 | Manufacture of jet head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5203882A JPS58167171A (en) | 1982-03-30 | 1982-03-30 | Manufacture of jet head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58167171A true JPS58167171A (en) | 1983-10-03 |
Family
ID=12903645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5203882A Pending JPS58167171A (en) | 1982-03-30 | 1982-03-30 | Manufacture of jet head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58167171A (en) |
-
1982
- 1982-03-30 JP JP5203882A patent/JPS58167171A/en active Pending
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