JPS58166723A - Transfer device for pattern - Google Patents

Transfer device for pattern

Info

Publication number
JPS58166723A
JPS58166723A JP57049136A JP4913682A JPS58166723A JP S58166723 A JPS58166723 A JP S58166723A JP 57049136 A JP57049136 A JP 57049136A JP 4913682 A JP4913682 A JP 4913682A JP S58166723 A JPS58166723 A JP S58166723A
Authority
JP
Japan
Prior art keywords
patterns
pattern
switch
light
transfer device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57049136A
Other languages
Japanese (ja)
Inventor
Fumio Mizuno
文夫 水野
Yoshikazu Tanabe
義和 田辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57049136A priority Critical patent/JPS58166723A/en
Publication of JPS58166723A publication Critical patent/JPS58166723A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/70391Addressable array sources specially adapted to produce patterns, e.g. addressable LED arrays
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To obtain desired patterns simply, to transfer patterns without using a photo-mask and to improve the accuracy of superposing of each pattern by forming a generating source of stimulus beams forming patterns by a plurality of minute unit generating sources and arranging the generating sources in plane shape and selectively driving desired unit generating sources. CONSTITUTION:A micro-computer 17 each brings several switch of a switch 15 group to ON or OFF state independently on the basis of pattern informations, and lights corresponding light-emitting elements 14. Consequently, light patterns are formed in the stimulus beam generating source 10 by the light-emitting elements lit, and the patterns are imaged onto the surface of the resist 13 of a wafer substrate 12 by an optical system 11. Accordingly, the patterns are transferred completely. When the forms of the patterns are to be altered, the switch 15 group may be changed over and operated accordingly.

Description

【発明の詳細な説明】 本発明は半導体集積回路装置の製造に用いて有効なパタ
ーン転写装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a pattern transfer device that is effective for use in manufacturing semiconductor integrated circuit devices.

半導体集積回路装置の製造に際しては、レジストを塗布
したウェーハ基板上に所定パター/の光、電子ビームを
照射する所顛バター7転写装置が必要とされる。この種
の装置として従来から用いられているものは、第1図に
示すようなホトマスクを利用したものであり、光[1か
ら放射した光線2を光学レンズ3にて集束してホトマス
ク4に照射する。ホトマスク4は光透過部若しくは光不
透過部を所定のパターンに形成しており、したがってホ
トマスク4を透過した光線はレジスト5を塗布したウェ
ーハ基板6上に前記パターンのホトマスク像を形成する
ことになる。この場合、ホトマスク4とウェーハ基板6
との間に光学系を介装することもある。
When manufacturing semiconductor integrated circuit devices, a butter 7 transfer device is required which irradiates a resist-coated wafer substrate with light and electron beams in a predetermined pattern. Conventionally used devices of this type utilize a photomask as shown in FIG. do. The photomask 4 has light transmitting parts or non-light transmitting parts formed in a predetermined pattern, and therefore, the light beam transmitted through the photomask 4 forms a photomask image of the pattern on the wafer substrate 6 coated with the resist 5. . In this case, the photomask 4 and the wafer substrate 6
An optical system may be interposed between the two.

しかしながら、このような構成のパターン転写装fll
Kあっては、異なる転写パターン毎に夫々異なるホトマ
スクを用意しなければならず、通常半導体集積回路装置
の構成には極めて多くの転写パターンが必要とされるこ
とからホトマスクの、&黴も多くなり、ホトマスクの製
作にかかる工数やコストカ極めて大きなものになると共
に各ホトマスクの管理も面倒になる。また、I[数枚の
ホトマスクを使用するときには各ホトマスクの位置合せ
精度(重ね合せ精度)も重要な要因となるが、ホトマス
クの枚数に比例してこの精度を確保することが困離にな
るという問題もある。
However, the pattern transfer device with such a configuration
In this case, a different photomask must be prepared for each different transfer pattern, and since an extremely large number of transfer patterns are normally required for the construction of a semiconductor integrated circuit device, the photomask becomes contaminated with mold and mildew. , the number of man-hours and costs required to produce the photomasks become extremely large, and the management of each photomask also becomes troublesome. In addition, when using several photomasks, the alignment accuracy (overlay accuracy) of each photomask is an important factor, but it becomes difficult to ensure this accuracy in proportion to the number of photomasks. There are also problems.

したがって本発明の目的は、パターン形成を行なう光や
電子線等の刺激ビームの発生源を複数個の微小な巣位発
生源にて形成し、かつこれらの巣位発生源を面状に配列
した上で所望の単位発生源を選択的に駆動できるように
構成することにより、これら巣位発生源の選択駆動によ
り所望のパターンを得ることができ、したがってホトマ
スクを全く不要にしてパターン転写を行ない、こrLに
よりホトマスクの製作、管理に関する種々の不具合を解
消することができるパターン転写装置を提供することに
ある。
Therefore, an object of the present invention is to form a stimulus beam such as light or an electron beam for forming a pattern by a plurality of microscopic focal point generating sources, and to arrange these focal point generating sources in a planar manner. By configuring the system so that the desired unit sources can be selectively driven, a desired pattern can be obtained by selectively driving these focal point sources, and therefore pattern transfer can be performed without using a photomask at all. The object of the present invention is to provide a pattern transfer device that can eliminate various problems related to the production and management of photomasks.

以下、本発明を図示の実施例により説明する。Hereinafter, the present invention will be explained with reference to illustrated embodiments.

第2図は本発明の一笑施例の斜視図、第3図はその一部
の拡大断面図であり、同図において10は本発明が%微
とする刺激ビーム発生源、11は結慣用の光学系、12
は表面にレジスト13を塗布したウェーハ基板である。
FIG. 2 is a perspective view of an embodiment of the present invention, and FIG. 3 is an enlarged sectional view of a part thereof. Optical system, 12
is a wafer substrate whose surface is coated with resist 13.

前記刺激ビーム発生#10は巣位発生源としての複数個
(多数)の微小な発光素子(例えば発光ダイオード等)
14を面状にかつ桝目状に配設し、しかも各発光素子1
4には夫々独立してオン・オフ作動されるスイッチ15
を接続しかつこのスイッチ15を介して電源16に接続
している。この場合、スイッチ15群はマイクロコンビ
エータ17により夫々オン−オフ作動さnるようにして
いる。したがって、この刺激ビーム発生#10はスイッ
チ15を夫々任意にかつ独立してオン或いはオフさせる
ことにより各発光素子14は独立して点灯或いは消灯さ
れ、これにより単位発生源としての発光素子は所要の点
灯パターン(若しくは消灯パターン)を形成することに
なる。
The stimulation beam generation #10 includes a plurality of (many) minute light emitting elements (for example, light emitting diodes, etc.) as focal point generation sources.
14 are arranged in a plane and in a grid pattern, and each light emitting element 1
4 has switches 15 that are independently turned on and off.
and is connected to a power source 16 via this switch 15. In this case, the switches 15 are turned on and off by the micro combinator 17, respectively. Therefore, in this stimulation beam generation #10, each light emitting element 14 is independently turned on or off by turning on or off the switch 15 arbitrarily and independently, and thereby the light emitting element as a unit source can be turned on or off as required. A lighting pattern (or a lighting-off pattern) is formed.

以上の構成によtば、マイクロコ/ピ艮−夕17に所要
のパターン情報を入力するとマイクロコンビ、−夕は情
報に基づいてスイッチ15群の各スイッチを夫々独立し
てオンまたはオフの状態とし、オノ状llにしたスイッ
チに対応する発光素子14を点灯させる。これにより、
剰漱ビーム発生#[10には点灯された発光素子によっ
て明パターンが形成され、このパターンは光学系11に
よりウェーハ基板12のレジス)13表面に結像される
ことになり、これによりパターンの転写が完了される。
According to the above configuration, when required pattern information is input to the microcomputer 17, the microcomputer independently turns on or off each switch of the switch group 15 based on the information. Then, the light emitting element 14 corresponding to the switch shaped like an axle is turned on. This results in
A bright pattern is formed by the light-emitting element that is turned on at residual beam generation #10, and this pattern is imaged by the optical system 11 on the surface of the resist 13 of the wafer substrate 12, thereby transferring the pattern. is completed.

また、パター/形状を変更する場合には前記スイッチ1
5の夫々のオン−オフ状態を改めて独立して切換作動す
れば、点灯される発光素子が変化され、点灯パターンが
変化されることになる。
In addition, when changing the putter/shape, the switch 1
If the ON/OFF state of each of the LEDs 5 is independently switched again, the light emitting elements to be lit will be changed, and the lighting pattern will be changed.

したがりて、この刺激ビーム発生filOをliすれば
、面状の発生源自身で所望のバター/を形成してこれを
ウェーハ基板12上に結像できるので、種々の形状のパ
ターン転写をスイッチの切換のみで行なうことができる
。これにより、多数枚のホトマスクを用意する必要はな
く、ホトマスクの製作。
Therefore, if this stimulation beam generation filO is turned on, the desired butter can be formed by the planar generation source itself and imaged onto the wafer substrate 12, so patterns of various shapes can be transferred by switching. This can be done simply by switching. This eliminates the need to prepare multiple photomasks and allows photomask production.

管理に関する種々の不具合を解消することができる。ま
た、この装置ではウェーハ基板12を所定の位置に設置
する限り刺激ビーム発生#10とはその相対位置関係を
一定に保つことがで診るので、種々のパターンの所關重
ね合せ精度を良好なものにできる。
Various problems related to management can be resolved. In addition, with this device, as long as the wafer substrate 12 is placed in a predetermined position, the stimulation beam generation #10 can be checked by keeping its relative positional relationship constant. Can be done.

第4図は本発明の他の実施例を示し、特に刺激ビーム発
生源の異なる例である。本実施例は内部を真空状gに保
つ筐体18内に共通電極19と複数個の微小電子銃20
を対向配置し、かつ微小電子銃20を桝目状に配置した
上で夫々にスイッチ21を接続し、このスイッチ21を
介して高電圧$22に接続したものである。この刺激ビ
ーム発生llKよれば、スイッチ21を選択かつ独立し
てオン・オフさせることにより、対応する微小電子銃2
0と共通電極19との間で電子線な発生することができ
、この電子線を直接ウェーハ基板12のレジス)13表
面に照射することができる。したがって、この装置では
スイッチ21を適宜選択作動すれば面状に形成した微小
電子銃の選択されたものから電子線が発生され、電子線
束からなるパターンを形成してパターン転1を完成する
ことができるのである。
FIG. 4 shows another embodiment of the invention, in particular a different example of the stimulation beam source. In this embodiment, a common electrode 19 and a plurality of microelectron guns 20 are installed in a housing 18 that maintains a vacuum state inside.
The microelectron guns 20 are arranged facing each other, and the microelectron guns 20 are arranged in a grid pattern, each of which is connected to a switch 21, and connected to a high voltage $22 via this switch 21. According to this stimulation beam generation ILK, by selectively and independently turning on and off the switch 21, the corresponding microelectron gun 2
An electron beam can be generated between the wafer substrate 12 and the common electrode 19, and the surface of the resist 13 of the wafer substrate 12 can be directly irradiated with this electron beam. Therefore, in this device, by selectively operating the switch 21, an electron beam is generated from the selected one of the planar microelectron guns, and a pattern consisting of a bundle of electron beams is formed to complete pattern transfer 1. It can be done.

なお、刺激ビーム発生源としてはイオンビームやその他
のものを使用するようにしてもよい。また、前記各実施
例では発生g1を平面状に形成しているが、投影光学系
の収差を小さくするために曲面状に形成してもよい。更
に投影光学系として縮小レンズを用いるようにすれば巣
位発生源を粗に形成しても実用上十分な転写パターンを
得ることができ、発生源の製作を容易にできる。
Note that an ion beam or other sources may be used as the stimulation beam generation source. Further, in each of the embodiments described above, the generation g1 is formed in a flat shape, but it may be formed in a curved shape in order to reduce the aberration of the projection optical system. Furthermore, if a reduction lens is used as the projection optical system, a practically sufficient transfer pattern can be obtained even if the focal point source is formed roughly, and the source can be manufactured easily.

以上のように本発明のパターン転写装置によれば、パタ
ーン形成を行なう光や電子線等の刺激ビームの発生源を
複数個の微小な本位発生源にて形成し、かつこれらの単
位発生源を面状に配列した上で所望の巣位発生源を選択
的に駆動できるように構成しているので、これら単位発
生源を選択駆動すれば所望のパターンを簡単に得ること
ができ、したがってホトマスクを用いなくともパターン
転写を行ない、これによりホトマスクの製作、管理に関
する種々の不具合を解消できると共に、各パターンの重
ね合せ精度の向上を図ることができるのである。
As described above, according to the pattern transfer apparatus of the present invention, the generation source of the stimulation beam such as light or electron beam for pattern formation is formed by a plurality of minute basic sources, and these unit sources are Since the structure is arranged in a planar manner and the desired position sources can be selectively driven, it is possible to easily obtain a desired pattern by selectively driving these unit sources. Pattern transfer can be performed even without using a photomask, thereby making it possible to eliminate various problems related to the production and management of photomasks, and to improve the overlay accuracy of each pattern.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来装置の構成図、第2図は本発明装置の構成
図、II3図は要部の断面図、第4図は他の実施例の構
成図である。 10・・・刺激ビーム発生源、11・・・光学系、12
・・・ウェーハ基板、14・・・発光素子(巣位発生1
j)、15・・・スイッチ、16・・・電源、17・・
・マイクロコンビーータ、19・・・共通電極、20・
・・微小電子銃、21・・・スイッチ、22・・・高圧
電源。 第  1  図 第  2  図 第  3  図 第  4  図
FIG. 1 is a block diagram of a conventional apparatus, FIG. 2 is a block diagram of the apparatus of the present invention, FIG. II3 is a sectional view of the main part, and FIG. 4 is a block diagram of another embodiment. 10... Stimulation beam generation source, 11... Optical system, 12
...Wafer substrate, 14...Light emitting element (Position occurrence 1
j), 15... switch, 16... power supply, 17...
・Micro combinator, 19... common electrode, 20・
...Microelectron gun, 21...Switch, 22...High voltage power supply. Figure 1 Figure 2 Figure 3 Figure 4

Claims (1)

【特許請求の範囲】 1、 ウェーハ等の基板上に刺激ビームを照射してパタ
ーン形成を行なうパターン転写装置において、光や電子
−等の前記刺激ビームの発生源を豪数個の微小な単位発
生源にて形成し、かっこtらの単位発生IIを面状に配
列した上で所望の単位発生減を選択的に駆動できるよう
に構成したことを特徴とするパターン転写装置。 2、単位発生源な桝目状に配列してなる特許請求の範囲
第1項記載のパターン転写装置。
[Claims] 1. In a pattern transfer device that forms a pattern by irradiating a stimulus beam onto a substrate such as a wafer, the source of the stimulus beam, such as light or electrons, is generated in several minute units. 1. A pattern transfer device characterized in that the pattern transfer device is formed by a source, and is configured to be able to selectively drive a desired unit generation decrease after arranging unit generation II of parentheses t et al. in a planar manner. 2. The pattern transfer device according to claim 1, which is formed by arranging unit sources in a grid pattern.
JP57049136A 1982-03-29 1982-03-29 Transfer device for pattern Pending JPS58166723A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57049136A JPS58166723A (en) 1982-03-29 1982-03-29 Transfer device for pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57049136A JPS58166723A (en) 1982-03-29 1982-03-29 Transfer device for pattern

Publications (1)

Publication Number Publication Date
JPS58166723A true JPS58166723A (en) 1983-10-01

Family

ID=12822647

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57049136A Pending JPS58166723A (en) 1982-03-29 1982-03-29 Transfer device for pattern

Country Status (1)

Country Link
JP (1) JPS58166723A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995010799A1 (en) * 1993-10-15 1995-04-20 Jenoptik Technologie Gmbh Process and device for generating dosage patterns for the production of structured surfaces

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995010799A1 (en) * 1993-10-15 1995-04-20 Jenoptik Technologie Gmbh Process and device for generating dosage patterns for the production of structured surfaces
US5620814A (en) * 1993-10-15 1997-04-15 Leica Lithographie Systeme Jena Gmbh Process and arrangement for producing dose profiles for the fabrication of structured surfaces

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