JPS5816600A - Method of holding electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for holding a large number of electronic components such as integrated circuit components and surface acoustic wave device components having lead bins for transportation and storage.

As a conventional holding method of this type, a method is known in which a lead bin 2 of an electronic component 1 is actually held on a foamed glass plate 3 as shown in FIG.

Then, if necessary, as shown in FIG. 2, a plurality of foamed plastic plates 3 are laminated, and a restraining foamed plastic plate 4 is stacked and placed inside a cardboard box 5, and the electronic component 1 is transported and stored. Ru.

However, in this holding method, if the lead bin 2 of the electronic component 1 is thin, the lead bin 2 will not float or come off, but if the lead bin 2 is thick, the plastic plate 30 will be greatly affected by the anti-elastic force, and the lead bin 2 will not come off. In fact, there is a drawback that the dobbin 2 easily floats or comes off, and the electronic component 1 may be pulled out from the foam plastic board 3 during the process of putting the foam plastic board 3 holding the electronic component 1 in and out of the cardboard box 5, etc. It had the disadvantage of causing falling accidents.

In the inventor's experiments, when the diameter of the lead bin 2 of the electronic component 1 was thinner than 0.50 m, the electronic component 1 did not float 9 or come off, but when the diameter exceeded 0.6 mm, the electronic component 1 did not float or come off. The result is that there are many omissions.

Therefore, the electronic component 1 having the relatively thick lead bin 2
When holding the electronic components 1, the number of electronic components 1 that can be held on the foamed plastic plate 3 and the number of laminated foamed plastic plates 3 holding the electronic components 1 are limited, which has been an obstacle to mass packaging of electronic components.

Furthermore, when electronic components after characteristics testing are held between the clamp arms of an automatic testing machine and held against a foamed plastic plate, the electronic parts tend to float due to the vibrations of the automatic testing machine. There was also a constraint that it could only hold 200 pieces of 3 foamed plastic plates and 200 pieces of electronic parts with a lead bin of about 50 pieces.

In addition, as a device to hold the child parts, Disa-153-1
The device described in Japanese Patent No. 66853 is also included. However, this device consists of a paper board, a planar plate that stores the paper board, four electric sheets formed on one side of the paper board, and electrodes that pass through this conductive layer and the corresponding paper plate tl')L. This device is equipped with a support hole for a terminal, and the electronic component to be held is held by inserting a lead bin into a support hole that is drilled in advance, so it still has the drawbacks mentioned above. Ta.

The present invention has been made in order to eliminate the above-mentioned drawbacks, and is intended to securely hold various electronic components on a foamed plastic board, from electronic components in thin lead bins to those in thick lead bins. The purpose is to provide a method.

In order to achieve this object, the present invention has a method of holding electronic parts by pricking a lead bin of electronic parts on a foamed plastic board. The device is characterized in that a component is placed on the electronic component, and pressure is applied to the electronic component to break through the membrane layer and pierce the lead bin into the foamed plastic board.

Next, the present invention will be explained with reference to FIGS. 3 to 5.

FIGS. 3 and 4 are partial vertical sectional views illustrating an embodiment Ik of the present invention. First, prepare a flat foamed polystyrene tray 1 with glassine paper 6 of about 20 μm thickness pasted on the surface, and as shown in FIG. Put it on top. After that, applying downward pressure P to the electronic component 11KJ1, tearing the glassine paper 6 in the center and inserting the lead bin 8 into the expanded polystyrene tray T, as shown in FIG. 4, the electronic component 9
A plurality of the foamed polystyrene trays 7 are held at appropriate intervals. Then, as necessary, as shown in FIG. 5, a plurality of foamed polystyrene trays 1 holding electronic components 9 are stacked one on top of the other, and a foamed polystyrene tray 10 for holding down is further stacked, and the electronic components are stored in an outer box 11 made of cardboard. Pack a large number of 9. Note that 12 in FIGS. 3 and 4 is a mark indicating the product number etc. formed on the top surface of the package of the electronic component 8.

In such a holding method of the present invention, the lead bin 8
Even if some downward pressure is applied by applying the glassine paper 6 to the glassine paper 6, the lead bin 8 cannot be stuck into the expanded polystyrene tray 7 because the glassine paper 6 acts as a barrier. When the pressure under the electronic component 9 accumulates and increases, the lead bin 8φ;
It breaks through the paper 6 and pierces the foam-restyrene tray 7 with a large downward pressure.

Therefore, the expanded polystyrene tray 7 is sufficiently deformed into the shape of the lead bin 8, and the repulsive force that the lead bin 8 receives from the expanded polystyrene tray 7 becomes extremely small.

On the other hand, the glassine paper 16 acts to clamp the lead bin 8 from the periphery, and exhibits resistance against the lead bin 8 floating up or coming off.

Fig. 6 shows the downward pressure P (vertical axis) applied to the electronic component 9 glue-dobin 8 when inserting the lead bin 8 of the electronic component 9 into @foamed polystyrene tray T, and the river side and distance of the lead bin 8! The above-mentioned relationship (horizontal axis) is shown in a characteristic diagram showing the relative softness with the conventional example.

In the same figure, in the conventional example, the lead pin 8 is deeply inserted in proportion to the lower pressure P, resulting in a blood relation A that is stationary at 8 points, whereas in the present invention, the lead pin 8 is not proportional to the lower pressure P, and - It can be seen that the lead pin 8 is plunged into the expanded polystyrene tray 1 at once due to the downward pressure, and the lead pin 8 is thrust all at once.

Not only can the glassine paper 6 attached to the foamed polystyrene tray 79 surface used in the present invention be replaced with other general paper or synthetic resin sheet, but also it can be replaced with a conductive foil such as aluminum foil. A short test of the lead pin 8 threshold becomes possible, making it possible to prevent electrostatic damage to semiconductor integrated circuits and the like.

As explained above, when holding electronic components on a foamed plastic board, the present invention uses a foamed plastic board on which a film layer of a synthetic resin or conductive foil is formed on the surface, and applies pressure to the electronic component. Instantly breaking through to the fjLIN layer,
To the foamed plastic plate with lead pin with large downward pressure *j
Since the foamed plastic plate is held in a manner similar to that used for holding electronic components, the foamed plastic plate is sufficiently deformed to match the shape of the lead pin, so that the repulsive force received by the lead pin is small, and the skin glands clamp the lead pin. Therefore, regardless of the diameter of the lead pin of the electronic component, the electronic component can be held on the foamed plastic plate very easily, and the electronic component can be prevented from floating or being pulled out. Therefore, it is possible to hold more than 1,000 various electronic components on a single foamed plastic plate, and multi-liter packaging is realized.

[Brief explanation of the drawing]

1 and 2 are longitudinal cross-sectional views showing a conventional electronic component holding method; FIGS. 3 to 5 are process longitudinal cross-sectional views showing an embodiment of the electronic component holding method of the present invention; FIG. 6 is a characteristic diagram showing the relationship between the downward pressure of the electronic component and the lead pin engagement distance. 1, -...Electronic components 2.8...Lead pins 3.7...Foamed plastic plate 5.11 ・
・・Outer box 6・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Outer box 6 ・ ・ ・ ・ ・ ・ ・ ・ ・

Claims (1)

[Claims] 1. A method for holding an electronic component by sticking a lead bin for the electronic component into a foamed plastic board, which includes placing the electronic component on a foamed plastic board with a film layer formed on its surface;
By applying pressure to this electronic component, the film layer is broken through and the lead bin is turned into a foamed plastic plate.
A method for holding an electronic component, comprising holding and holding the demon component on a foamed plastic plate. 2. A method for holding an electronic component according to claim 1, characterized in that a foamed plastic board to which paper is attached is used as the foamed plastic board on which a film layer is formed. 3. As a foamed plastic plate with a film layer formed: 1. A method for holding an electronic component according to claim 1, characterized in that a foamed plastic plate to which a conductive foil is attached is used. 4. Holding of electronic components according to any one of claims 1 to 3, characterized in that a plurality of foamed plastic plates holding electronic components are stacked and stored in a case. Method.