JPS58164712U - Mold for molding synthetic resin products - Google Patents

Mold for molding synthetic resin products

Info

Publication number
JPS58164712U
JPS58164712U JP6147882U JP6147882U JPS58164712U JP S58164712 U JPS58164712 U JP S58164712U JP 6147882 U JP6147882 U JP 6147882U JP 6147882 U JP6147882 U JP 6147882U JP S58164712 U JPS58164712 U JP S58164712U
Authority
JP
Japan
Prior art keywords
mold
synthetic resin
resin products
molding synthetic
temperature control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6147882U
Other languages
Japanese (ja)
Inventor
昭治 石原
Original Assignee
井上エムテ−ピ−株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 井上エムテ−ピ−株式会社 filed Critical 井上エムテ−ピ−株式会社
Priority to JP6147882U priority Critical patent/JPS58164712U/en
Publication of JPS58164712U publication Critical patent/JPS58164712U/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図及び第２図は従来の金型の断面図、第３図は本考
案の合成樹脂製品成形用金型の一実施例の断面図第４図
は本考案の合成樹脂製品成形用金型の製造工程を説明す
る図である。 ３１・・・・・・型内面体、３２・・・・・・型外面体
、３３・・・・・・温調用パイプ、３４・・・・・・伝
熱体。Figures 1 and 2 are cross-sectional views of conventional molds, Figure 3 is a cross-sectional view of an embodiment of the mold for molding synthetic resin products of the present invention, and Figure 4 is the mold for molding synthetic resin products of the present invention. It is a figure explaining the manufacturing process of a mold. 31... Mold inner surface body, 32... Mold outer surface body, 33... Temperature control pipe, 34... Heat transfer body.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 内部に温調用パイプを有する、上型及び下型又は三以上
の分割型よりなる合成樹脂製品成形用金型において、該
成形用金型の少なくとも一つの型の内面および外面を電
気鋳造法により成形した型内面体および型外面体で各々
構造酸し、この各面体の間に温調用パイプを配管し、こ
の温調用パイプの周囲と各面体との空間を熱伝導性の良
好な金属からなる伝熱体により埋めたことを特徴とする
合成樹脂製品成形用金型。In a mold for molding a synthetic resin product consisting of an upper mold and a lower mold or three or more divided molds, each having a temperature control pipe inside, the inner and outer surfaces of at least one of the molds are formed by electroforming. A temperature control pipe is installed between each face piece, and the space between the temperature control pipe and each face piece is made of a metal with good thermal conductivity. A mold for molding synthetic resin products characterized by being filled with a heating element.
JP6147882U 1982-04-27 1982-04-27 Mold for molding synthetic resin products Pending JPS58164712U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6147882U JPS58164712U (en) 1982-04-27 1982-04-27 Mold for molding synthetic resin products

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6147882U JPS58164712U (en) 1982-04-27 1982-04-27 Mold for molding synthetic resin products

Publications (1)

Publication Number Publication Date
JPS58164712U true JPS58164712U (en) 1983-11-02

Family

ID=30071674

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6147882U Pending JPS58164712U (en) 1982-04-27 1982-04-27 Mold for molding synthetic resin products

Country Status (1)

Country Link
JP (1) JPS58164712U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62113521A (en) * 1985-11-13 1987-05-25 Dai Ichi High Frequency Co Ltd Powder resin molding device
JPH01166912A (en) * 1987-12-23 1989-06-30 Bridgestone Corp Mold
JPH0664840U (en) * 1991-10-25 1994-09-13 シチズン時計株式会社 Mold structure with cooling function

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5337760B2 (en) * 1977-10-04 1978-10-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5337760B2 (en) * 1977-10-04 1978-10-11

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62113521A (en) * 1985-11-13 1987-05-25 Dai Ichi High Frequency Co Ltd Powder resin molding device
JPH01166912A (en) * 1987-12-23 1989-06-30 Bridgestone Corp Mold
JPH0664840U (en) * 1991-10-25 1994-09-13 シチズン時計株式会社 Mold structure with cooling function

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