JPS6128617U - Secondary sprue of injection mold - bush - Google Patents

Secondary sprue of injection mold - bush

Info

Publication number
JPS6128617U
JPS6128617U JP11432684U JP11432684U JPS6128617U JP S6128617 U JPS6128617 U JP S6128617U JP 11432684 U JP11432684 U JP 11432684U JP 11432684 U JP11432684 U JP 11432684U JP S6128617 U JPS6128617 U JP S6128617U
Authority
JP
Japan
Prior art keywords
injection mold
bush
secondary sprue
sub
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11432684U
Other languages
Japanese (ja)
Inventor
宜樹 武藤
俊和 石橋
Original Assignee
日産自動車株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日産自動車株式会社 filed Critical 日産自動車株式会社
Priority to JP11432684U priority Critical patent/JPS6128617U/en
Publication of JPS6128617U publication Critical patent/JPS6128617U/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】 第1図は本考案の一実施例を示す断面図、第2図は従来
の2次スプループツシュの構成を示す断面図、第3図は
従来の2次スプループッシュを含む射出成形金型の一般
的な構成を示す断面図である。 7・・・2次スプループツシュ、7a・・・スプループ
ツシュ本体、8a,8b・・・パンドヒータ、8A,8
B・・・加熱ソーン、10・・・サーモカップル、11
・・・断熱構。
[Brief Description of the Drawings] Fig. 1 is a sectional view showing an embodiment of the present invention, Fig. 2 is a sectional view showing the configuration of a conventional secondary splop tush, and Fig. 3 includes a conventional secondary splop tush. FIG. 1 is a cross-sectional view showing a general configuration of an injection mold. 7... Secondary spoop tush, 7a... Sproop tush body, 8a, 8b... Pand heater, 8A, 8
B... Heating sawn, 10... Thermocouple, 11
...insulation structure.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] スブルーブツシュ本体の外周に複数のパンドヒータを装
着して、前記スブルーブツシュ本体の外周にバンドヒー
タ毎に加熱ゾーンを構成するとともに、各パンドヒータ
に個々にサーモカツブルを付設し、さらに前起各加熱ゾ
ーンの境界部に断熱溝を形成したことを特徴とする射出
成形金型の2次スプルプッシュ。
A plurality of band heaters are attached to the outer periphery of the sub-blue bushing main body, and a heating zone is formed for each band heater on the outer periphery of the sub-blue bush main body. A secondary sprup push for an injection mold, characterized by forming a heat insulating groove at the boundary of the heating zone.
JP11432684U 1984-07-27 1984-07-27 Secondary sprue of injection mold - bush Pending JPS6128617U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11432684U JPS6128617U (en) 1984-07-27 1984-07-27 Secondary sprue of injection mold - bush

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11432684U JPS6128617U (en) 1984-07-27 1984-07-27 Secondary sprue of injection mold - bush

Publications (1)

Publication Number Publication Date
JPS6128617U true JPS6128617U (en) 1986-02-20

Family

ID=30673347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11432684U Pending JPS6128617U (en) 1984-07-27 1984-07-27 Secondary sprue of injection mold - bush

Country Status (1)

Country Link
JP (1) JPS6128617U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH038512U (en) * 1989-06-14 1991-01-28
WO2019107331A1 (en) * 2017-12-01 2019-06-06 東京エレクトロン株式会社 Substrate liquid processing device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH038512U (en) * 1989-06-14 1991-01-28
WO2019107331A1 (en) * 2017-12-01 2019-06-06 東京エレクトロン株式会社 Substrate liquid processing device
JPWO2019107331A1 (en) * 2017-12-01 2020-12-03 東京エレクトロン株式会社 Substrate liquid processing equipment

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