JPS58151016U - Mold heating device for injection molding - Google Patents
Mold heating device for injection moldingInfo
- Publication number
- JPS58151016U JPS58151016U JP4907982U JP4907982U JPS58151016U JP S58151016 U JPS58151016 U JP S58151016U JP 4907982 U JP4907982 U JP 4907982U JP 4907982 U JP4907982 U JP 4907982U JP S58151016 U JPS58151016 U JP S58151016U
- Authority
- JP
- Japan
- Prior art keywords
- injection molding
- heating device
- mold heating
- mold
- contact surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の射出成形用金型の斜視図、第2図は従来
法による成形前の金型温度分布図、第3図は同じく連続
成形中の金型温度分布図、第4図は本考案の金型昇温装
置を金型に取付けた状態を示す斜視図、第5図は金型昇
温装置を用いた時の金型温度分布図である。
1′・・・・・・固定金型、1″・・・・・・可動金型
、4・・・・・・キャビティ空間、5・・・・・・本体
、5′・・・・・・密着面、6・・・・・・ヒータ。Figure 1 is a perspective view of a conventional injection mold, Figure 2 is a temperature distribution diagram of the mold before molding by the conventional method, Figure 3 is a temperature distribution diagram of the mold during continuous molding, and Figure 4 is a diagram of the mold temperature distribution during continuous molding. FIG. 5 is a perspective view showing the state in which the mold temperature raising device of the present invention is attached to a mold, and FIG. 5 is a mold temperature distribution diagram when the mold temperature raising device is used. 1'...Fixed mold, 1''...Movable mold, 4...Cavity space, 5...Main body, 5'... - Close contact surface, 6... Heater.
Claims (1)
可動金型1″のキャビティ空間4面とに、それぞれ、密
着可能な密着面5’、5’を形成し、その内部にヒータ
6を設けた射出成形用金型昇温装置。On both sides of the main body 5, contact surfaces 5', 5' that can be brought into close contact with the four cavity space surfaces of the fixed mold 1' and the four cavity spaces of the movable mold 1'' are formed, respectively, and a heater is installed inside the contact surfaces 5', 5'. Injection mold temperature raising device equipped with 6.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4907982U JPS58151016U (en) | 1982-04-05 | 1982-04-05 | Mold heating device for injection molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4907982U JPS58151016U (en) | 1982-04-05 | 1982-04-05 | Mold heating device for injection molding |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58151016U true JPS58151016U (en) | 1983-10-11 |
JPS6134093Y2 JPS6134093Y2 (en) | 1986-10-04 |
Family
ID=30059968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4907982U Granted JPS58151016U (en) | 1982-04-05 | 1982-04-05 | Mold heating device for injection molding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58151016U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6250061A (en) * | 1985-08-27 | 1987-03-04 | Fuso Light Alloys Co Ltd | Die casting method |
-
1982
- 1982-04-05 JP JP4907982U patent/JPS58151016U/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6250061A (en) * | 1985-08-27 | 1987-03-04 | Fuso Light Alloys Co Ltd | Die casting method |
Also Published As
Publication number | Publication date |
---|---|
JPS6134093Y2 (en) | 1986-10-04 |
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