JPS58112530U - Molding mold equipment - Google Patents

Molding mold equipment

Info

Publication number
JPS58112530U
JPS58112530U JP982882U JP982882U JPS58112530U JP S58112530 U JPS58112530 U JP S58112530U JP 982882 U JP982882 U JP 982882U JP 982882 U JP982882 U JP 982882U JP S58112530 U JPS58112530 U JP S58112530U
Authority
JP
Japan
Prior art keywords
mold
molding mold
mold equipment
heater
paring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP982882U
Other languages
Japanese (ja)
Inventor
江口　実
Original Assignee
キ−パ−株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by キ−パ−株式会社 filed Critical キ−パ−株式会社
Priority to JP982882U priority Critical patent/JPS58112530U/en
Publication of JPS58112530U publication Critical patent/JPS58112530U/en
Pending legal-status Critical Current

Links

Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の成型金型装置の軸方向断面図、第２図
は第１図の線■−■における断面図、第３図はヒータの
温度上昇を示すグラフである。 １・・・・・・中子、２・・・・・・成型金型、２Ａ・
・・・・・上金型、２Ｂ・・・・・・下金型、３・・・
・・・ヒータ、４・・・・・・キャビティ、Ｓ・・・・
・・電源、Ｒ・・・・・・抵抗器。FIG. 1 is an axial cross-sectional view of the molding device of the present invention, FIG. 2 is a cross-sectional view taken along line 1--2 in FIG. 1, and FIG. 3 is a graph showing the temperature rise of the heater. 1... Core, 2... Molding die, 2A.
...Upper mold, 2B...Lower mold, 3...
...Heater, 4...Cavity, S...
...Power supply, R...Resistor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ′　　上金型と下金型とのパーティング面において、キ
ャビティの外周面の輪郭に沿って前記金型の開口直前に
加熱させるヒータを前記金型内に埋設させ、該ヒーター
の加熱作用によりパリ部を焼切ることを特徴とする成型
金型装置。' On the parting surfaces of the upper mold and the lower mold, a heater is embedded in the mold to heat the mold along the contour of the outer peripheral surface of the cavity immediately before the opening of the mold, and the heating action of the heater causes paring. A molding device that is characterized by burning out parts.
JP982882U 1982-01-27 1982-01-27 Molding mold equipment Pending JPS58112530U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP982882U JPS58112530U (en) 1982-01-27 1982-01-27 Molding mold equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP982882U JPS58112530U (en) 1982-01-27 1982-01-27 Molding mold equipment

Publications (1)

Publication Number Publication Date
JPS58112530U true JPS58112530U (en) 1983-08-01

Family

ID=30022440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP982882U Pending JPS58112530U (en) 1982-01-27 1982-01-27 Molding mold equipment

Country Status (1)

Country Link
JP (1) JPS58112530U (en)

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