JPS58163648A - Manufacture of zinc-foil lined laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for preparing a zinc foil laminated board.
Small fat on S plate, m- due to @heaviness.

Moving towards multi-layering, and 4! Due to the increase in the number of rss products, the wiring board ignites due to the singing of the regular electric tILK ◆
IP! It's increasing by 1.

Copper is usually used for printed wiring circuits, but J
A narrow safety net is installed in one corridor of the circuit so that it will normally melt at a flow rate of 11 tons.
wlt - The t we set is the melting point of octopus, or 6 at 1,085℃.
9#! Cut off - one shot - and show the fire 4
oc (IUC when leaving early as a measure against LJ does not cause fins,
In addition, there is no noticeable sagging from the epoxy 11 resin, 7X nol resin, etc. on the board! As a foil for 1WIr, 1191 points or 419.5℃! Lead foil is the best choice, and zinc foil laminated IIjLt'' production MLt was studied using Ebokiko fat-impregnated gas cloth.

A 1M lead foil laminated laminate was prepared by pressing a triacetate film as a border film according to a conventional method, and
i Apply etching resist to the lead foil surface in the specified shape #IC, #4
] After drying the wire, I tried to remove the unnecessary parts of the zinc foil by etching with iron chloride bath solution, but I was unable to do so.
Even if you apply a thin layer of zinc foil to a sticky material and wash it with a solvent like Metel Ethercutone qJL, it will still work 9! Is it not possible to completely eliminate it and form a clear line?・@Ji6N phenomenon that does not occur in ship-attached horizontal laminates
It was found that the triacetate 2 film was thermally decomposed during high-pressing, resulting in a low molecular weight Iit fraction.

The original @ is made by looking at the C9L & eel points at 4 degrees, and the thermosetting resin varnish is impregnated into the base material, and the dried Gripreg is piled up as many times as necessary, and one side %L < 3 and both sides KIiToflli
Alternatively, in the manufacturing method of a zinc foil laminated board in which a zinc foil coated with a layering agent is applied to the hook plate by heating and pressurizing it through a resin film, methylpentene poly is used as the o+wvt film to make the zinc foil KIi/. -Methylpentene poly! - It is a 4-methylpentene It-based and 2-polion 2-based polymer, and is mainly used as 2-yl^, tape, coating paper, WL-shaped products, etc. F-- is used. 4 methylpentene 1 and SO unsaturated monomers, ? For example, a co-Mft compound with ethylene, polypyrene, vinyl acetate, etc. can also be used. ◎ 2 films are preferably 440 to 60 μm in diameter, and heated and pressed at 140 to 180°C and 20 to 12
0 minutes, 40 to 160 kg/all is used. As the thermosetting m layer, polyester resin, epoxy resin, and phenolic resin are preferably used.

In addition to zinc alone, the invention is also effective for zinc foil with other metals such as tin and lead.Example 50 μmal zinc foil (Nippon Kamikai Kogyo Exhibition) and epoxy resin impregnation Layer 4 sheets of Gas 2 Cross Grig Reg (product name: GE-67NEL, manufactured by Hitachi Kagaku Co., Ltd., NM), 50 μm thick as the mold release 2 laminate, 02 vinyl fluoride 2 laminate, methylpentene poly W-74 lume (Mitsui) Product name manufactured by Petrochemical Industry Co., Ltd., TPX-DX-=810) One side of 1 ava thickness, heated at 11 - 170 degrees Celsius and heated for 90 minutes using t'. A zinc foil laminated laminate was created using @*2's laminate, which was removed using a plane with lead foil coat mKtzll.It was in good condition with no greasy residue, and the etching resist was applied. After dissolving and removing the warping, the etchant resist was removed from all 9 places except for the t-pins, and a good one-way process with no etching residue was created! In the example, the reacetate film (58 μm (L)) was separated and laminated using a film, and when the film was laminated, a layered material remained on the entire surface of the zinc foil, and the layered material remained on the entire surface of the zinc foil. ff1111 cannot be etched with #L Hamamaki, L
7t Once the desired circuit was created and I was not able to do it.
Did you remove the triacetate film on the surface of the epoxy resin of hI? I didn't know what to do.Adhesive material rx
An abnormal phenomenon occurs between the zinc foil and the triacetate film.The viscous material generated on the surface of the zinc foil was washed away using methyl ethyl ketone, and 7 tons was completely removed. Only 9 etchings were left, and it was not possible to fabricate an attractive circuit.

In the above 111111jl 1 sea urchin 2F- invention, σ
Without special cleaning of the surface of the zinc foil, the ordinary etching method was used to produce good results with no etching residue.
The zinc foil laminated board can be assembled by making IAIII and it will take 4 hours.

Claims (1)

[Claims] t A fixed number of dried Grigreg T-Pk sheets are stacked on one material, one side of the quick-curing resin face or Wi4 facing KJ
I Heat and pressurize the head plate through lead foil or zinc foil with skin adhesive film to the end plate. II In the method of preparing lead foil laminates, zinc recess KM & meat O wear film As methylpentene poly! -Fill At-To use
'Method for manufacturing 41116 foil-covered laminates.