JPS58161950A - Airtightly welded body and welding method thereof - Google Patents

Airtightly welded body and welding method thereof

Info

Publication number
JPS58161950A
JPS58161950A JP4081582A JP4081582A JPS58161950A JP S58161950 A JPS58161950 A JP S58161950A JP 4081582 A JP4081582 A JP 4081582A JP 4081582 A JP4081582 A JP 4081582A JP S58161950 A JPS58161950 A JP S58161950A
Authority
JP
Japan
Prior art keywords
glass
metal frame
glass plate
frame
airtight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4081582A
Other languages
Japanese (ja)
Inventor
Hiromitsu Kawamura
河村 啓溢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4081582A priority Critical patent/JPS58161950A/en
Publication of JPS58161950A publication Critical patent/JPS58161950A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04Joining glass to metal by means of an interlayer
    • C03C27/042Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
    • C03C27/044Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of glass, glass-ceramic or ceramic material only

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Joining Of Glass To Other Materials (AREA)

Abstract

PURPOSE:To obtain an airtightly welded body of a glass plate and a metallic frame having high accuracy quality and reliability with a simple process at a low cost by welding the glass plate to the metallic frame through the glass wound layer formed to said frame then subjected the same to an annealing treatment. CONSTITUTION:A metallic frame 1 is subjected to a wet hydrogen treatment for about 10min at about 1,100 deg.C, whereafter the frame is oxidized for about 2min at about 1,000 deg.C. Glass powder of the same kind as a glass plat 3 or having the coefft. of thermal expansion roughly equal to the coefft. of thermal expansion of the frame 1 is coated on the required part of the frame 1 by using a suitable solvent and is dried. The frame is then heated in a furnace of about 900-1,000 deg.C to weld the glass thereto, whereby a glass-wound layer 2 is completed. The plate 3 is fixed to the layer 2 in contact therewith and is heated by induction heating at about 800-1,000 deg.C to weld said layer and plate to one body, whereafter the assembly is treated for about 5min at about 550 deg.C in an annealing furnace, whereby the airtightly welded body is obtained. It is possible to improve the adhesive strength by embedding the frame 1 into the plate 3 during welding.

Description

【発明の詳細な説明】 本発明は気密融着体およびその融着方法、特にディスプ
レイデバイス、半導体デバイス、を子w等の透明な窓を
有する気密封止のパッケージングに用いるガラス板と金
属枠との気密融着体およびそのM1方法に関する%Oで
ある。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an airtight fused body and a fusion bonding method thereof, particularly a glass plate and a metal frame used for airtight packaging with a transparent window for display devices, semiconductor devices, etc. %O for the hermetically fused body and its M1 method.

近部、ディスプレイデバイス、半導体デバイスO発展は
めざましく、外部からの光信号を入力したル、また内部
からの光信号を外部へ出力したシするために信頼性の高
い各種の透明な窓を有する気密封止構造のパッケージン
グの要求が強くなっている。とりわけ内部に収納する機
能1子割料も複H−4岐にわたり、各種の高信頼性パッ
ケージングが要求される。特に外界雰囲気、温度、湿度
など過酷な環境条件下においても内部素子が例等損傷し
ないためにも気密封止が絶対不可久の条件となってきた
In recent years, the development of display devices and semiconductor devices has been remarkable, and there is a growing trend to have various types of highly reliable transparent windows to input optical signals from the outside and to output optical signals from the inside to the outside. There is a growing demand for packaging with a hermetically sealed structure. In particular, the number of functional parts housed inside the product ranges from multiple H-4, and various types of highly reliable packaging are required. In particular, hermetic sealing has become an absolute necessity in order to prevent damage to internal elements even under harsh environmental conditions such as external atmosphere, temperature, and humidity.

これらの要求に対しては、無機シール方式が採用されて
いるが、一般に無機シールはシール時の温度が高温とカ
リ、内部に収納した素子や機能材料に温度による損傷を
与えてしまう。例えば固体撮像素子のカラー感光膜フィ
ルタとしてのゼラチン膜は約180℃で機能に損傷を島
える。また液晶表示素子がどの配向膜は300〜400
℃で損傷を与える。
In order to meet these demands, inorganic sealing methods have been adopted, but inorganic seals generally have high temperatures and potash during sealing, which can damage the elements and functional materials housed inside due to the temperature. For example, a gelatin film used as a color photoresist filter for a solid-state image pickup device becomes functionally damaged at about 180°C. Also, the alignment film of the liquid crystal display element has a molecular weight of 300 to 400.
damage at °C.

そこで第1図に固体撮像装置O!!部断面断面図で示す
如く、セラミックの容器1を形成し、この容器10内郁
に機能素子としての固体撮像素子2を収納して接着配置
し、一方、このセラミック容器1の開口部のガラス窓の
I!(以下ガラスキャップと称する)として、透光性ガ
ラスM13にセラミック枠4をブリットガラス5を介し
て融着し、このセラ、Zツク枠4の反対面にメタライズ
層Sを形威し、このメタライズ層・に金属枠Tを取シ付
は大カラスキャップ8を形成してこのガラスキャラ成し
九メタライズ層9とをろう材1oを介してろう付は壇た
祉溶接して封止する気密封止構造が採用されていた。
Therefore, Fig. 1 shows the solid-state imaging device O! ! As shown in the partial cross-sectional view, a ceramic container 1 is formed, and a solid-state image sensor 2 as a functional element is housed and bonded inside the container 10, while a glass window at the opening of the ceramic container 1 is sealed. I! (hereinafter referred to as a glass cap), a ceramic frame 4 is fused to a translucent glass M13 via a bullet glass 5, and a metallized layer S is formed on the opposite surface of this ceramic and Z-shaped frame 4. Attach the metal frame T to the layer and form a large crow cap 8, and then weld the metalized layer 9 and the glass layer 9 through the brazing filler metal 1o to seal the airtight seal. A stop structure was used.

しかしながら、このような封止構造によると、ガラスキ
ャップ8を製作する工程において、ガラx@3と*ラミ
ック枠体4とを7リツトSラス5で接着す為工程と、セ
ラミック枠4にメタライズ層6を形成する工程と、金属
枠Tをメタライズ層6に接着する工程とが必要と表るこ
とから、ガラスキャップ$の纒作工1!が複雑となル、
製造コストが極めて高価となる次点があった。
However, according to such a sealing structure, in the process of manufacturing the glass cap 8, there is a process for bonding the glass x@3 and the *ramic frame 4 with the 7-lit S lath 5, and a metallized layer is added to the ceramic frame 4. 6 and the step of bonding the metal frame T to the metallized layer 6 are required. is complicated,
There was a runner-up that was extremely expensive to manufacture.

このような欠点を改良したものとしては、第2図に要部
断面図で示すようにガラス板3と金属枠Tとを直接接着
する方法としてフリットガラス5を介在させる方法が提
案されているが、このよう々構成によると、金属枠Tと
フリットガラス5との接着は機械的強度が弱く、高信頼
性が得られないという欠点があった。塘た、ガラス板3
0周辺部 する方法は、ガラス@3の光透過有効面のIIKよる変
形や損傷がはげしく、技術的に不可能であった。
As a method for improving such drawbacks, a method has been proposed in which a frit glass 5 is interposed as a method for directly bonding the glass plate 3 and the metal frame T, as shown in a sectional view of the main part in FIG. According to such a structure, the mechanical strength of the bond between the metal frame T and the frit glass 5 is weak, and high reliability cannot be obtained. Tongta, glass plate 3
The method of removing the 0 peripheral portion was technically impossible because the light-transmitting effective surface of the glass@3 would be severely deformed and damaged by IIK.

し九がって本発明は、上記従来の欠点に鑑みてなされた
ものであシ、そO目的とするところは、気密融着体を製
作する工程を簡略化するとともに、精度1品質および信
頼性の高い気密融着体を低コストで実現可能にした気密
融着体およびその融着方法を提供する°ことにある。
Therefore, the present invention has been made in view of the above-mentioned drawbacks of the conventional art, and its purpose is to simplify the process of manufacturing an airtight fused body, and to improve accuracy, quality, and reliability. An object of the present invention is to provide an airtight fused body and a method for fusing the same, which make it possible to realize an airtight fused body with high properties at low cost.

以下図面を用いて本発明の1M!棒例を詳細に説明する
1M of the present invention using the drawings below! A bar example will be explained in detail.

第3図は本発明による気密融着体の一例を示すガラスキ
ャップの一例を示すl!s断面図である。
FIG. 3 shows an example of a glass cap showing an example of the airtight fused body according to the present invention. It is a s cross-sectional view.

同図において、ガラス板30周辺部には、ガラス1i3
と同材質または金属枠Tとほぼ同等の熱膨張係数を有す
るガラスからなるガラス巻き層11を介して金属枠Tが
固着配置されている。この気密融着体の製造方法は、ま
ず金属枠Tを予儒酸化処jl Lりi、この金属枠Tの
ガラス113を接着する部位に、このガラス1[3と同
材質のガラスを設置し、900〜1000℃て融着させ
てガラス巻き層を形成する。次にガラス板3とガラス巻
き層が形成され九金属枠Tとを高岡a!誘導加熱炉の中
にセットシ、高m*誘導加熱装置の出力をコントロール
して金属枠Tを800−1000℃O温度範囲に保持す
る。このようにしてガラス板30周辺部が金属枠IK被
接触せた状態で充分に接着は完成されるが、場合によっ
て拡ガラス飯3を固定した9、ガラスilBの陶辺部に
圧力を加えても差支えない。
In the figure, a glass 1i3 is provided around the glass plate 30.
The metal frame T is fixedly disposed through a glass wrapping layer 11 made of the same material as the metal frame T or glass having substantially the same coefficient of thermal expansion as the metal frame T. The manufacturing method of this airtight fused body is as follows: First, a metal frame T is subjected to pre-confucian oxidation treatment, and a glass made of the same material as this glass 1 [3 is installed in the part of this metal frame T where the glass 113 is to be bonded. , to form a glass-wound layer by fusing at 900 to 1000°C. Next, the glass plate 3 and the glass wrapping layer are formed and the metal frame T is attached to the Takaoka a! The metal frame T is set in an induction heating furnace and the output of the high m* induction heating device is controlled to maintain the metal frame T in the temperature range of 800-1000°C. In this way, the adhesion is fully completed with the peripheral part of the glass plate 30 in contact with the metal frame IK, but in some cases, when the expanded glass plate 3 is fixed 9, pressure is applied to the ceramic part of the glass plate IB. There is no problem.

こO場合、融着体嬬第411に要部拡大断面図で示すよ
うにいずれも金属枠1の一部がガラス板3に埋込まれる
形状とな)、強度の大きい接着力で融着される。引き続
き融着が完了した融着体は冷却過程でガラス巻き層11
に用いたガラス材の転移点近傍の温度で5〜lO分アニ
ール処理を施して完成される。
In this case, a part of the metal frame 1 is embedded in the glass plate 3 (as shown in the enlarged sectional view of the main part of the fused body No. 411), and is fused with a strong adhesive force. Ru. Subsequently, the fused body that has been fused is coated with a glass-wrapped layer 11 during the cooling process.
It is completed by annealing for 5 to 10 minutes at a temperature near the transition point of the glass material used in the process.

また、金属枠7のガラスli3と接着する部分の形状は
、第5図、@6図、第7図に示すように種々の形態が1
1!論可能であり、筒6図に示すように段付けした場合
や、第7図に示すようにガラス板3への突入方式にした
場合は特に接着強度を向上させることができる。また少
々くとも金属枠Tのガラス板3と接着する部分を50〜
400メツシユのサンドブラスト処理をして表面に凹凸
を設けることによって、接着面積の拡大と酸化の均一化
により、接着性をさらに向上させることができる。
Moreover, the shape of the part of the metal frame 7 that is bonded to the glass li3 has various shapes as shown in FIGS. 5, 6, and 7.
1! The adhesive strength can be particularly improved when the tube is stepped as shown in FIG. 6 or when it is plunged into the glass plate 3 as shown in FIG. Also, at least the part of the metal frame T that is to be glued to the glass plate 3 is 50~
By applying 400 mesh sandblasting to provide unevenness on the surface, the adhesion can be further improved by expanding the adhesion area and making oxidation uniform.

ま九高周波誘導加熱中は接着面以外の部分も赤く加熱さ
れるので、過剰酸化を防止するために不活性ガス中で作
業しても差支え表い。
During high-frequency induction heating, parts other than the adhesive surface are heated red, so it is okay to work in an inert gas to prevent excessive oxidation.

以下本発明を具体的実施例により詳細に説明する。The present invention will be explained in detail below using specific examples.

tず、縦横厚さが20−X 20 sw X 1−の硬
質ガラス板と、ガラス板の周辺11幅にコバール金属枠
の内枠が重々るように金属枠の寸法を調整する。そして
、この金属枠を約1100℃で約10分間のウェット水
素処理を行なった後、約1000℃て約29関0@化処
理を行なう。次に硬質ガラス板と同じガラス粕床を加工
し、適当なIIIK入れてスリップ状にして上記処理後
の金属枠の所定部分にハケ塗り法でガラス9末tw11
布し、乾燥させる。そして、このもOを900−100
0℃O炉中に約5分量大れてガラスを融着するいわゆる
ガラス巻きを完成する。次にガラス巻きが施された金属
枠に硬質ガラス板を接触固定し、出力的2KW。
First, the dimensions of the metal frame are adjusted so that the inner frame of the Kovar metal frame overlaps the 11 widths of the periphery of the hard glass plate with the length and width of 20 x 20 sw x 1 -. Then, this metal frame is subjected to wet hydrogen treatment at approximately 1100° C. for approximately 10 minutes, and then subjected to approximately 29% hydrogen treatment at approximately 1000° C. Next, process the same glass lees bed as the hard glass plate, put appropriate IIIK in it, make it into a slip form, apply glass powder TW11 to the designated part of the metal frame after the above treatment by brushing.
Wipe and dry. And this also O is 900-100
The so-called glass wrapping is completed by placing about 5 portions of glass in a 0°C O oven and fusing the glass. Next, a hard glass plate is fixed in contact with the glass-wrapped metal frame, resulting in an output of 2KW.

問波数約0・45M11!0高周波誘導加熱炉の中にセ
ットする。そして、出力を評整して金属枠を800〜1
000℃に加熱して金属枠と接着するガラス部分を溶か
して適度の圧力を与えて金属枠がガラス板の中に適当に
埋め込噛れるようにして融着させる。次に融着徒の組立
体を直ちにアニール炉内に導き、約550℃で約5分間
アニール処理しズガラスキャツプを完成させる。そして
、完成されたガラスキャップをΔt=90℃の冷水と熱
水との間を約30秒サイクルで10回繰り返したが、全
くクラックの発生もなく、ヘリウムディテクタによる気
密性テストでは全く気密であった。
Set it in a high frequency induction heating furnace with a wave number of approximately 0.45M11!0. Then, adjust the output and make the metal frame 800 to 1
The glass portion to be bonded to the metal frame is melted by heating to 000°C, and moderate pressure is applied to properly embed the metal frame into the glass plate and fuse the glass plate. Next, the fused assembly is immediately introduced into an annealing furnace and annealed at about 550° C. for about 5 minutes to complete the glass cap. Then, the completed glass cap was exposed to cold water and hot water at Δt=90°C 10 times in a cycle of about 30 seconds, but no cracks occurred, and an airtightness test using a helium detector showed that it was completely airtight. Ta.

実施例2 ガラス板の拐質を熱膨張係数α=63秒度の半硬質ガラ
ス板に、金属枠をト・−N142チ合金に変えて金属枠
の醒化処理を約1100℃で約10分間のウェット水素
処理後、約950℃で約5分間の空気中酸化処理とした
以外は全て実施例1と同じ方法テカラスキャップを製作
した。そして、このものも実施例1と全く同じく強度的
に充分強いものが得られた。
Example 2 The glass plate was replaced with a semi-hard glass plate with a coefficient of thermal expansion α = 63 seconds, the metal frame was replaced with a T-N142 alloy, and the metal frame was heated at about 1100°C for about 10 minutes. A Tekaras cap was manufactured in the same manner as in Example 1, except that after the wet hydrogen treatment, an oxidation treatment was performed in air at approximately 950° C. for approximately 5 minutes. This product also had sufficient strength as in Example 1.

なお、上記実施例においては、気密融着体として、固体
撮像装置のガラスキャップに適用した場合について説明
したが、本発明はこれに限定されるものではなく、ガラ
ス材と金属体とを融着させて構成される全ての融着体に
適用できることは勿論である。
In the above embodiment, the case where the airtightly fused body is applied to a glass cap of a solid-state imaging device has been described, but the present invention is not limited to this, and the present invention is not limited to this, but may be applied to a glass material and a metal body by fusion bonding. Needless to say, the present invention can be applied to all fused bodies constructed by the following methods.

以上説明したように本発明によれば、ガラス対と金属片
とからkるII雛な形状を有する気密融着体を、簡単な
製造工程で材料数も少なく、低コストでしかも高品質、
1Illi信頼性で得られるという極めて優れ良効果を
有する。
As explained above, according to the present invention, an airtight fused body having a typical shape made of a glass pair and a metal piece can be produced using a simple manufacturing process, using a small number of materials, at low cost, and with high quality.
It has an extremely excellent effect of achieving 1Illi reliability.

WAIjの簡単な説明 第1図は従来O固体V&像装置の一例を示す要部Ifi
Iii図、第2図は従来のガラス板と金属枠との気密融
着体の一例を示す要部断面図、第3図り第4図は本発明
による気v!i鵬着体の一例を示す要部断面図、その要
部拡大断面図、第5WAないし第7図は本発明による気
密融着体の他の実施例を示す要部断面図である。
Brief explanation of WAIj Figure 1 shows the main part Ifi of an example of a conventional solid-state V&image device.
FIG. A sectional view of a main part showing an example of a bonded body, an enlarged sectional view of the main part thereof, and FIGS. 5WA to 7 are sectional views of a main part showing other embodiments of an airtightly fused body according to the present invention.

3・・・・ガラス板、T・・・・金属枠、11・−・・
ガラス巻き層。
3...Glass plate, T...Metal frame, 11...
Glass wrapped layer.

第1図 3 第6図 1 第3図 第5図 第7図Figure 1 3 Figure 6 1 Figure 3 Figure 5 Figure 7

Claims (1)

【特許請求の範囲】 1 ガラス板と金属枠とからhる気密融着体において、
前記ガラス板と金属枠との接着部分に前記ガラス板と同
種のガラスまたは前記金属枠とはは同等の熱膨張係数を
有するガラスを介在させて融着一体化したことを特命と
する気密融着体。。 2、前記金属枠のガラスと接着する部分の金属を、ガラ
ス板に埋設したことを特徴とする特許請求の範囲第1項
記載の気密融着体。 3、前記金属枠のガラス板と接着する部分に、段部を設
けたことを特徴とする特許請求の範囲第1項記載の気密
融着体。 4、前記金属枠のガラスと接着する部分に、50〜40
0メツシユのサンドブラスト処理をして表面に凹凸を設
〃たことを特徴とする特許請求の範囲第1項、第2項ま
たは第3a記載の気密融着体。 5、ガラス板と金属枠とからなる気密融着体において、
前記金属枠をウェット水素処理後酸化処理する工程と、
前記金属粋のガラス板と接着する部分にガラスlI!l
き層を形成する工程と、前記ガラス板と前記金属枠Oガ
ラス**層とを接触させて高周波誘導加熱し融着一体化
する工程と、前記融着後アニール処理する工程とからな
ることを特命とした気!!融着体OII着方法。 1 前記金属枠とガラス板とを融着一体化する工程で適
度の圧力を加えて金属枠をガラス板に埋込むことを特徴
とする特許請求の範囲第5.lli記載の気密融着体の
融着方法。 7、前記高周波−導加熱を不活性舅ス雰日中で行なうこ
とを特徴とする特許請求の範囲第5項記載O気密融着体
の融着方法。
[Claims] 1. In an airtight fused body consisting of a glass plate and a metal frame,
Air-tight fusion, in which the glass plate and the metal frame are fused together by interposing a glass of the same type as the glass plate or a glass having a thermal expansion coefficient equivalent to that of the metal frame at the bonded part. body. . 2. The airtight fused body according to claim 1, wherein the metal of the portion of the metal frame that is bonded to the glass is embedded in the glass plate. 3. The airtight fused body according to claim 1, characterized in that a stepped portion is provided in a portion of the metal frame that is bonded to the glass plate. 4. 50 to 40
The airtight fused body according to claim 1, 2, or 3a, characterized in that the surface is roughened by sandblasting with zero mesh. 5. In an airtight fused body consisting of a glass plate and a metal frame,
a step of subjecting the metal frame to wet hydrogen treatment and then oxidation treatment;
Glass lI on the part that will be bonded to the metal glass plate! l
the glass plate and the metal frame O glass** layer are brought into contact and fused together by high-frequency induction heating, and the process is annealed after the fusion. I felt like it was a special mission! ! Fusion body OII bonding method. 1. Claim 5, characterized in that in the process of fusing and integrating the metal frame and the glass plate, the metal frame is embedded in the glass plate by applying an appropriate pressure. A method for fusing an airtightly fused body as described in lli. 7. The method of fusing an airtight welded body according to claim 5, characterized in that the high frequency induction heating is carried out in an inert atmosphere.
JP4081582A 1982-03-17 1982-03-17 Airtightly welded body and welding method thereof Pending JPS58161950A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4081582A JPS58161950A (en) 1982-03-17 1982-03-17 Airtightly welded body and welding method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4081582A JPS58161950A (en) 1982-03-17 1982-03-17 Airtightly welded body and welding method thereof

Publications (1)

Publication Number Publication Date
JPS58161950A true JPS58161950A (en) 1983-09-26

Family

ID=12591141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4081582A Pending JPS58161950A (en) 1982-03-17 1982-03-17 Airtightly welded body and welding method thereof

Country Status (1)

Country Link
JP (1) JPS58161950A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01150343A (en) * 1987-12-07 1989-06-13 Nec Corp Cap for chip carrier
WO2002100795A1 (en) * 2001-06-13 2002-12-19 Raytheon Company Lid with window hermetically sealed to frame, and a method of making it
KR100429756B1 (en) * 2001-08-04 2004-05-04 한국과학기술연구원 Glass to Metal Seals in Optoelectronic Device Package
US6908026B2 (en) 2001-11-06 2005-06-21 Raytheon Company Method and apparatus for making a lid with an optically transmissive window
US6988338B1 (en) 2002-10-10 2006-01-24 Raytheon Company Lid with a thermally protected window
JP2019169675A (en) * 2018-03-26 2019-10-03 京セラ株式会社 Ceramic circuit board, package, and electronic apparatus
JP2020017704A (en) * 2018-07-27 2020-01-30 京セラ株式会社 Ceramic circuit board, package, and electronic device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01150343A (en) * 1987-12-07 1989-06-13 Nec Corp Cap for chip carrier
WO2002100795A1 (en) * 2001-06-13 2002-12-19 Raytheon Company Lid with window hermetically sealed to frame, and a method of making it
US6974517B2 (en) 2001-06-13 2005-12-13 Raytheon Company Lid with window hermetically sealed to frame, and a method of making it
KR100429756B1 (en) * 2001-08-04 2004-05-04 한국과학기술연구원 Glass to Metal Seals in Optoelectronic Device Package
US6908026B2 (en) 2001-11-06 2005-06-21 Raytheon Company Method and apparatus for making a lid with an optically transmissive window
US6988338B1 (en) 2002-10-10 2006-01-24 Raytheon Company Lid with a thermally protected window
JP2019169675A (en) * 2018-03-26 2019-10-03 京セラ株式会社 Ceramic circuit board, package, and electronic apparatus
JP2020017704A (en) * 2018-07-27 2020-01-30 京セラ株式会社 Ceramic circuit board, package, and electronic device

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