JPS58160350A - Production of polyimide resin compound - Google Patents
Production of polyimide resin compoundInfo
- Publication number
- JPS58160350A JPS58160350A JP4194582A JP4194582A JPS58160350A JP S58160350 A JPS58160350 A JP S58160350A JP 4194582 A JP4194582 A JP 4194582A JP 4194582 A JP4194582 A JP 4194582A JP S58160350 A JPS58160350 A JP S58160350A
- Authority
- JP
- Japan
- Prior art keywords
- polyimide resin
- resin compound
- compound
- molding
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001721 polyimide Polymers 0.000 title claims abstract description 18
- 239000009719 polyimide resin Substances 0.000 title claims abstract description 17
- 150000001875 compounds Chemical class 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 238000000748 compression moulding Methods 0.000 claims abstract description 6
- 239000011256 inorganic filler Substances 0.000 claims description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 6
- 238000010298 pulverizing process Methods 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 claims description 2
- 239000010419 fine particle Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims 1
- 239000003365 glass fiber Substances 0.000 abstract description 7
- 238000001746 injection moulding Methods 0.000 abstract description 5
- 230000006835 compression Effects 0.000 abstract description 4
- 239000000945 filler Substances 0.000 abstract 3
- 239000000843 powder Substances 0.000 abstract 2
- 238000007493 shaping process Methods 0.000 abstract 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 4
- 229920003192 poly(bis maleimide) Polymers 0.000 description 4
- 238000007906 compression Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 2
- 239000008116 calcium stearate Substances 0.000 description 2
- 235000013539 calcium stearate Nutrition 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（発明の技術分野）
本発明はポリイミド系樹脂コンパウンドの製造方法に関
する。DETAILED DESCRIPTION OF THE INVENTION (Technical Field of the Invention) The present invention relates to a method for producing a polyimide resin compound.
（発明の技術的背景とその問題点）
近年ポリアミノビスマレイミド樹脂等のポリイミド系樹
脂から成る成形品はその優れた耐熱性のために種々の分
野で使用が期待されている。(Technical background of the invention and its problems) In recent years, molded products made of polyimide resins such as polyamino bismaleimide resins are expected to be used in various fields because of their excellent heat resistance.
しかしながらこれらの樹脂に無機質充填剤特にガラス繊
維を多量に配合した成形品を製造することは非常に困難
であった。However, it has been extremely difficult to manufacture molded articles containing a large amount of inorganic filler, particularly glass fiber, mixed with these resins.
すなわちポリアミノビスマレイミド樹脂等のポリイミド
系樹脂と無機質充填剤との混練は通常ヒートロール機で
行なわれているが、ガラス繊維等の配合が多くなると混
練が難しいため材料ロスが多く製造歩留りが非常に悪か
ったのである。In other words, kneading of polyimide resin such as polyamino bismaleimide resin and inorganic filler is usually done using a heat roll machine, but when a large amount of glass fiber etc. is added, kneading becomes difficult, resulting in a lot of material loss and very low production yield. It was bad.
（発明の目的）
本発明はこのような無機質充填剤の多量に配合されたも
のであっても容易にかつ歩留の向上したポリイミド系樹
脂コンパウンドを製造することを目的とする。(Object of the Invention) The object of the present invention is to easily produce a polyimide resin compound with improved yield even when a large amount of such an inorganic filler is blended.
（発明の概要）
すなわち本発明のコンパウンドの製造は、ポリイミド系
樹脂と無機質充填剤とを主成分とするドライブレンド物
をいったん加熱して任意の形状に成形し、これを粉砕あ
るいは細粒化したことを特徴とするものである。(Summary of the Invention) In other words, the compound of the present invention is produced by heating a dry blend mainly composed of a polyimide resin and an inorganic filler, molding it into an arbitrary shape, and then pulverizing or pulverizing it into fine particles. It is characterized by this.
本発明に使用するポリイミド系樹脂としては、ロース、
ブーラン社製のＫＩＮＢＬ−１０００、ＫＥＲ，ＩＭＩ
Ｄ−６０１、東芝ケミカル社製のイミダロイＫＩＲ−
１０等のポリアミノビスマレイミド樹脂があげられる。The polyimide resin used in the present invention includes loin,
KINBL-1000, KER, IMI manufactured by Boulan
D-601, Imidalloy KIR- manufactured by Toshiba Chemical Company
Examples include polyamino bismaleimide resins such as No. 10.
本発明に使用する無機質充填剤としてはガラス繊維、ガ
ーボン繊維、グラファイト、四三酸化鉄等があげられる
。この無機質充填剤の配合量は５０〜７５ＰＨＲの範囲
で用途に応じて適宜選定する。Examples of the inorganic filler used in the present invention include glass fiber, garbon fiber, graphite, and triiron tetroxide. The blending amount of this inorganic filler is appropriately selected in the range of 50 to 75 PHR depending on the application.
本発明においてＦｉｔずポリイミド系樹脂と無機質充填
剤とをトライブレンドするわけであるが、このときステ
アリン酸カルシウム、ステアリン酸亜鉛等の滑剤を添加
して行なうのが望筐しい。トライブレンドの方法は押出
機または射出成形機のホッパーに攪拌装置等全取付け、
この混合用ホッパーにポリイミド系樹脂と無機質充填剤
とを入れて攪拌混合する方法がある。つづいてこのトラ
イブレンド物をその−１：′１ひも状に押出成形して粉
砕すれば圧縮成形用の粉状のコンパウンドが得られ、ペ
レタイザーでベレット状にすれば射出成形用のコンパウ
ンドが得られる。なお押出温度は１２０〜１４０℃が好
１〔７い。また押出機は２軸スクリユ一式が好ましい。In the present invention, the polyimide resin and the inorganic filler are triblended, and at this time it is desirable to add a lubricant such as calcium stearate or zinc stearate. The tri-blend method involves installing a stirring device and all other equipment in the hopper of an extruder or injection molding machine.
There is a method in which a polyimide resin and an inorganic filler are placed in this mixing hopper and mixed by stirring. Next, by extruding this triblend into a -1:'1 string shape and crushing it, a powdery compound for compression molding can be obtained, and by making it into a pellet shape with a pelletizer, a compound for injection molding can be obtained. . Note that the extrusion temperature is preferably 120 to 140°C. Further, the extruder is preferably a twin-screw set.
あるいはトライブレンドをヘンシェルミキサー等で行な
ってから押出機で押出す場合は、トライブレンド物を空
気輸送等の手段により押出機の栓用特殊ホッパーまで輸
送する必要がある。Alternatively, if the triblend is performed using a Henschel mixer or the like and then extruded using an extruder, the triblend must be transported to a special hopper for the stopper of the extruder by means such as pneumatic transportation.
本発明においては特に多量のガラス繊維を配合したコン
パウンドを製造するにはトライブレンド物を圧縮成形に
て任意の形状に成形することが望ましい。このときの条
件は金型温度８０〜１１０℃、圧縮ゲージ圧力３５０−
４００ Ｋｆ／ｃｄ、焼時間４〜６分が適切である。こ
の条件をけずれる七、例えば金型温度１１０℃以上で２
〜３分の短時間で焼くと金型に樹脂がくっつき作業性が
悪くなる。In the present invention, especially in order to produce a compound containing a large amount of glass fiber, it is desirable to mold the triblend into an arbitrary shape by compression molding. The conditions at this time are mold temperature 80-110℃, compression gauge pressure 350-
400 Kf/cd and baking time of 4 to 6 minutes are appropriate. If this condition is violated, for example, if the mold temperature is 110℃ or higher,
If you bake for a short time of ~3 minutes, the resin will stick to the mold, making workability worse.
また８０℃以下では外面だけは固するが、成形品の中央
部１で熱が伝わらず、粉状の′！１であるため好ましく
ない。焼時間を１０〜２０分の長時間かつ１１０℃以上
の高温にすると完全に硬化してし１い最終の成形が困難
になる。このように予備圧縮成形してブロック状にした
ものをハンマー等で砕いて顆粒状にすれば圧縮成形用ま
たは射出成形用のコンパウンドが得られる。Also, at temperatures below 80°C, only the outer surface becomes hard, but the heat is not transferred to the center part 1 of the molded product, resulting in a powdery '! 1, which is not preferable. If the baking time is as long as 10 to 20 minutes and the temperature is higher than 110°C, it will be completely hardened and final molding will be difficult. A compound for compression molding or injection molding can be obtained by crushing the pre-compression molded blocks into granules with a hammer or the like.
（発明の実施例） 次に本発明の実施例について説明する。(Example of the invention) Next, examples of the present invention will be described.
実施例
ポリアミノビスマレイミド樹脂（イミダロイＫＩＲ−１
０）２５重量部とガラス繊維７５重量部とステアリン酸
カルシウム１重量部と金へ／シェルミキサーでトライブ
レンドし、このブレンド物を金型に入れ、金型温度１０
０℃、圧縮ゲージ圧力４００ Ｋｇ／ｉ、焼時間５分の
条件で予備圧縮成形し、直径１００■、長さ４０ｗａの
円柱状のブロックを得た。これをハンマーで粉砕して顆
粒状にし、成形用のコンパウンドを製造した。Example polyamino bismaleimide resin (Imidalloy KIR-1
0) Tri-blend 25 parts by weight, 75 parts by weight of glass fiber, 1 part by weight of calcium stearate and gold using a shell mixer, put this blend into a mold, and mold at a temperature of 10
Preliminary compression molding was carried out under the conditions of 0° C., compression gauge pressure of 400 Kg/i, and baking time of 5 minutes to obtain a cylindrical block with a diameter of 100 cm and a length of 40 wa. This was ground into granules with a hammer to produce a molding compound.
このようにして得られるコンパウンドの歩留は８０〜９
５チと良好であった。これを射出成形機に投入して所定
形状のポリイミド系樹脂の成形品を製造した。このよう
にして得られる成形品はガラス繊維の分散が良く、外観
の優れたものであった。The yield of the compound thus obtained is 80-9
It was a good score of 5. This was put into an injection molding machine to produce a polyimide resin molded product in a predetermined shape. The molded product thus obtained had good dispersion of glass fibers and an excellent appearance.
（発明の効果）
以上の実施例からもあきらかなように、本発明方法によ
れば、無機質充填剤の配合量が多くても歩留りの良好な
成形用ポリイミド系樹脂コンパウンドが得られる。(Effects of the Invention) As is clear from the above examples, according to the method of the present invention, a polyimide resin compound for molding with a good yield can be obtained even if the amount of inorganic filler is large.
Claims (1)
トライブレンド物をいったん加熱して任意の形状に成形
し、これを粉砕あるいは細粒化したことを特徴とするポ
リイミド系樹脂コンパウンドの製造方法。 ２、任意の形状の成形は８０〜１１０℃の圧縮成形にて
行なわれる特許請求の範囲第１項記載のポリイミド系樹
脂コンパウンドの製造方法。 ６、任意の形状の成形は押出成形にて行なわれる特許請
求の範囲第１項記載のポリイミド系樹脂コンパウンドの
製造方法。[Scope of Claims] 1. A polyimide characterized by heating a tri-blend material mainly consisting of a polyimide resin and an inorganic filler, molding it into an arbitrary shape, and pulverizing or pulverizing it into fine particles. A method for producing a resin compound. 2. The method for producing a polyimide resin compound according to claim 1, wherein the molding into an arbitrary shape is performed by compression molding at 80 to 110°C. 6. The method for producing a polyimide resin compound according to claim 1, wherein the desired shape is formed by extrusion molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4194582A JPS58160350A (en) | 1982-03-17 | 1982-03-17 | Production of polyimide resin compound |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4194582A JPS58160350A (en) | 1982-03-17 | 1982-03-17 | Production of polyimide resin compound |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58160350A true JPS58160350A (en) | 1983-09-22 |
Family
ID=12622344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4194582A Pending JPS58160350A (en) | 1982-03-17 | 1982-03-17 | Production of polyimide resin compound |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58160350A (en) |
-
1982
- 1982-03-17 JP JP4194582A patent/JPS58160350A/en active Pending
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