JPS58159767U

JPS58159767U - wiring board

Info

Publication number: JPS58159767U
Application number: JP5721582U
Authority: JP
Inventors: 伊藤　友久
Original assignee: パイオニア株式会社
Priority date: 1982-04-20
Filing date: 1982-04-20
Publication date: 1983-10-25

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図ａ、　　ｂは、従来例による部品を仮固定した配
線板を示す断面図、第２図は、本考案の実施例を示す断
面図で、ａはリードレス部品及びリード付き部品を仮固
定した配線板、ｂは、他の実施例によるリードレス部品
を仮固定した配線板、Ｃ９ｄ、　　ｅはそれぞれリード
付き部品を仮固定する配線板の異なる実施例を示す図で
ある。１・・・・・・リードレス部品、１ａ・・間電極、２・
・間配線板、２ａ、　　２ｂ・・・・・・ベース、３・
・・・・・導電箔、４４・・・・・・半田、５・・・・
・・仮固定用接着剤、５ａ・・・・・・クリーム半田、
６・・・・・・リード付き部品、６ａ・・・・・・リー
ド線、・６ｂ・・・・・・屈曲部、６Ｃ・・・・・・導
電性硬磁性体、６ｄ・・・・・・半田メッキ、７ａ・・
・・・・穴、７ｂ・・曲スルーホール、８・・・・・・
硬磁性体、９・・・・・・軟磁性体、９ａ・・・・・・
軟鉄（軟磁性体）、９ｂ・・・・・・絶縁性軟磁性体、
９Ｃ・・・・・・軟磁性体、１０・・・・・・絶縁層、
１０ａ・・・・・・ホーロー。Figures 1a and 1b are cross-sectional views showing a wiring board on which conventional components are temporarily fixed, and Figure 2 is a cross-sectional view showing an embodiment of the present invention. C9d and C9e are diagrams showing a fixed wiring board, C9d and C9e respectively showing different embodiments of wiring boards to which leadless components are temporarily fixed, and C9d and C9e, respectively, to which leadless components according to other embodiments are temporarily fixed. 1...Leadless component, 1a...Interelectrode, 2...
・Interval wiring board, 2a, 2b...Base, 3・
...Conductive foil, 44...Solder, 5...
...Temporary fixing adhesive, 5a...Cream solder,
6... Parts with leads, 6a... Lead wire, 6b... Bent portion, 6C... Conductive hard magnetic material, 6d...・Solder plating, 7a...
...Hole, 7b...Track through hole, 8...
Hard magnetic material, 9... Soft magnetic material, 9a...
Soft iron (soft magnetic material), 9b...Insulating soft magnetic material,
9C... Soft magnetic material, 10... Insulating layer,
10a... Enamel.

Claims

[Scope of utility model registration request]

The hard magnetic material magnetized by using either a component having a soft magnetic material for a wiring board having a hard magnetic material, or a component having a hard magnetic material for a wiring board having a soft magnetic material. A wiring board, characterized in that the component is temporarily fixed to the wiring board by a magnetic attraction force generated between the component and the soft magnetic material on the other side.