JPS58159514A - Formation of laser beam space distribution - Google Patents

Formation of laser beam space distribution

Info

Publication number
JPS58159514A
JPS58159514A JP57041754A JP4175482A JPS58159514A JP S58159514 A JPS58159514 A JP S58159514A JP 57041754 A JP57041754 A JP 57041754A JP 4175482 A JP4175482 A JP 4175482A JP S58159514 A JPS58159514 A JP S58159514A
Authority
JP
Japan
Prior art keywords
laser
light
laser beam
incidence
optical fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57041754A
Other languages
Japanese (ja)
Inventor
Ken Ishikawa
憲 石川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP57041754A priority Critical patent/JPS58159514A/en
Publication of JPS58159514A publication Critical patent/JPS58159514A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides

Abstract

PURPOSE:To obtain the space distribution of a laser beam suitable for various kinds of work, by guiding >=2 kinds of laser light having different properties to an optica lfiber at different angles of incidence and distributing projected light coaxially. CONSTITUTION:Laser beams 2 and 4 which are emitted from laser oscillators 1 and 3 and have different properties are deflected by reflecting mirrors 5 and 6 perpendicularly to travel in parallel and then condensed by a condenser 7 to the incidence terminal 11 of a composite optical fiber 10. At this time, the condensed light 9 of laser light 4 has a large-incidence-angle component removed by a light shielding plate 12 having a semicircular opening and is made incident to the incidence terminal 11 together with the condensed light 8 of laser light 2. The projected light consists of a large-diameter circular beam 13 originating from the laser beam 2 and a small-diameter circular beam 14 which overlaps with the former beam coaxially and originates from the laser beam 4, 1 thus obtaining the space distribution of the laser beam suitable for various kinds of work.

Description

【発明の詳細な説明】 〔発明の技術分骨〕 この発明は性質の異なるレーザ光を組合せて同心的に空
間分布を形成する方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Substances of the Invention] The present invention relates to a method for forming a concentric spatial distribution by combining laser beams with different properties.

〔発明の技術的背景およびその問題截〕レーザによる溶
接、切断、穴あけ等の金属加工には金属を溶づ)シ、ま
た蒸発させる二ネルギ密変の得られるパルスレーザが適
用されるが、たとえば溶接加工では容接部に亀裂の光束
する現象がみられろ。また、連続発儂レーザでは上記の
ような商工ネルギ1g度のエネルギが得られにくいため
、主として焼入れ等の熱処理加工に適用されている。
[Technical Background of the Invention and Problems Therewith] Pulsed lasers are used for metal processing such as welding, cutting, and drilling using lasers, which can melt and evaporate metals. During the welding process, a phenomenon in which cracks radiate can be seen in the welded parts. Further, since it is difficult to obtain the above-mentioned 1g degree of commercial energy with a continuous emitting laser, it is mainly applied to heat treatment processes such as hardening.

これらの3属加工用のレーデビーム1はその空間の強変
分佑によって加工性能が変るが、その制御技術は複雑で
ある。ところで、1/−ザビームの空間的な分布特性は
レーザ発振器の種類、性能にtって定まる。ンーザ拮振
器から放出された同作の分布を多数の集光レンズもしく
け集光反射鏡を用論て変えビーム強変の調節が行われて
いるが、複雑な光学系の機構になり実用上問題がちる。
The processing performance of the radar beam 1 for processing these three metals changes depending on the strong variation in its space, but its control technology is complex. By the way, the spatial distribution characteristics of the 1/- laser beam are determined by the type and performance of the laser oscillator. The intensity of the beam is adjusted by changing the distribution of the beam emitted from the oscillator by using a large number of condensing lenses and a condensing reflector, but this requires a complicated optical system and is not practical. There are some problems.

レーザビームを熱加工に適用するに当って、特性の異な
る各種のレーザビームを同軸的に合成して照射すること
で、溶接、切断、熱処理等を良好に行えることが考えら
れるが、容易に実現することができなかった。
When applying laser beams to thermal processing, it is conceivable that welding, cutting, heat treatment, etc. can be performed efficiently by coaxially combining various laser beams with different characteristics and irradiating them, but this is not easy to achieve. I couldn't do it.

〔発明の目的〕[Purpose of the invention]

この発明は連続レーザ、パルスレーザ、波長ノ異なるレ
ーザなどの性質の異なるレーザを合成し所望する分布に
して各種の加工に適するレーザビームの空間分布方法を
提供する。
The present invention provides a method for spatially distributing laser beams by combining lasers with different properties such as continuous lasers, pulsed lasers, and lasers with different wavelengths and creating a desired distribution suitable for various types of processing.

〔発明の概要〕[Summary of the invention]

性質の異なる二種以上のV−デ光を入射角度を異ならし
めて光ファイバに導き、それらのレーザ光を同軸的に分
布させるようにしたものである。
Two or more types of V-de lights with different properties are guided into an optical fiber with different incident angles, and the laser lights are coaxially distributed.

〔発明の寿確例〕[Example of longevity of invention]

第1図はこの発明の第1の実施例で(1)は連続レーザ
ビーム(2)を放出する第1のレーザ発1G5.+3)
はパフレスレーザビーム(4)を放出する第2のレーザ
発振器である。上記二つのレーザビームはそれぞれ反射
傭・5)・(6)で直角に偏向され両ビームの光束端を
ゲいに接して並行に進むようになっている。
FIG. 1 shows a first embodiment of the present invention, in which (1) shows a first laser beam 1G5 that emits a continuous laser beam (2). +3)
is a second laser oscillator that emits a puffless laser beam (4). The two laser beams mentioned above are deflected at right angles by reflections 5) and (6), respectively, so that the ends of the beams of both beams touch the beam and travel in parallel.

(力は集光レンズで、その中心が上記二つのレーデビー
ム!2) pf4)の境界と一致する位置に設けられ、
二つの集束光・8) = (9)にして合成光ファイバ
ー[1Gの入射端(1υに1に角に向かわせている。こ
こで、パルスレーザビーム(4)の集束光19)の入射
角の大きな成分を入射端(1υに入射する前に、半円形
開口を形成した遮光板t12で除去し、残りの部分集束
光・9)を連続レーザ光12)のm 卑ffi +8)
とともに入射端0υに入射させている。
(The force is a condensing lens, the center of which is located at a position that coincides with the boundary of the two radar beams!2) pf4),
Two focused beams 8) = (9) and combine the optical fiber [1G's input end (1υ is oriented at an angle of 1. Here, the incident angle of the focused beam 19 of the pulsed laser beam (4)) Before entering the incident end (1υ), a large component is removed by a light shielding plate t12 having a semicircular opening, and the remaining partially focused light 9) is converted into continuous laser light 12) m ffi +8)
The light is also incident on the incident end 0υ.

上記のように光ファイバー・IGに導入された集束光8
)・9)ツバ光ファイバー+1の出射・喘(1υより出
射すると第2図(a)・(b)のように、パルスレーザ
ビーム(4)が艶していると外は、出力パワーの小さい
連続レーデビーム12)による直径の大きな円形ビーム
(]31とこの円形ビーム+13)の中央l(同軸に重
畳され出力パワーの大きなパルスレーデビーム+4)に
よる小径の円形ビーム(1沿のパターン分布になる。こ
のよう’l中央461パルスレーザビームとパルスレー
ザビームとが重畳してエネルギ密・妃の高くなった性質
をもち、周辺部が連続レーザビームの性質になるレーザ
出力を溶接加工に適用すると、常時連続レーザビームで
常時予熱状憧にされた微小頭域の中心部にパルス的に高
エネルギ密度の照射ができる哨3図はこの発明の第2の
犬梅列で、集光レンズ(力の軸と光ファイバー111の
軸とを相対的に角度(al)頌けることにより、たとえ
ば北記東束光(8)を集束光・9)よりも小さな入射角
肥で入射端0υに入射させると、出射端a2からは第1
図(a)および(b)に示すように連続レーザビーム(
2)の成分をもつ円形ビーム(1つとこのビームラ同軸
に囲うパルスレーザ(4)の成分をもつ環状ビーム(l
からなる)くターン分布に形成される。このようなパタ
ーンをもったレーザは半田付加工に好適である。
Focused light 8 introduced into the optical fiber/IG as described above
)・9) Tsuba Optical Fiber +1 Output (When emitted from 1υ, as shown in Figure 2 (a) and (b), when the pulsed laser beam (4) is shiny, the output power is continuous and small. A small diameter circular beam (1) is formed by a large diameter circular beam (] 31 and this circular beam +13) formed by the Rede beam 12) and a small diameter circular beam (1) formed by the center l (coaxially superimposed pulsed Rede beam +4 with a large output power). When welding is applied to a laser output where the central 461-pulse laser beam and the pulsed laser beam are superimposed and have a property of high energy density and high intensity, and the peripheral part has the property of a continuous laser beam, it is possible to constantly Figure 3 shows the second Inume row of this invention, which can irradiate the center of the tiny head region that is constantly preheated with a continuous laser beam in a pulsed manner. By considering the angle (al) relative to the axis of the optical fiber 111 and the axis of the optical fiber 111, for example, if the Kitaki Higashifuku light (8) is made to enter the input end 0υ with a smaller angle of incidence than the focused light 9), the output will be From end a2, the first
As shown in Figures (a) and (b), the continuous laser beam (
A circular beam (1) with components of 2) and an annular beam (1) with a component of a pulsed laser (4) coaxially surrounding this beam
) is formed in a multi-turn distribution. A laser with such a pattern is suitable for soldering processing.

第5図は上記第2の実施例における角度(のを逆の方向
に角度(θ)傾けた第3の実施例で、・クターン分布は
第2の実施例とは逆のパターン分布、すなわち、第6図
(al t(b)に示すようにパルスレーザ(4)の成
分をもつ円形ビーム(′I′rIとこのビームを同軸に
囲う連続レーザビーム(2)の成分をもつ環状ビーム(
曙からなる分布になる。
FIG. 5 shows a third embodiment in which the angle (θ) in the second embodiment is tilted in the opposite direction, and the Coutane distribution is a pattern distribution opposite to that of the second embodiment, that is, As shown in Fig. 6(alt(b)), a circular beam ('I'rI) having a component of a pulsed laser (4) and an annular beam ('I'rI) having a component of a continuous laser beam (2) coaxially surrounding this beam (
The distribution consists of Akebono.

第7図はこの発明の第4の実施例で、一方の)くルスレ
ーザビーム(4)を集光レンズ(21)で集光しその光
軸を合成光ファイバーα値の軸線に一致させて入射し、
他方の連続レーザビーム(2)を集光レンズρ漕により
別な光ファイバー04に一端導入し、その出力ビーム(
四をりl)−レンズ(至)によって、合成ファイバー(
24へlJeパルスレーザビーム(4)より大きい入射
角度で入射させる。このような方法により、上記第2も
しくは第3の実施例と同様に二種のレーザビームが同軸
的に分布するパターン、すなわち、中央にパルスレーザ
ビーム(4)の成分をもつ円形ビーム1:)19とこの
周囲に連続レーデビーム(2)の成分をもつ環状ビーム
(2)からなるパターンが合成光ファイバー+11より
出射する。
FIG. 7 shows a fourth embodiment of the present invention, in which one of the cursor laser beams (4) is focused by a condenser lens (21), and its optical axis is aligned with the axis of the α value of the composite optical fiber. death,
The other continuous laser beam (2) is introduced at one end into another optical fiber 04 using a condensing lens ρ, and its output beam (
Synthetic fiber (
24 at a larger incident angle than the lJe pulse laser beam (4). With this method, a pattern in which two types of laser beams are coaxially distributed as in the second or third embodiment, that is, a circular beam 1 with a pulsed laser beam (4) component in the center is created. A pattern consisting of an annular beam (2) having a component of a continuous radar beam (2) around the annular beam 19 is emitted from the composite optical fiber +11.

なお、本発明は2種類のビームをパルスレーザビームと
連続レーザビームとしたが、これに限らず、パルスI@
のf互に億なろレーザでも、また連続で七カパワーの異
なるレーザでも、またν互に発振波長のことなる1ノ−
ザでも適用できることは明らかである。その用途として
は溶接目的以外に切断、熱処理などの加工目的以外、医
用などにも利用でき、2種のレーザを加工的エネルギー
利用の他に少なくとも一方を可視レーザ光に利用し化学
反応促進用や他方のレーザビームの照射照準用に利用す
ることができる。
Note that in the present invention, the two types of beams are a pulsed laser beam and a continuous laser beam, but the invention is not limited to this, and the pulsed I@
f lasers with different oscillation wavelengths, or continuous lasers with seven powers different from each other, or v lasers with different oscillation wavelengths.
It is clear that it can also be applied to It can be used for purposes other than welding, cutting, heat treatment, and other processing purposes, as well as for medical purposes.In addition to using two types of lasers for processing energy, at least one of them is used for visible laser light to promote chemical reactions. It can be used for aiming the irradiation of the other laser beam.

〔発明の効果〕〔Effect of the invention〕

中心部がパルスレーザの成分でその周辺部が連続レーザ
ビームの成分1(なる分布あるいはその逆の分布等レー
ザによる切断、溶接、穴あけ、熱処理、半田付は等の踵
々の加工に適した分布が容易に得られるようになった。
The center part is the pulsed laser beam component and the peripheral part is the continuous laser beam component 1 (distribution or vice versa).A distribution suitable for laser cutting, welding, drilling, heat treatment, soldering, etc. is now easily obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図1 @ 3 :q j第5図および第7図はこの
発明の第1の実施例乃至第4の実施例を説明するための
模式図、第2図(a)?(b)、第4図(a) −(b
)および第6 II (a)・rb)はそれぞれ第17
77至第3の実施例で得ら九たレーザビームのパターン
分布図である。 (1)・・連続レーザ発振器、(2)・・・パルスレー
ザ発振器、!+n・・・渠光レンズ、・、IQ・・・合
成光ファイバー。 第1図 /! 策2図     策4霞
Fig. 1 1 @ 3 :q j Figs. 5 and 7 are schematic diagrams for explaining the first to fourth embodiments of the present invention, and Fig. 2 (a)? (b), Figure 4 (a) - (b)
) and 6th II (a) and rb) are respectively 17th
FIG. 77 is a pattern distribution diagram of a laser beam obtained in the third example. (1)...Continuous laser oscillator, (2)...Pulse laser oscillator,! +n...Double optical lens, IQ...Synthetic optical fiber. Figure 1/! Plan 2 Plan 4 Haze

Claims (1)

【特許請求の範囲】[Claims] 少なくとも二つのレーザ発振器から互いに性質の異なる
レーザビームを放出せしめ、これらレーザビームを互い
に異なる入射角度で光ファイバに入力し、この光ファイ
バの出力端から径の異なる円形ビームが同心的に重畳す
る分布もしくは円形ビームの周辺に環状ビームが同心的
に接する分布に出力することを特徴とするレーザビーム
空間分布形成方法。
A distribution in which at least two laser oscillators emit laser beams with different properties, these laser beams are input into an optical fiber at different incident angles, and circular beams with different diameters are concentrically superimposed from the output end of the optical fiber. Alternatively, a laser beam spatial distribution forming method is characterized in that an annular beam is output in a distribution concentrically touching the periphery of a circular beam.
JP57041754A 1982-03-18 1982-03-18 Formation of laser beam space distribution Pending JPS58159514A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57041754A JPS58159514A (en) 1982-03-18 1982-03-18 Formation of laser beam space distribution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57041754A JPS58159514A (en) 1982-03-18 1982-03-18 Formation of laser beam space distribution

Publications (1)

Publication Number Publication Date
JPS58159514A true JPS58159514A (en) 1983-09-21

Family

ID=12617201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57041754A Pending JPS58159514A (en) 1982-03-18 1982-03-18 Formation of laser beam space distribution

Country Status (1)

Country Link
JP (1) JPS58159514A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0201306A2 (en) * 1985-05-08 1986-12-17 Lambda Photometrics Limited Apparatus for providing uniform exposure at an exposing station
JP2000208794A (en) * 1999-01-19 2000-07-28 Fuji Electric Co Ltd Method of laser patterning pattern-shaped thin film of thin-film solar cell or the like
JP2002111022A (en) * 2000-09-27 2002-04-12 Mitsubishi Heavy Ind Ltd Solar battery module and its manufacturing method
JP2011023408A (en) * 2009-07-13 2011-02-03 Miyachi Technos Corp Laser device, and method of adjusting laser light
WO2012053045A1 (en) * 2010-10-18 2012-04-26 新日本製鐵株式会社 Laser apparatus and laser processing apparatus provided with same
CN110087817A (en) * 2016-12-08 2019-08-02 可利雷斯股份有限公司 Laser process equipment and method
JP2020511634A (en) * 2017-02-28 2020-04-16 サントル ナシオナル ドゥ ラ ルシェルシェ シアンティフィクCentre National De La Recherche Scientifique Laser light source for emitting pulses
WO2020167588A1 (en) * 2019-02-13 2020-08-20 Coherent, Inc. Laser welding method
WO2020241138A1 (en) * 2019-05-29 2020-12-03 パナソニックIpマネジメント株式会社 Laser machining device and laser machining method using same
JP2021514854A (en) * 2019-02-01 2021-06-17 レーザーセル カンパニー リミテッド Multi-beam laser debonding equipment and methods
US11524361B2 (en) 2020-05-22 2022-12-13 Coherent, Inc. Laser welding method
US11850679B2 (en) 2017-12-29 2023-12-26 Corelase Oy Laser processing apparatus and method

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0201306A2 (en) * 1985-05-08 1986-12-17 Lambda Photometrics Limited Apparatus for providing uniform exposure at an exposing station
EP0201306A3 (en) * 1985-05-08 1989-06-28 Lambda Photometrics Limited Apparatus for providing uniform exposure at an exposing station
JP2000208794A (en) * 1999-01-19 2000-07-28 Fuji Electric Co Ltd Method of laser patterning pattern-shaped thin film of thin-film solar cell or the like
JP2002111022A (en) * 2000-09-27 2002-04-12 Mitsubishi Heavy Ind Ltd Solar battery module and its manufacturing method
JP2011023408A (en) * 2009-07-13 2011-02-03 Miyachi Technos Corp Laser device, and method of adjusting laser light
CN103155308A (en) * 2010-10-18 2013-06-12 新日铁住金株式会社 Laser apparatus and laser processing apparatus provided with same
US9172202B2 (en) 2010-10-18 2015-10-27 Nippon Steel & Sumitomo Metal Corporation Laser apparatus and laser materials processing apparatus provided with same
WO2012053045A1 (en) * 2010-10-18 2012-04-26 新日本製鐵株式会社 Laser apparatus and laser processing apparatus provided with same
US11022747B2 (en) 2016-12-08 2021-06-01 Corelase Oy Laser processing apparatus and method
CN110087817A (en) * 2016-12-08 2019-08-02 可利雷斯股份有限公司 Laser process equipment and method
EP3551372A4 (en) * 2016-12-08 2020-09-09 Corelase OY Laser processing apparatus and method
TWI758365B (en) * 2016-12-08 2022-03-21 芬蘭商可利雷斯股份有限公司 Laser processing apparatus and method
JP2020511634A (en) * 2017-02-28 2020-04-16 サントル ナシオナル ドゥ ラ ルシェルシェ シアンティフィクCentre National De La Recherche Scientifique Laser light source for emitting pulses
US11850679B2 (en) 2017-12-29 2023-12-26 Corelase Oy Laser processing apparatus and method
EP3919218A4 (en) * 2019-02-01 2022-05-11 Laserssel Co., Ltd Multibeam laser debonding device and method
JP2021514854A (en) * 2019-02-01 2021-06-17 レーザーセル カンパニー リミテッド Multi-beam laser debonding equipment and methods
US11699676B2 (en) 2019-02-01 2023-07-11 Laserssel Co., Ltd. Multi-beam laser de-bonding apparatus and method thereof
CN113423531A (en) * 2019-02-13 2021-09-21 相干公司 Laser welding method
US11389894B2 (en) 2019-02-13 2022-07-19 Coherent, Inc. Laser welding method
CN113423531B (en) * 2019-02-13 2023-09-05 相干公司 laser welding method
WO2020167588A1 (en) * 2019-02-13 2020-08-20 Coherent, Inc. Laser welding method
JPWO2020241138A1 (en) * 2019-05-29 2020-12-03
WO2020241138A1 (en) * 2019-05-29 2020-12-03 パナソニックIpマネジメント株式会社 Laser machining device and laser machining method using same
US11524361B2 (en) 2020-05-22 2022-12-13 Coherent, Inc. Laser welding method

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