JPS58158531A - Temperature sensor - Google Patents
Temperature sensorInfo
- Publication number
- JPS58158531A JPS58158531A JP4020782A JP4020782A JPS58158531A JP S58158531 A JPS58158531 A JP S58158531A JP 4020782 A JP4020782 A JP 4020782A JP 4020782 A JP4020782 A JP 4020782A JP S58158531 A JPS58158531 A JP S58158531A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sensing element
- temperature sensor
- cap
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は金属製キャップ内に感温素子及びそのリード線
を配置し、前記キャップ内で感温素子及びそのリード線
が埋入される様に樹脂モールドしてなる温度センサーの
製造法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a temperature sensing device in which a temperature sensing element and its lead wires are disposed within a metal cap, and resin molded so that the temperature sensing element and its lead wires are embedded within the cap. This relates to a method of manufacturing a sensor.
従来のこの型の温度センサーの製造法においては、あら
かじめ金属製のキャップ内に、感温素子及びそのリード
線を配置しておき前記キャップに樹脂をインジェクショ
ンモールドすることにより前記（１）
キャップと感温素子及びそのリード線部を一体成型化し
ていた。しかしこの方法釦依ると、樹脂をキャップにイ
ンジェクションモールドする時、その射出圧力により感
温素子のリード線が金属製キャップに接触してしまった
υ、又モールド成形後モールド樹脂の収縮により、その
樹脂体とキャップとの間にわずかな隙間が形成され、そ
の隙間に沿って水分が侵入し、その水分が更にリード線
に沿ってリード線端子まで達し遂にはキャップと端子間
の絶縁劣化をもたらすこともある。In the conventional manufacturing method of this type of temperature sensor, the temperature sensing element and its lead wires are placed in advance in a metal cap, and resin is injection molded into the cap, thereby achieving the above-mentioned (1) cap and sensor. The thermal element and its lead wire were integrally molded. However, with this method, when resin is injection molded into the cap, the lead wire of the temperature sensing element comes into contact with the metal cap due to the injection pressure, and the shrinkage of the molded resin after molding causes the resin to A slight gap is formed between the body and the cap, moisture enters along this gap, and the moisture further reaches the lead wire terminal along the lead wire, eventually causing insulation deterioration between the cap and the terminal. There is also.
この様な製造方法は、温度センサーとしての信頼性を著
しく低下させるばかりでなく、その用途を制約するので
好ましくない。Such a manufacturing method is not preferable because it not only significantly lowers the reliability as a temperature sensor but also restricts its use.
本発明の目的は、このような欠点をなくし絶縁特性、耐
水性に優れたセンサー製造法を提供することである。An object of the present invention is to eliminate such drawbacks and provide a method for manufacturing a sensor with excellent insulation properties and water resistance.
この目的は、感温素子及びそのリード線部をあらかじめ
樹脂モールドして一体化しておくことによって達成され
る。This objective is achieved by molding the temperature sensing element and its lead wire portion in advance into one body.
以下図面により、本発明を更に詳細に説明する第１図は
本発明の一実施例を示す縦断面図である。第２図は一体
化されたモールド樹脂体３を示す縦断面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be explained in more detail with reference to the drawings below. FIG. 1 is a longitudinal sectional view showing one embodiment of the present invention. FIG. 2 is a longitudinal sectional view showing the integrated molded resin body 3.
温度センサーは金属製の例えば、黄銅、鉄等のキャップ
１をベースとして構成されている。The temperature sensor is constructed based on a cap 1 made of metal, such as brass or iron.
サーミスタ等からなる感温素子４には、リード線５が接
続されさらにリード線５には、端子６が接続されている
。前記のサーミスタ等感温素子４とリード線５と端子６
は、金属製キャップ１に埋入される前に、あらかじめ樹
脂例えばナイロンレジン等で樹脂モールドして一体化し
ておき、モールド樹脂体６を形成しておく。A lead wire 5 is connected to a temperature sensing element 4 such as a thermistor, and a terminal 6 is connected to the lead wire 5. The temperature sensing element 4 such as the thermistor, the lead wire 5 and the terminal 6
Before being embedded in the metal cap 1, the molded resin body 6 is formed by integrally molding the resin with a resin such as nylon resin in advance.
上記モールド樹脂体６を金属製キャップ１の内に配置す
ることによって出来る金属製キャップ１と樹脂モールド
体６との隙間には樹脂モールド６と同様の樹脂例えばナ
イロンレジン等をインジェクションモールドする。A resin similar to that of the resin mold 6, such as nylon resin, is injection molded into the gap between the metal cap 1 and the resin mold body 6, which is created by placing the mold resin body 6 inside the metal cap 1.
この様に金属製キャンプ１に樹脂をインジェクションモ
ールドする前にあらかじめサーミスタ等感温素子４、リ
ード線５及び端子６を樹脂モールドで一体化しておくこ
とにより、たとえ金属製キャップ１とモールド樹脂体６
との間に形成される隙間から水分が侵入してもその水分
がサーミスタ等の感温素子４やリード線５に到達するの
を防ぐことが出来、又リード線５が金属製キャップ１に
接触するという事態を避けることが出来る。In this way, by integrating the temperature sensing element 4 such as a thermistor, the lead wire 5 and the terminal 6 with the resin mold before injection molding the resin into the metal cap 1, even if the metal cap 1 and the molded resin body 6
Even if moisture infiltrates through the gap formed between This situation can be avoided.
従って、本発明によればモールド時のリード線とキャッ
プとの接触とか水分の侵入による絶縁劣化といった様な
不都合の無い、従って高信頼性の温度センサーを提供す
ることが出来る。Therefore, according to the present invention, it is possible to provide a highly reliable temperature sensor that is free from inconveniences such as contact between the lead wire and the cap during molding and insulation deterioration due to moisture intrusion.
第１図は本発明による温度センサの断面図である。第２
図は第１図の６の部分の詳細な縦断面図である。
１は金属製キャップ、２はモールド樹脂、３はサーミス
タ、等の感温素子４、リード線５、端子６をモールド樹
脂で一体化したものである。
特許出願人 株式会社芝浦電子製作所臂１ （２）
茅２図
手 続 補 正 書（力へ）
特許庁長官 若 杉 和 夫 殿
１ 事件の表示 昭和５７年特許願第４０２０７号６
、補正をする者
事件との関係 特許出願人
住所（居所） 埼玉県浦和市大字町谷５２０番地４ 補
市命令の日付 昭和５７年６月２９日５ 補正の対象
明細書の発明の名ｉ６補正の内容
明細書１頁第２行「発明の名称」ヲ「発明の名称 温度
センサ」と補正する。
１７９−FIG. 1 is a cross-sectional view of a temperature sensor according to the present invention. Second
The figure is a detailed longitudinal sectional view of the portion 6 in FIG. 1. 1 is a metal cap, 2 is a molded resin, and 3 is a thermistor or other temperature sensing element 4, a lead wire 5, and a terminal 6 integrated with a molded resin. Patent Applicant Shibaura Electronics Manufacturing Co., Ltd. 1 (2) Kaya 2 Proceedings Amendment (To Power) Commissioner of the Patent Office Kazuo Wakasugi 1 Indication of Case Patent Application No. 40207 of 1982
, Relationship to the case of the person making the amendment Patent applicant address (residence) 520-4 Machiya, Urawa City, Saitama Prefecture Date of supplementary city order June 29, 1980 5 Subject of amendment Name of the invention in the specification of the i6 amendment On page 1 of the description of contents, line 2, "Title of the invention" is amended to "Title of the invention: Temperature sensor." 179-
Claims (1)
、前記キャップ内で感温素子及びリード線が埋入される
ようにした温度センサに於いて、感温素子、リード線及
び端子を樹脂モールドで一体化し、後に、前記の金属製
キャップ内に配置して更にモールディングを行うことを
特徴とした温度センサ。In a temperature sensor in which a temperature-sensing element and its lead wires are arranged in a metal cap, and the temperature-sensing element and its lead wires are embedded in the cap, the temperature-sensing element, lead wires, and terminals are made of resin. A temperature sensor characterized in that it is integrated by molding, and is later placed inside the metal cap and further molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4020782A JPS58158531A (en) | 1982-03-16 | 1982-03-16 | Temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4020782A JPS58158531A (en) | 1982-03-16 | 1982-03-16 | Temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58158531A true JPS58158531A (en) | 1983-09-20 |
Family
ID=12574328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4020782A Pending JPS58158531A (en) | 1982-03-16 | 1982-03-16 | Temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58158531A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7410294B2 (en) * | 2003-06-25 | 2008-08-12 | Tdk Corporation | Temperature sensor |
| DE19942723B4 (en) * | 1999-09-08 | 2008-10-30 | Stiebel Eltron Gmbh & Co. Kg | Sensor device for water-bearing devices |
| CN109477744A (en) * | 2016-07-07 | 2019-03-15 | 恩德斯+豪斯流量技术股份有限公司 | For manufacturing the method and sensor that are used to the sensor of the hot-fluid flowmeter measured to the mass flow of the medium in measurement pipe |
-
1982
- 1982-03-16 JP JP4020782A patent/JPS58158531A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19942723B4 (en) * | 1999-09-08 | 2008-10-30 | Stiebel Eltron Gmbh & Co. Kg | Sensor device for water-bearing devices |
| US7410294B2 (en) * | 2003-06-25 | 2008-08-12 | Tdk Corporation | Temperature sensor |
| CN109477744A (en) * | 2016-07-07 | 2019-03-15 | 恩德斯+豪斯流量技术股份有限公司 | For manufacturing the method and sensor that are used to the sensor of the hot-fluid flowmeter measured to the mass flow of the medium in measurement pipe |
| US11248941B2 (en) | 2016-07-07 | 2022-02-15 | Endress+Hauser Flowtec Ag | Method for manufacturing a sensor of a thermal, flow measuring device for measuring mass flow of a medium in a measuring tube |
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