WO2005001404A1 - Temperature sensor - Google Patents

Temperature sensor Download PDF

Info

Publication number
WO2005001404A1
WO2005001404A1 PCT/JP2004/008752 JP2004008752W WO2005001404A1 WO 2005001404 A1 WO2005001404 A1 WO 2005001404A1 JP 2004008752 W JP2004008752 W JP 2004008752W WO 2005001404 A1 WO2005001404 A1 WO 2005001404A1
Authority
WO
WIPO (PCT)
Prior art keywords
portion
holder
temperature sensor
resin
temperature
Prior art date
Application number
PCT/JP2004/008752
Other languages
French (fr)
Japanese (ja)
Inventor
Satoru Shiraki
Kaoru Sasaki
Yutaka Wakabayashi
Original Assignee
Tdk Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2003-181598 priority Critical
Priority to JP2003181598A priority patent/JP4041018B2/en
Priority to JP2003-188511 priority
Priority to JP2003188511A priority patent/JP2005024344A/en
Application filed by Tdk Corporation filed Critical Tdk Corporation
Publication of WO2005001404A1 publication Critical patent/WO2005001404A1/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14Supports; Fastening devices; Mounting thermometers in particular locations
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08Protective devices, e.g. casings

Abstract

A temperature sensor with a reduced number of parts. In a temperature sensor (10), an entire opening portion (14) of a holder (12) is covered by a cap portion (44A) of a sensor cover (44), so that water drops etc. are prevented from entering between the holder (12) and a filled resin portion (42). Further, wire breakage in a harness pair (34A, 34B) caused by excessive bending is restricted by a neck portion (44B) of the sensor cover (44). The cap portion (44A) and the neck portion (44B) are both part of the sensor cover (44) and are integrated together. In the temperature sensor (10) with such a sensor cover (44), the number of parts is less than that of a temperature sensor (50) where a cap and a lead-wire lead-out member are separate bodies.

Description

Specification

Temperature sensor

Technical field

[0001] The present invention relates to a temperature sensor you detect the oil temperature, such as ATF (Automatic Transmission Fluid) of a motor vehicle.

BACKGROUND

[0002] Temperature sensors in the field of this technology, for example, disclosed in Patent Document 1 and Patent Document 2 and the like. In the temperature sensor according to these publications, the bottomed cylindrical holder made of brass glass Futomesa one thermistor (temperature detecting element) is accommodated has a resin is filled, the water to the temperature detecting element portion preventing intrusion are achieved. The temperature detecting element of these temperature sensors, each one end of the pair of lead wires are connected, the other end is connected to the electrode pairs extending to the outside of the resin. Then, this electrode pair, a pair of lead wires for transmitting the signal detected by the temperature detecting element to control processor is connected.

[0003] invention have found that the electrode pairs possibility of short circuit is a high part proceeded research on unnecessary temperature sensor, to complete the prototype of the temperature sensor 50 as shown in FIG. 15. Figure 15 is a schematic sectional view showing a temperature sensor prototype (None known). As shown in Figure 15, the temperature sensor 50 is made of metal bottomed cylindrical bottom pair of lead wire 54A of the holder 52, 54B are arranged temperature detecting element 56 connected, the resin 58 is filled into the holder 52. Resin 58 filled in the holder 52 forms a cylindrical side wall 62 at the opening 60 side of the holder 52. In the constructed side walls 62 resin are formed holes 64 which leads through the lead wire 54A drawn out from the resin 58, the 54B is bent, drawn to the outside through the hole 64 .

[0004] On the outside of the hole 64 formed in the side wall 62, lead pull-out member 66 a part of which is mounted so as to circle Tan sidewall 62 is mounted. The lead wire pull-out member 66 is a cylindrical elastic body, the lead wire 54A in the vicinity of the hole 64, thereby suppressing excessive bending of 54B. Such lead wire pull-out member 66, the lead wire 54A, in part 54B is issued pulled to the outside, in the vicinity of the lead wire 54A, the hole 64 54B is greatly bent portion easily, leads 54A, 54B is 90 situation that results in breakage by bending close time is prevented.

[0005] Inside of the side wall 62 formed by the resin 58, the resin 68 is filled so leads 54A, 54B are Tan設. Thus, the resin 58 and the lead wire 54A, the interface strength between 54B, avoidance of al of water ingress, the leads 54A, is fixed and protection of 54B are achieved. Further, the waterproof cap 70 is covered so as to cover the resin 68 and the side wall 62. The waterproof key Yap 70, by covering the temperature sensor upper that is exposed to the environment for receiving water droplets or water vapor, is avoided in state that water drops reach the border of the members to a temperature detecting element 56 enters inside the sensor 50 It is achieved. Reference numeral 72 is insert molded to the resin 58, a suppressing metal stearate scratch its movement and supports the leads from below, reference numeral 74 is a lead wire 54A, 54B may be damaged by the metal stearyl one 72 a protective tube to prevent the situation.

[0006] Patent Document 1: JP-A-11 one 23379 JP

Patent Document 2: Real No. 5 - 3955 JP

Patent Document 3: JP 2002 - 267540 discloses

Patent Document 4: Real Unexamined 6 62336 JP

Patent Document 5: JP-8 - 128,901 JP

Disclosure of the Invention

Problems that the Invention is to you'll solve

[0007] and force, while, in the temperature sensor prototype stage mentioned above, that are present the following problems. That had constructed because the material of the lead wire pull-out member 66 and the waterproof cap 70 is different from the temperature sensor 50 as separate members. Thereby, it inhibited decrease cutting the number of parts, was also inhibited simplification of the manufacturing process accordingly.

[0008] The present invention has been made to solve the problems described above, and an object thereof is to provide a temperature sensor which reduces the number of parts is reduced.

Means for Solving the Problems

[0009] Temperature sensor according to the present invention, the temperature of the bottomed cylindrical holder having an opening, the lead line pair is connected to be introduced from the open mouth portion, housed in the bottom of the holder a detection element, while being filled in the holder so as to seal the temperature sensing element, and extending buildings filled resin portion to the opening, and a cap portion which covers the entire opening, a lead wire pair drawn from the cap portion a neck portion extending outwardly of the cap portion along the outer peripheral surface, characterized in that it comprises a sensor cover that has become over body.

[0010] In this temperature sensor, the cap portion of the sensor cover the entire opening of the holder is covered, preventing the situation where water drops from entering is achieved between the holder and the filling resin portion. Further, the neck portion of the sensor cover, disconnection of the lead wire due to excessive bending is prevented. Such a cap section and the neck are both a part of Sensakaba one, it is integrated. In such a temperature sensor which sensor cover is employed, such a cap and a lead wire pull-out member is the number of parts is reduced as compared with the temperature sensor of the prototype stage it is separate.

[0011] In addition, projecting from the edge of the opening of the holder, further includes a guide portion for guiding the respective lead wires constituting the lead line pair, the sensor cover, better good that covers the guide portion Les,. In this case, since the sensor cover to limit the movement of the lead wire pair of the peripheral guide portion, the guide portion can be more reliably guided leads.

[0012] Further, the shape of the guide portion is a τ-shape having a portion extending in a direction perpendicular to the extending direction of the holder, and a portion extending parallel to the extending direction of the holder it is good Masui. In this case, the portion extending in a direction perpendicular to the extending direction of the holder, dropping Sen Sakaba is suppressed.

[0013] Also, the edge of the opening of the holder, return of the substantially annular projecting outward of the holder is formed, at least a portion of the sensor cover, that is engaged by the return part but good better record,. In this case, it is possible to suppress falling from the holder of the sensor cover.

[0014] Also, the sensor cover is preferably formed by a hot melt molding. In this case, this a force S to reliably form the sensor cover a hot-melt molding is a molding method suitable for practical use.

[0015] In addition, provided with a sensing portion immersed in the fluid in a temperature-measured object case, the sensing unit, the temperature detecting element lead wire pair is connected has been accommodated, this temperature detection element it is preferably covered only by the element protection unit made of a resin. Oite this temperature sensor, the temperature sensing element lead wire pair is connected is accommodated in the sensing unit. The temperature detecting element and its is covered only by the element protection unit made of a resin. That is, the temperature sensor holder having conductivity not used, since the situation in which the temperature sensing element and the lead wire pair makes contact with the conductor does not occur, the stabilization of the temperature detection signal of the sensor is achieved. Accordingly, at this temperature sensor is different from the conventional temperature sensor metallic holder to the temperature detecting element is accommodated, and a temperature detecting element and the lead wire pair and the conductor upon receiving a temperature sensing element into the holder for it is not necessary to consider the insulation, making the work of the sensor is simplified and efficiency of manufacturing operations can be achieved. Further, since the molding does not use the metallic holder is difficult, with ease of sensors produced is achieved, reduced parts products manufacturing cost can be reduced.

[0016] Further, the element protection unit preferably has a layered structure with the resin of the heterologous or homologous. In this case, can be selected as needed, the side of the resin coating the resin and the temperature sensing element on the side immersed in the fluid directly.

[0017] The holder is made of resin, the element protection unit is preferably configured in the holder and the filled resin portion filled in the holder. The conventional temperature sensor you use a metallic holder, put that watertightness low Les between the filling resin portion is filled into the holder and the holder, but the resin in this way the plastic holder when filled, the water tightness between the holder and the filled resin portion is improved.

[0018] Further, the element protection unit preferably contains Porifue two sulfide resin as a constituent material. This resin has a high thermal conductivity, it does not interfere with the temperature detection level of the temperature detecting element. The resin has high fluidity, it is possible to perform also the type shape a complex resin formed shape with high accuracy.

Effect of the invention

According to [0019] the present invention, the temperature sensor reduce the number of parts is reduced is provided.

BRIEF DESCRIPTION OF THE DRAWINGS

[0020] FIG 1 is a schematic perspective view showing a temperature sensor according to an embodiment of the present invention.

FIG. 2 is a II II line cross-sectional view of a temperature sensor shown in FIG.

FIG. 3 is a III III line sectional view of the temperature sensor shown in FIG.

FIG. 4 is Ru schematic perspective view der showing the different temperature sensors of the temperature sensor shown in FIG. FIG. 5 is a sectional view showing a V- V direction in FIG. 4.

FIG. 6 is a sectional view showing a VI- VI direction of FIG.

[7] FIG. 7 is a diagram illustrating a thermistor is accommodated in the temperature sensor of FIG.

Garden 8] FIG. 8 is a perspective view showing a primary molded article of the temperature sensor of FIG.

[9] FIG. 9 is a IX- IX line sectional view of FIG.

[10] FIG 10 is a X- X-ray side view of FIG.

[11] FIG 11 is a diagram showing a state of applying the temperature sensor of FIG. 4 to the automatic transmission. Garden 12] FIG 12 is a diagram showing a type of the stationary side of the mold temperature sensor of FIG.

[13] FIG. 13 is a sectional view showing a XIII- XIII direction in FIG. 12.

[14] FIG 14 is a diagram illustrating a process of performing the secondary molding.

Garden 15] FIG 15 is a schematic sectional view showing a prototype of the temperature sensor.

DESCRIPTION OF SYMBOLS

10, 50, 101 temperature sensor

12 holder

12a, 121 sensing unit

12c closure

14 opening

16 return part

18 guide portion

18a, part of 18b guide portion

32, 110 Thermistor

34A, 34B harness

42 filled resin portion

43, 120 element protection unit

44 sensor cover

44A cap portion

44B neck

112, 113 best mode for carrying out the leads invention

[0022] Hereinafter, will be described in detail preferred embodiments of a temperature sensor according to the present invention with reference to the accompanying drawings. The same symbols are given to the same or equivalent elements, when the description is duplicated description thereof is omitted.

[0023] FIG. 1 is a schematic perspective view showing a temperature sensor according to an embodiment of the present invention. Figure 2 is a sectional view taken along line II-II of a temperature sensor shown in FIG. 3, the temperature sensor shown in FIG. 1 I

II is an III line sectional view.

[0024] Temperature sensor 10 according to the embodiment of the present invention shown in FIG. 1 one 3, plugged into an automobile automatic transmission (Automatic Transmission), a temperature sensor for detecting the ATF temperature in the transmission. The temperature sensor 10 has a Porifue two sulfide (PPS) bottomed cylindrical holder 12 made of resin. The PPS resin has high fluidity, the holder 12 of the high accuracy can be obtained. The holder 12, the diameter of the bottom side 12a is lower side is thin summer, the bottom side 12a is immersed in ATF in the automatic transmission casing is temperature-measured object (case), the temperature sensor 10 It has become of the sensing unit 12a. The upper end side 12b of the holder 12 opening 14 is formed. Opening 14 has a circular shape, barbs 16 are formed at the edges. The return portion 16 projects so as to extend in a direction perpendicular to the side wall of the holder 12, which is substantially annular. Also, the edge of the opening 14, T-shaped guide portion 18 is formed into a flat row in the extending direction of the holder 12. The guide portion 18, the edge of the opening 14 and projecting from the Yan Migihitsuji, Haiti Ness pairs 34A to be described later between the edge of the guide portion 18 and the opening 14, 34B is guided.

[0025] Furthermore, the upper end 12b of the holder 12, the sensor fixing section 20 which extends projecting in a direction perpendicular to the side wall of the holder 12 is formed. The free end 20a of the sensor fixing section 20, a through hole 22 in a direction parallel to the extending direction of the holder 12 is formed, the temperature sensor 10 through the through hole 22 by a screw 23 having a predetermined size setting target object 24 (i.e., the case of automatic transmission) and are fixed. Incidentally, the side wall of the through hole 22 is cylindrical metal pipes 26 are 揷設, rigidity against the screw 23 of the through hole 22 is enhanced. Further, in the vicinity of the center of the side wall of the holder 12 tightly closed part 12c to prevent leakage of the ATF to the setting target object 24 outside it is formed. The sealing unit 12c includes an annular recess 28 formed along the outer periphery of the holder 12, and a sealing ring 3 0 made of resin having elasticity is fitted in the recess 28. The setting target object 24 as described above is bored small again hole 24a than the outer diameter of the sealing ring 30, when inserting the holder 12 into the hole 24a, the setting target object 24 is reliably by the sealing ring 30 It is sealed.

[0026] inside of the sensing unit 12a diameter is thin summer is, - 40 ° C 150 ° NTC for detecting the ATF temperature in the range of C (Negative Temperature Coefficient) thermistor 32 is disposed. Here, PPS resin constituting the outer shell of the sensing portion 12a is preferable in that thermal conductivity does not interfere with the temperature detection level of the high tool thermistor 32. The thermistor (temperature detecting element) 32, for example, manganese, nickel, is formed from cobalt, has a polycrystalline ceramic gathered grain of so-called Ru spinel structure. Also, thermistor 32, with hermetically sealed glass waterproofing is achieved, a pair of harness pairs overturned the respective crosslinked polyethylene (read line pairs) 34A, so as to be introduced from 34B force the opening 14 It is connected. A pair of harness 34A, a pair of wires 36A pulled out from the pair of conductors 35A, 35 B and the thermistor 32 through the interior 34B, and 36B, respectively joined band 3 8A, are seamed by caulking by 38B. Reference numeral 39 shown in FIGS. 2 and 3, the fluorine resin tube covering the wire 36A (e.g., Teflon (registered trademark) tube), and is intended to prevent a short circuit due to contact of the wires with each other.

[0027] Harness pairs 34A, 34B one end of a state force the other end that is connected to the thermistor 32 is bundled with a protective tube 40 made of drawn crosslinked polyolefin from the temperature sensor 10 as described above, the thermistor It is connected to the control processor for processing the detected temperature detection signal (not shown) by 32. Control processor for the temperature detection signal has been received, Motodzure to that signal, it controls the shift timing of an automatic transmission or the like Te.

[0028] above-mentioned thermistor 32 and a harness pair 34A, 34B, the epoxy resin is housed in a state of being filled up to the vicinity of the open mouth portion 14 of the upper end side 12b of the holder 12, filled resin portion the resin is thermally cured 42 is formed. The filling resin portion 42, opening portion 14 and the harness pair 34A, 34B forces the holder 12, with the water from entering the al thermistor 32 is suppressed, the movement of the thermistor 32 can be suppressed. This way a holder 12 for accommodating the filling resin portion 42 covering the thermistor 32 a filling resin portion 42, the element protection unit 43 to the water seal covering the thermistor 32 is formed. Incidentally, the harness pair 34A, 34B is fixed so as to be parallel in the resin filled in the extending direction of the holder 12, it is substantially vertically erected in the vicinity of the surface 42a of the filling resin portion 42.

[0029] Harness pair 34A extending substantially perpendicularly from the surface 42a of the filling resin portion 42, 34B are substantially perpendicular bend in the direction of the guide portion 18 described above predicate. The harness pair 34A, 34B, of the guide portion 18, each harness 34A by parallel extending portion 18a with respect to the extending direction of the holder 12 is divided into 34B, with respect to the extending direction of the holder 12 It is guided as passed between the edge portion 18b and the opening 14 extending in the vertical direction Te. Note that when the harness 34A, 34B guide the by the guide portion 18, harness 34A by a portion 18b of the guide portion 18, the 34B is pressed from above, by the frictional force caused by the pressing harness 34A, 34B move is suppressed Rutotomoni, harnesses 34A, de drop of Honoreda 12 Chikarara of 34B is prevented.

[0030] The opening 14 of the holder 12, to cover the entire opening 14, sensor cover (lead wire lead-out portion) 44 is formed. The sensor cover 44 has been formed by Hottome Noreto molding of polyester, and a cap portion 44A and a neck portion 44B (see FIG. 2). Cap portion 44A is from the edge of the opening 14 to the surface 42a the center of the filling resin portion 42 covers not all over, have a height extent of the harness pair 34A, 34B and the guide portion 18 is covered. Such cap portion 44A functions as a portion to prevent a situation in which water drops from entering between the holder 12 and the filling resin portion 42. That is, in general of the temperature sensor is applied to an automatic transmission of an automobile, a portion located outside of the transmission that the entire opening 14 is covered by the force cap portion 44A which is exposed to the environment for receiving water droplets or steam in, entering the interior temperature sensor 10 of the water drops is prevented.

[0031] Also, the sensor cover 44 covers the guide portion 18 is restricted guide portion 18 around the harness 34A, 34B movement of the guide portion 18 is more reliably harnesses 34A, 34B can and a guide child . Here, in general, the harness drawn position of the temperature sensor is limited by the arrangement relationship with other parts in the layout that the automatic transmission is arranged. Tokoro force hot melt molding, because it is possible to change the variable even more easily harness drawn out position of the mold, the temperature sensor 10, the layout variations further be of an automatic transmission for each vehicle type, variant of Hottomenoreto mold it can be even more easily accommodated. Furthermore, of the guide portion 18, a resin that surrounds the portion 18b extending in a direction perpendicular to the extending direction of the holder 12, since the movement in the extending direction of the holder 12 of Sensakaba one 44 is suppressed, the sensor can cover 44 can be more reliably prevented a situation you fall off.

[0032] The neck portion 44B, as well has been issued can pull in a direction perpendicular to the extending direction of the holder 12 from the cap portion 44A, the harness pair 34A, 34B and the harness pair 34A, the protective tube Ru bundled 34B 40 and it extends outwardly of the cap portion 44A along the outer peripheral surface of the. The network click portion 44B has elasticity since it is made of polyester as described above. Harness such values ​​click portion 44B is harness pair 34A in the vicinity of a portion drawn from the temperature sensor 10, 34B functions as situation suppressing portion to increase bending, accompanied by the neck portion 44B to the bending of the over-degree pairs 34A, and disconnection of 34B is prevented les, Ru.

[0033] sensor cover 44, which is formed by a hot melt molding as mentioned above, that it is possible easily and reliably resin mold the entire opening 14 in the low temperature and pressure, the resin during molding is flowable, it is possible to reliably pour the polyester barb 16 bottom of the gap provided in the edge of the opening 14. Such barbs 16 resin portion solidified crowded flow at the bottom of the air gap, the return portion 16 in cooperation with, and suppressed from falling off from the holder 12 of the sensor cover 44. That is, the sensor cover 44 is a Rukoto engaged with barbs 16, from falling out of the holder 12 is suppressed.

[0034] As described above in detail, in the temperature sensor 10, and the cap 44A is a portion to prevent the water drops from entering between the sensor cover 44 force Hol da 12 a filling resin portion 42, harness pair 34A in the vicinity of a portion drawn from the temperature sensor 10, 34 B has a neck portion 44B is situation suppressing portion to increase bending. In such a cap portion 44A and the neck portion 44B is temperature sensor 10 for sensor cover 44 is employed which is integrated in the cap portion and the lead wire drawer (neck portion) and is separate Der Ru prototype stage parts as compared to the temperature sensor 50 (see FIG. 15) is reduced.

[0035] Here, in the temperature sensor 50 of the prototype stage, and the resin 58 to be filled with therein metallic holder 52, the physical properties (e.g., thermal conductivity), mechanical properties (e.g., catcher's modulus) was very different. Accordingly, the rapid change of temperature and internal stress or the like, between the holder 52 and the resin 58 Ease gap is formed Katsuta. The watertight property is lowered between the holder 52 and the resin 58 Te cowpea in the formed gap, when water drops sometimes as entering from this gap, a situation where the temperature detection level of the sensor is reduced occur Shimare ,, in the worst case, it becomes undetectable by an electrical short circuit.

[0036] On the other hand, at a temperature sensor 10 that holder 12 made of PPS resin is employed, differences in physical properties and mechanical properties of the holder 12 and the filling resin portion 42 is negligible. Therefore, as compared with the temperature sensor 50 of the prototype stage, the holder 12 and a gap is less likely to occur between the filling resin portion 42, improving the water tightness between the holder 12 and the filling resin portion 42 is achieved. Accordingly, the temperature detection level of the thermistor 32 is stable in the temperature sensor 10. Moreover, C, as compared to the combination of H and resin and metal formed polymer with O, because of its high adhesiveness toward between the resins, also from this point, is also employed metallic holder 52 were compared to the temperature sensor 50, the temperature sensor 10 is considered to improve the water tightness between the holder 12 and the filling resin portion 42 is achieved.

[0037] Further, the material of the metallic holder is used for a temperature sensor 50 or the like, to lead to improve the machinability improving is contained sagging, but the point of this lead environmental contamination from the use restriction it has been demanded. Incidentally, in the production of metallic holder of a material that does not contain lead, since the advanced technology and expensive equipment is required, they tend to be expensive. That point, the temperature sensor 10, since the material of the holder 12 does not contain lead is a resin, it is possible to inexpensively realize the decrease cutting the use of lead.

[0038] Furthermore, the temperature sensor 10, reduction of component metal stay 72 and protective tube 74 that required by the temperature sensor 50 of the prototype stage is achieved (see Figure 15). This is because the shape and adjust the hardness of the polyester of the mold to be used for hot melt molding, because the harness pair 34A, 34B is reliably supported by the neck portion 44B of the sensor force bar 44. That is, in the temperature sensor 10, the metal stay 72 and protective tube 74 which has been utilized by the temperature sensor 50 is replaced by the sensor cover 44. Incidentally, or extend the neck portion 44B of the sensor cover 44, by or employing a polyester material having a high hardness, can be supported more reliably harness pair 34A, and 34B in the sensor cover 44.

[0039] Here, the temperature sensor 50 of the prototype stage, the following problems were also present. That is, the holder 52 since the metallic holder 52 of brass or the like is used has an electrical conductivity. Therefore, when the wire drawn from the thermistor 56 is in contact with the holder 52 is disturbed temperature detection signal of the sensor 50 is a resistance value, it is impossible to perform an accurate temperature detection. Thus, for accommodating the thermistor 56 into the holder 52 there has been a need to carry out very carefully, making the efficiency of the sensor 50 there has been a problem that invites Shimare ,, making time delay with it decreases. Therefore, in this temperature sensor 10, efficiency of manufacturing operations has been achieved.

[0040] That is, in the sensing part 12a of the temperature sensor 10, the thermistor 32 is covered only by the element protection unit 43 composed of a filler resin part 42 and the holder 12. Here, the filling resin portion 42 is constituted by epoxy resin, the holder 12 is made of a PPS resin. Thus sensing portion 12a has a structure for covering the thermistor 32 is the element protection unit 43, Les such have uses holder having conductivity. Therefore, the thermistor 32 and the harness pair 34A, Les 34B is a cause situation in contact with the conductor.

[0041] Thus, the temperature sensor 10 is different from the temperature sensor 50 of the prototype stage that thermistor is accommodated in a metal holder, the thermistor 3 2 and harness pairs upon receiving the thermistor 32 of the holder 12 34A, there is no need to consider insulation between 34B and the conductor, making the work of the sensor is simplified and efficiency of manufacturing operations can be achieved. That is, in the temperature sensor 10, efficiency of manufacturing operations is achieved.

[0042] The holder used in a temperature sensor 50 of the prototype stage is made of metal, because it was more produced in cutting took much labor and time to the manufacturing. On the other hand, the holder 12 is applied to the temperature sensor 10 is made of resin, it can be easily produced by die molding. Therefore, when the holder is made of resin instead of metal, the facilitation of the sensor produced can be achieved. Further, Banre ,, reduce holder manufacturing cost is achieved easily of holder produced. In particular, the holder 12 because the PPS resin is used as resin material, high thermal conductivity, does not interfere with the temperature detection level of the temperature detecting element. Also this PPS resin has a high fluidity, it is possible to perform the type shape molded resin be complicated with high accuracy.

[0043] Next, in that the temperature sensing element is covered only by the element protection unit made of resin, the temperature sensor 101 is similar to the temperature sensor 10 described above with reference to FIG. 4 one 14 theory Akira to. Figure 4 is a perspective view showing a different temperature sensors of the temperature sensor 10 described above, FIG. 5 is a sectional view of a V- V direction in FIG. 4, FIG. 6, the VI- VI direction in FIG. 4 it is a cross-sectional view. Temperature sensor 101 has a built-in thermistor, for detecting the temperature of oil (ATF) or the like is used for the automatic transmission of an automobile.

[0044] First, referring to FIG. 7, a thermistor (temperature detecting element) incorporated in the temperature sensor 101 11 0 will be described. The thermistor 110 is a NTC thermistor, and a temperature sensing unit 111 for detecting the temperature such as water and oil, and a pair of lead line pairs 112, 113 connected to both sides. Temperature sensing unit 111, for example, manganese, nickel, is formed from cobalt, has a polycrystalline body ceramic crystal grains of a so-called spinel structure gathered. Further, the temperature sensing unit 111, in order to relax the stress received from the resin portion covering the periphery thereof (described later), are coated with an epoxy-based rubber. On the other hand, the lead wire pair 112, 113, fluorocarbon resin coating (e.g., Teflon coated) has been conducting wire 114, 115 are connected by caulking force crimp terminals 116, 117.

[0045] Next, the configuration of the temperature sensor 101. As shown in FIG. 5, the temperature sensor 101, a resin portion which covers the mono- thermistor 110 directly (element protection unit) 120, and a external resin portion 150 covering the resin portion 120. Resin portion 120 is formed in the first insert molding (primary molding), the external resin portion 150 is formed in the second insert molding (secondary molding). Temperature range of the thermistor 110, for example - 40 ° in the range of C-0.99 ° C.

[0046] Resin portion 120 is formed by PPS resin, the distal end, a first region (sensing unit) 121 directly contacting the oil or the like of the temperature measurement object shape covers the temperature-sensing portion 11 1 of the thermistor 110 It has been made. The first region 121, the cross-sectional shape has a flattened oval.

[0047] Here, with reference to FIGS. 8 10, further detailing the resin portion 120. Each figure molded body after the primary molding (hereinafter referred to as "primary molded body") is indicative of, FIG. 8 is a perspective view of a primary molded body, FIG. 9, in FIG. 8 IX- IX is a cross-sectional view, FIG. 10 is a Tsukuda J view of X- X direction in FIG. 8.

[0048] the primary molded body, the second region 122 in succession in the first region 121 described above have been formed.

The second region 122 covers a portion of the pair of lead line pairs 112, 113 of the juxtaposed thermistor 110. The portion connected to the second region 122 in the first region 121, the thickness of the edges gradually thinner disc portion 121a toward the ambient is formed. The surrounding of the disk portion 121a so that overhangs the outer side, to increase the creepage distance, in order to enhance the adhesion between the secondary molding resin.

[0049] The second region 122 in cross section has become a cross shape, the width W of the first region 121

2

Are narrower summer than the width W (see FIG. 9). The width referred to here, the arrangement of the lead wire pair 112, 113

1

It refers to a length corresponding to the direction (X direction in the drawing). Lead pairs 112, 113 are positioned at both ends in the width direction in the second region 122. The region where the lead line pair 112 in the second region 122, 113 is arranged is (a direction crossing the width direction; Y direction) and the height H is first territory

2

And summer lower than the same direction of the height H of the frequency 121.

1

[0050] In the second region 122, third region 123 is connected. The third region 123 has a width has summer wider second area 122 Yorichi accommodates the crimp terminals 116, 117 for connecting the lead wire pair 112, 113 and Shirubeizumi 114, 115. Further, between the crimp terminal 116, 117 between namely lead pairs 112, 113, through holes 124 are formed in the longitudinal direction is oriented in a direction (Y direction) intersecting the arrangement direction of the lead wire. From front and rear surfaces in the drawing above the through hole 124 in the third region 123, a pair of fixing portions 127, 127 are projected (see FIG. 8, FIG. 10). Fixing portions 127, 127 has a groove V-shaped cross section, by Rukoto abut the bar for fixing the groove, it is possible to position the primary molded body during secondary molding. Further, the upper ends of the third area 123, a pair of thin plate portions 125, 126 and is erected, the thin plate portion 125, 1 26 between power conductors 114, 115 is extended upward.

[0051] in the vicinity of the thin plate portion 125, 126 has a substantially rectangular shape of the protective portion 128 for covering the periphery of the conductor 114, 115 are formed. Protection unit 128 is formed in the first one third region integrally with the same materials described above, the role of conductor 114, 115 at the time of secondary molding is prevent from being damaged in contact with the mold It has. Protection portion for bending such wires is not necessarily provided.

[0052] Next, with reference to FIG. 4 one 6 again, will be described in detail external resin portion 150. External resin portion 150 are intended to define the outer shape of the temperature sensor 101, and covers the region excluding the most part of the first region 1 21 in the resin portion 120. That is, the shape of the region come in contact to a temperature measured in water or oil, etc., it will be defined by the primary molding. In the region of FIG lower portion of the external resin portion 150, a pair of ring portions 151, 152 are formed, and ring grooves 153 for writing because fitting the O-ring is formed therebetween.

[0053] above the upper ring portion 152 of the outer resin part 150, a key receiving portion 154 having a rectangular parallelepiped shape to be described later of the key plate is written to 揷 is formed. Key receiving portion 154, in order to prevent the vertical misalignment of the key plate, the thickness in the Y direction, narrower than the rectangular shape of the head 155 is located in the ring portion 152 and the upper to position thereunder and summer. Also, on one side of the head 155 is protruded portion 156 is formed, conductor 114, 115 jump out in the vertical direction (Z-direction) in the primary molded body, the projecting portion 156 bent substantially at a right angle It protrudes.

[0054] Figure 11 shows an application example of such a temperature sensor 101. The figure is an example of applying the temperature sensor 101 to measure the temperature of the oil F of automatic transmission, is mounted to the case 160 for accommodating the oil F. The case 160, a circular through hole 160h is formed, the ring portion 151, 152 of the temperature sensor 101 is within the through hole 160h. O-ring is fitted in the ring groove 153, and seals the gap between the case 160 and the temperature sensor 101. The first region 121 of the resin portion 120 is immersed in the oil F. On the other hand, the key plate 161 is inserted in the key receptacle 154 located outside of the case 160, the key plate 161 is fixed to the to case 160 by screws 162. Then, information on oil temperature detected by the temperature sensor 101 is transmitted to the electronic control apparatus for an automatic transmission (ECU). The electronic control unit controls the transmission timing and the like based on the received oil temperature information.

[0055] As described above in detail, in the temperature sensor 101, the first region 121 of the resin portion 120 which is immersed in the oil F in the case 160, the thermistor 110 is housed. That is, the thermistor 110 is covered with only the resin portion 120 made of PPS. The first region 121 as is covered thermistor 110 only by the resin portion 120, the holder having conductivity is not used. Therefore, condition does not occur that the thermistor 110 and lead wire pair 112, 113 is in contact with the conductor. Thus, the temperature sensor 101 is different from the conventional temperature sensor thermistor metal holder is accommodated, necessary to consider the insulation between the thermistor and harness pairs and conductor upon receiving a thermistor into the holder because there is no, making the work of the sensor is easy becomes simply efficiency of manufacturing operations can be achieved. [0056] Next, a manufacturing method and a temperature sensor type suitable for use in this method of the temperature sensor 101.

[0057] First, as shown in FIG. 12, to prepare a mold (temperature sensor type) 170 for insert molding temperature sensor 101 (primary molding). The mold forces are use a fixed mold and a movable side mold here detailing only mold 170 of the fixed side. About the type of mobile side, it can be made in accordance with the outer shape of the temperature sensor. Kiyabiti mold 170, the first region 121 first Kiyabiti region 171 for forming a region for forming the second region 122 are both the 171 in consecutive second Kiyabiti region 172 of the resin portion 120 and, and a third Kiyabiti region 173 for forming the third region 123 as well as continuous to the area 172. Width W of the second Kiyabiti region 172 have narrower summer than the width W of the first Kiyabiti region 171

C2 C1

That.

[0058] In the region opposite to the second Kiyabiti region 172 in the first Kiyabiti region 171, a space 174 for disseminating injection resin to the tip of the first Kiyabiti region 171 is made form. Further, in the third Kiyabiti area 172, partition wall 175 for forming the through hole 124 is erected. Also on the type of mobile side similar partition wall 181 (see FIG. 13) are found provided, partition walls 175, 181 are summer to abut one another upon clamping. Also, on the opposite side to the second Kiyabiti region 172 in the partition wall 175, the groove 176 for forming the upper Symbol fixing portion 127 of the primary molded body is provided. Groove 176 is most shallow tool both ends central portion has a deepest such inclination. Further, the third Kiyabiti region 1 72, the space 177, 178 for forming the thin plate portion 125, 126 of the primary molded body is al provided. In the space 177, 178, conductors 114, 115 protective part for Kiyabiti region 179 of the order to form a protective portion 128 for protecting the are connected.

[0059] die 170, although not shown, it includes various known elements in addition to this. The written that element, for example, a gate for injecting a resin into Kiyabiti, Ejiwekutapin for taking out die or we moldings, the guide pins and the guide pins for aligning precisely fit the type of the fixed side and moving side bush, and the like.

[0060] After preparing the mold 170 as described above, this sets the thermistor 110. At this time, as shown in FIG. 12, the temperature-sensitive portion 111 located in the first Kiyabiti region 171, so that a pair of lead line pairs 112, 113 force S Nami歹 IJ second Kiyabiti region 172. Also, so that the lead wire 112 one by one on both sides of the partition walls 175, 113 passes. After setting the thermistor 110, to move the die of the movable toward the fixed side mold 170, performs mold clamping.

[0061] FIG. 13 is a cross-sectional view of a state in which mold clamping in XIII- XIII direction in FIG. 12. Reference numeral 18 0 shows a mold movable. As demonstrated in Figure 13, the second Kiyabiti region 172, the width W of that is Semare than the width W of the first Kiyabiti region 171, as well, the lead wire 112, 113

C2 C1

Is summer lower than the height H of the height H be the first Kiyabiti region 171 of the region disposed.

C2 C1

After completion of the [0062] mold clamping, the resin is injected at high pressure into the Kiyabiti through the gate, performing insert molding. Here, since the use of high fluidity PPS resin, even complex mold shapes, the resin spreads throughout the Kiyabiti, it is possible to realize a resin molding precision. Further, since the resin has a high thermal conductivity, such interfere with the temperature detection level of the thermistor les. Further, the mold 170 because it is structured as described above, in the process of injecting the resin into the first Kiyabiti region 171 及 beauty second Kiyabiti region 172, also injecting resin into Kiyabi tee area 179 protection unit at the same time be able to. Thus, a process of forming a first region 121 and second area 122, etc., need to be eliminated twice injection molding and process for forming the protective part 128, it is possible to reduce the number of resin injection , Ru can achieve a simplification of the manufacturing operations.

In the manufacturing method shown in [0063] above, the following effects can be obtained. That is, the pressure acts on the thermistor 110 during resin injection, as the thermistor 110 is misaligned, the inner wall surface 172a of the lead wire 1 12, 113 force S second Kiyabiti region 172, mono- by contacting 172b mista 110 movement of is restricted. Therefore, possible to prevent a situation in which the temperature sensing unit 111 at the time of insert molding reaches the inner wall surface 171a, 171b of the first Kiyabiti region 171. More thereto, at a temperature sensor 101 resulting a situation that is exposed on the surface of the resin portion 120 temperature-sensitive portion 111 of the thermistor 110 covers it is suppressed. And power, also, since the exposure of the temperature sensing portion 111 is suppressed, it is not necessary to cover the first area 121 by the thermistor 110 is positioned in the secondary molding described later, the ambient temperature sensing portion 111 of the resin size as possible out it is possible to reduce the size.

[0064] Further, since the height H of the area leads 112, 113 in the second Kiyabiti region 172 is disposed is summer lower than the height H of the first Kiyabiti region 171, the injection pressure of the resin

C1

Even when the thermistor 110 is displaced in the connexion height-direction, the inner wall surface 172c of the second Kiyabiti region 172, it is possible to restrict the movement of the lead, the line 112, 113 by 172d, the temperature sensing unit 111 is first Kiyabiti region 171 of the inner wall surface 171c, Ru can suppress a situation in which to reach the 171d. Therefore, it is possible to temperature-sensitive portion 111 further effectively suppress a situation that is exposed on the surface of the resin portion 120 covering it.

[0065] Furthermore, the thermistor 1 10 as both sides through the leads 112, 113 force S one by one of the partition wall 175 and the mold 170ί this set Rereru. Therefore, I partition wall 175 (child stranded, it is possible to regulate the movement in the direction of the lead Izumi 112, 113 approach each other, can be effectively suppressed by al the displacement of the thermistor 110.

[0066] After completion of the resin injection of the primary molding, E di Engineering Tatopin after mold opening removing the molded body from the mold. Then, both when cutting the portions connecting the protective portion 128 and the thin plate portion 125, 126, cut off the portion formed by the space 174. Thus, the primary molded body shown in FIGS. 8-10 is obtained.

[0067] Next, with reference to FIG. 14, a process of applying a secondary molding will be described with respect to the primary molded body. First, by bending at substantially right angles conductors 114, 115 that extend linearly, while the first region 121 that covers the thermistor 110 inserted into the through hole of the mold 185, the protective portion 12 8 that covers the conductors 114, 115 It is sandwiched by a pair of the lower mold 190 and the upper mold 191. In other words, around the majority of the first region 121 (a region to the vicinity of the distal end portion forces also the second region 122) resin is not molded in the secondary molding. Further, the inner surface defining a Kiyabiti of the lower mold 190, the bar 192 is mounted, the bars 192, are in contact with one of the fixed portion 127 of the primary molded body.

[0068] After fixing the primary molded body to the lower mold 190 and the upper mold 191 is a mold of the stationary side, and clamping by moving the die 194 of the moving side. In this case, the bar 1 93 attached to the mold 194 is adapted to abut the other of the fixed part 127 of the primary molded body, it is possible to position and fix the 1 TsugiNaru form in the mold.

[0069] When equipped with above preparatory, the resin is injected from the mold gate, to implement the secondary molding. In this case, although injecting primary molding as well as PPS resin, it may be used other resins. In 2 TsugiNaru shaped, wires 114, 115 as described above, because it is sandwiched by the lower mold 190 and the upper mold 191 through the protection portion 128 can be prevented from being damaged received from these types. After finishing the resin injection 2 TsugiNaru shaped by Ejetatopin after the mold is opened and eject the molded product from the mold. Thus, the temperature sensor 101 shown in FIG. 4 one 6 can be obtained.

[0070] Temperature sensor 101 obtained in this manner, the first region 121 that covers the temperature sensing portion 111 of the thermistor 110 has its outer shape is defined only by primary molding, the first region by the secondary molding 1 because 21 is not necessary to cover the, it is possible to downsize the resin size around the temperature sensing unit. Further, it is possible to reduce the amount of resin used, also can be force S reduced cost Xiao IJ decreased. The two outer resin portion formed by TsugiNaru form, the Yogu first region if One covering the resin part except at least a part may also be excluded Te to base of the first region 121 in addition, even as excluding also regions other than the first region good record,,. Further, without performing the secondary molding, Yo Le be producing temperature sensor only by primary molding.

[0071] The present invention can be those at the nag various modifications to be limited to the above embodiment. For example, the angle with respect to the holder side wall of the return portion formed in the holder is not limited to the vertical (90 degrees), it sensor cover is to be changed in a range of appropriate 0- 90 degrees as long as the angle to be locked to the holder It can force S. The shape of the neck portion is not limited to the T-shape may be rod-like or plate-like as long as the shape of the harness can be properly guided.

[0072] Further, the resin constituting the resin and the filling resin portion constituting the holder is not limited to the combination of the PPS resin and the E port carboxymethyl resin. For example, the resin constituting the holder, liquid crystal polymers, polyamides may be homologous to the resin constituting the resin and the filling resin portion a polyimide constituting the Yogu holder.

Claims

The scope of the claims
[1] and the bottomed cylindrical holder having an opening,
Along with the read line pair are connected so as to be introduced from the opening side, and a temperature sensing element housed in the bottom of the holder,
While it is filled in said holder so as to seal said temperature sensing element, and a filling resin portion extending to said opening,
A cap portion that covers the entire opening, a cell Nsakaba that a neck portion extending outwardly of the cap portion along the outer peripheral surface of the lead wire pair drawn from the cap portion is in the over body
Comprising a temperature sensor.
[2] projecting from the edge of the opening of the holder, further includes a guide portion for guiding the respective lead wires constituting the lead line pair,
The sensor cover covers the guide portion, the temperature sensor according to claim 1.
[3] The shape of the guide portion includes a portion extending in a direction perpendicular to the extending direction of the holder, in T-shape having a portion extending parallel to the extending direction of the holder there, the temperature sensor according to claim 2.
[4] the edge of the opening of the holder is returned portion of the substantially annular projecting outward is formed of the holder,
At least a portion is engaged by the return part, the temperature sensor according to claim 1 of the sensor cover.
[5] The sensor cover is formed by a hot melt molding, Ru, temperature sensor according to claim 1.
[6] includes a sensing portion immersed in the fluid in the casing is a temperature-measured object,
Said sensing unit, said being read line pair connected to said temperature sensing element is accommodated, the temperature detecting element is covered only by the element protection unit made of resin, the temperature of claim 1 sensor.
[7] the element protection unit has a stacked structure with the resin heterologous temperature sensor according to claim 6. The element protection unit has a laminated structure of a resin of the same type, the temperature sensor of claim 6.
The holder is made of resin,
The element protection unit, a temperature sensor according to said holder and is composed of said filling resin portion filled in the holder, according to claim 6.
The element protection unit is included poly full We two sulfide resin as a constituent material, Ru, temperature sensor according to claim 6.
PCT/JP2004/008752 2003-06-25 2004-06-22 Temperature sensor WO2005001404A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003-181598 2003-06-25
JP2003181598A JP4041018B2 (en) 2003-06-25 2003-06-25 Temperature sensor
JP2003-188511 2003-06-30
JP2003188511A JP2005024344A (en) 2003-06-25 2003-06-30 Temperature sensor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN 200480017410 CN1809733B (en) 2003-06-25 2004-06-22 Temperature sensor
US10/559,763 US7410294B2 (en) 2003-06-25 2004-06-22 Temperature sensor

Publications (1)

Publication Number Publication Date
WO2005001404A1 true WO2005001404A1 (en) 2005-01-06

Family

ID=33554444

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/008752 WO2005001404A1 (en) 2003-06-25 2004-06-22 Temperature sensor

Country Status (5)

Country Link
US (1) US7410294B2 (en)
JP (2) JP4041018B2 (en)
KR (1) KR100810937B1 (en)
CN (1) CN1809733B (en)
WO (1) WO2005001404A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105719782A (en) * 2014-12-19 2016-06-29 Tdk株式会社 Thermistor

Families Citing this family (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7381184B2 (en) 2002-11-05 2008-06-03 Abbott Diabetes Care Inc. Sensor inserter assembly
JP4041018B2 (en) 2003-06-25 2008-01-30 Tdk株式会社 Temperature sensor
US8571624B2 (en) 2004-12-29 2013-10-29 Abbott Diabetes Care Inc. Method and apparatus for mounting a data transmission device in a communication system
US10226207B2 (en) 2004-12-29 2019-03-12 Abbott Diabetes Care Inc. Sensor inserter having introducer
US7731657B2 (en) 2005-08-30 2010-06-08 Abbott Diabetes Care Inc. Analyte sensor introducer and methods of use
US8512243B2 (en) 2005-09-30 2013-08-20 Abbott Diabetes Care Inc. Integrated introducer and transmitter assembly and methods of use
US7883464B2 (en) 2005-09-30 2011-02-08 Abbott Diabetes Care Inc. Integrated transmitter unit and sensor introducer mechanism and methods of use
US9398882B2 (en) 2005-09-30 2016-07-26 Abbott Diabetes Care Inc. Method and apparatus for providing analyte sensor and data processing device
US9521968B2 (en) 2005-09-30 2016-12-20 Abbott Diabetes Care Inc. Analyte sensor retention mechanism and methods of use
CA2636034A1 (en) 2005-12-28 2007-10-25 Abbott Diabetes Care Inc. Medical device insertion
US7697967B2 (en) 2005-12-28 2010-04-13 Abbott Diabetes Care Inc. Method and apparatus for providing analyte sensor insertion
US8366316B2 (en) * 2006-04-14 2013-02-05 Deka Products Limited Partnership Sensor apparatus systems, devices and methods
MX2008013266A (en) 2006-04-14 2008-10-27 Deka Products Lp Systems, devices and methods for fluid pumping, heat exchange, thermal sensing, and conductivity sensing.
US20090105569A1 (en) 2006-04-28 2009-04-23 Abbott Diabetes Care, Inc. Introducer Assembly and Methods of Use
US8333714B2 (en) 2006-09-10 2012-12-18 Abbott Diabetes Care Inc. Method and system for providing an integrated analyte sensor insertion device and data processing unit
US9259175B2 (en) 2006-10-23 2016-02-16 Abbott Diabetes Care, Inc. Flexible patch for fluid delivery and monitoring body analytes
US9788771B2 (en) 2006-10-23 2017-10-17 Abbott Diabetes Care Inc. Variable speed sensor insertion devices and methods of use
US8425471B2 (en) 2007-02-27 2013-04-23 Deka Products Limited Partnership Reagent supply for a hemodialysis system
US8357298B2 (en) 2007-02-27 2013-01-22 Deka Products Limited Partnership Hemodialysis systems and methods
US8562834B2 (en) 2007-02-27 2013-10-22 Deka Products Limited Partnership Modular assembly for a portable hemodialysis system
US8393690B2 (en) 2007-02-27 2013-03-12 Deka Products Limited Partnership Enclosure for a portable hemodialysis system
US20090107335A1 (en) 2007-02-27 2009-04-30 Deka Products Limited Partnership Air trap for a medical infusion device
US9028691B2 (en) 2007-02-27 2015-05-12 Deka Products Limited Partnership Blood circuit assembly for a hemodialysis system
US8042563B2 (en) 2007-02-27 2011-10-25 Deka Products Limited Partnership Cassette system integrated apparatus
US8409441B2 (en) 2007-02-27 2013-04-02 Deka Products Limited Partnership Blood treatment systems and methods
US7967022B2 (en) 2007-02-27 2011-06-28 Deka Products Limited Partnership Cassette system integrated apparatus
MX2009009215A (en) 2007-02-27 2009-12-04 Deka Products Lp Hemodialysis systems and methods.
US8491184B2 (en) 2007-02-27 2013-07-23 Deka Products Limited Partnership Sensor apparatus systems, devices and methods
US7891572B1 (en) 2007-04-05 2011-02-22 C. Cowles & Company Temperature and low water monitoring for boiler systems
WO2008150917A1 (en) 2007-05-31 2008-12-11 Abbott Diabetes Care, Inc. Insertion devices and methods
US8251579B2 (en) * 2007-07-16 2012-08-28 Rtd Company Robust stator winding temperature sensor
EP2217301A2 (en) * 2007-10-12 2010-08-18 DEKA Products Limited Partnership Systems, devices and methods for cardiopulmonary treatment and procedures
US9078971B2 (en) 2008-01-23 2015-07-14 Deka Products Limited Partnership Medical treatment system and methods using a plurality of fluid lines
JP5416137B2 (en) 2008-01-23 2014-02-12 デカ・プロダクツ・リミテッド・パートナーシップ Automated peritoneal dialysis system
DE102008029192A1 (en) * 2008-03-13 2009-09-24 Epcos Ag Sensor for detecting a physical size, and method of manufacturing the sensor
KR101020282B1 (en) * 2008-07-09 2011-03-07 주식회사 하이닉스반도체 Temperature sensor
US8771508B2 (en) 2008-08-27 2014-07-08 Deka Products Limited Partnership Dialyzer cartridge mounting arrangement for a hemodialysis system
JP5429476B2 (en) * 2008-11-20 2014-02-26 Tdk株式会社 Temperature sensor
KR101117994B1 (en) * 2009-01-06 2012-02-24 주식회사 엘지화학 Spacer for Battery Pack and Battery Pack Comprising the Same
US9402544B2 (en) 2009-02-03 2016-08-02 Abbott Diabetes Care Inc. Analyte sensor and apparatus for insertion of the sensor
DE102009015315A1 (en) 2009-03-27 2010-09-30 Epcos Ag Sensor arrangement and methods for making
JP5326826B2 (en) * 2009-06-02 2013-10-30 三菱マテリアル株式会社 Temperature sensor
JP5455454B2 (en) * 2009-06-08 2014-03-26 矢崎総業株式会社 Conveniently fixed function temperature sensor and its on-board battery pack blast air duct
US9351669B2 (en) 2009-09-30 2016-05-31 Abbott Diabetes Care Inc. Interconnect for on-body analyte monitoring device
US8287185B2 (en) * 2009-10-01 2012-10-16 Delphi Technologies, Inc. Cell temperature sensing apparatus for a battery module
EP3072545B1 (en) 2009-10-30 2019-05-08 DEKA Products Limited Partnership Apparatus for detecting disconnection of an intravascular access device
AU2011269796A1 (en) 2010-03-24 2012-02-16 Abbott Diabetes Care Inc. Medical device inserters and processes of inserting and using medical devices
US9572534B2 (en) 2010-06-29 2017-02-21 Abbott Diabetes Care Inc. Devices, systems and methods for on-skin or on-body mounting of medical devices
MX2013000212A (en) 2010-07-07 2013-05-09 Deka Products Lp Medical treatment system and methods using a plurality of fluid lines.
JP5624667B2 (en) * 2011-02-21 2014-11-12 株式会社日立製作所 motor
US9743862B2 (en) 2011-03-31 2017-08-29 Abbott Diabetes Care Inc. Systems and methods for transcutaneously implanting medical devices
JP5307852B2 (en) * 2011-05-19 2013-10-02 三菱電機株式会社 Temperature sensor
CA2837200A1 (en) 2011-05-24 2012-11-29 Deka Products Limited Partnership Hemodialysis system
EP3263150A1 (en) 2011-05-24 2018-01-03 DEKA Products Limited Partnership Blood treatment systems and methods
JP5769298B2 (en) * 2011-07-06 2015-08-26 株式会社芝浦電子 Integrated sensor for detecting the temperature sensor, the temperature and pressure
CN103063322B (en) * 2011-10-19 2014-12-03 花国樑 Stretch resistance insulation structure of negative temperature coefficient (NTC) temperature sensor
WO2013067359A2 (en) 2011-11-04 2013-05-10 Deka Products Limited Partnership Medical treatment system and methods using a plurality of fluid lines
US9402570B2 (en) 2011-12-11 2016-08-02 Abbott Diabetes Care Inc. Analyte sensor devices, connections, and methods
US20140028434A1 (en) * 2012-07-25 2014-01-30 Polestar Electric Industries Co., Ltd. Self-recovery circuit breaker
DE102012110858A1 (en) * 2012-11-12 2014-05-15 Epcos Ag Temperature sensor system and method for the manufacture of a temperature sensor system
DE102012110822A1 (en) * 2012-11-12 2014-05-15 Epcos Ag Temperature sensor system and method for the manufacture of a temperature sensor system
US9709461B2 (en) * 2012-11-30 2017-07-18 Sensata Technologies, Inc. Method of integrating a temperature sensing element
EP3115759A4 (en) * 2014-03-07 2017-03-29 Shibaura Electronics Co., Ltd. Temperature sensor and temperature sensor manufacturing method
DE102014212279A1 (en) * 2014-06-26 2015-12-31 Robert Bosch Gmbh Measuring arrangement for receiving a sensor
WO2016017050A1 (en) * 2014-07-28 2016-02-04 パナソニックIpマネジメント株式会社 Temperature sensor
KR20160067415A (en) * 2014-12-04 2016-06-14 현대모비스 주식회사 Temperature sensor and Method for manufacturing the same
EP3264056A4 (en) * 2015-02-26 2018-02-21 Shibaura Electronics Co., Ltd. Temperature sensor
US10161639B2 (en) * 2015-03-10 2018-12-25 Joseph Copeland Heat transfer apparatus and heat transfer system for masonry heater
US10213139B2 (en) 2015-05-14 2019-02-26 Abbott Diabetes Care Inc. Systems, devices, and methods for assembling an applicator and sensor control device
DE102015110399A1 (en) * 2015-06-29 2016-12-29 Ebm-Papst Mulfingen Gmbh & Co. Kg Motor temperature monitoring
DE102015223951A1 (en) * 2015-12-01 2017-06-01 TE Connectivity Sensors Germany GmbH Substrate for a sensor arrangement for a resistance thermometer sensor arrangement, resistance thermometers and methods of making such a substrate
DE102015223948B3 (en) * 2015-12-01 2017-03-30 TE Connectivity Sensors Germany GmbH Substrate for a sensor arrangement for a resistance thermometer sensor arrangement, resistance thermometers and methods of making such a substrate
US20180003655A1 (en) * 2016-06-29 2018-01-04 Rosemount Inc. Process fluid temperature measurement system with improved process intrusion
JP6405074B2 (en) * 2016-06-30 2018-10-17 Semitec株式会社 Apparatus equipped with a temperature sensor and a temperature sensor
WO2018106126A1 (en) * 2016-12-07 2018-06-14 Fisher And Paykel Healthcare Limited Sensing arrangements for medical devices
US20190064000A1 (en) 2017-02-09 2019-02-28 Shibaura Electronics Co., Ltd. Temperature sensor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02247522A (en) * 1989-03-20 1990-10-03 Hitachi Kiden Kogyo Ltd Unit travel distance correcting device for carriage
JPH03108624A (en) * 1989-08-22 1991-05-08 Matsushita Electric Ind Co Ltd Temperature sensor
JPH1123379A (en) * 1997-06-30 1999-01-29 Aisin Aw Co Ltd Temperature sensor
JP2000105151A (en) * 1998-09-29 2000-04-11 Zexel Corp Temperature sensor
JP2001343292A (en) * 2000-03-31 2001-12-14 Ngk Spark Plug Co Ltd Waterproof structure for sensor and sensor equipped with the same

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158531A (en) * 1982-03-16 1983-09-20 Shibaura Denshi Seisakusho:Kk Temperature sensor
US4560973A (en) * 1983-11-15 1985-12-24 Daimler-Benz Aktiengesellschaft Rod shaped thermometer and method of making same
JPS61110019A (en) 1984-11-02 1986-05-28 Sanyo Electric Co Ltd Manufacture of temperature detector
JPS61142430A (en) * 1984-12-17 1986-06-30 Matsushita Electric Ind Co Ltd Temperature detector
JPH02247532A (en) * 1989-03-20 1990-10-03 Mitsubishi Electric Corp Temperature sensor
JPH053955A (en) 1991-04-26 1993-01-14 Sophia Co Ltd Game device
KR0166712B1 (en) 1991-11-19 1999-03-20 강진구 Programmable pwm signal generator
JP2789986B2 (en) * 1993-02-02 1998-08-27 株式会社デンソー Thermistor temperature sensor
JPH08128901A (en) 1994-10-31 1996-05-21 Sanyo Electric Co Ltd Temperature sensor and pack battery
DE19534887B4 (en) * 1995-09-20 2004-04-15 Robert Bosch Gmbh temperature sensor
JP3108624B2 (en) * 1996-03-07 2000-11-13 シャープ株式会社 Electric carpet
US6045261A (en) * 1997-11-14 2000-04-04 Alltemp Sensors Inc. Temperature sensor assembly
DE10109828A1 (en) * 2001-03-01 2002-09-05 Xcellsis Gmbh Electrical temperature measuring device used for measuring the temperature inside thermally insulated gas generating box comprises temperature sensor arranged in protective tube with metal screw fixed to tube
JP2002267540A (en) 2001-03-13 2002-09-18 Denso Corp Temperature sensor
JP2002289407A (en) * 2001-03-23 2002-10-04 Denso Corp Temperature sensor and its manufacturing method
US6607302B2 (en) * 2001-09-24 2003-08-19 Visteon Global Technologies, Inc. Temperature sensor housing design
DE10156753A1 (en) * 2001-11-19 2003-06-05 Epcos Ag Sensors and sensor assembly
US20040081225A1 (en) * 2002-10-25 2004-04-29 Janicek Alan J. Plastic enclosed sensor
US20040101031A1 (en) * 2002-11-25 2004-05-27 Ford Global Technologies, Inc. Temperature sensor with improved response time
JP2004198240A (en) * 2002-12-18 2004-07-15 Denso Corp Sensor device
US6918696B2 (en) * 2003-01-15 2005-07-19 Denso Corporation Temperature sensor and method for manufacturing the same
JP4041018B2 (en) 2003-06-25 2008-01-30 Tdk株式会社 Temperature sensor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02247522A (en) * 1989-03-20 1990-10-03 Hitachi Kiden Kogyo Ltd Unit travel distance correcting device for carriage
JPH03108624A (en) * 1989-08-22 1991-05-08 Matsushita Electric Ind Co Ltd Temperature sensor
JPH1123379A (en) * 1997-06-30 1999-01-29 Aisin Aw Co Ltd Temperature sensor
JP2000105151A (en) * 1998-09-29 2000-04-11 Zexel Corp Temperature sensor
JP2001343292A (en) * 2000-03-31 2001-12-14 Ngk Spark Plug Co Ltd Waterproof structure for sensor and sensor equipped with the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105719782A (en) * 2014-12-19 2016-06-29 Tdk株式会社 Thermistor
CN105719782B (en) * 2014-12-19 2018-06-05 Tdk株式会社 Thermistor

Also Published As

Publication number Publication date
JP2005024344A (en) 2005-01-27
KR20060018266A (en) 2006-02-28
KR100810937B1 (en) 2008-03-10
JP2005017088A (en) 2005-01-20
US20070110124A1 (en) 2007-05-17
CN1809733B (en) 2010-04-14
JP4041018B2 (en) 2008-01-30
US7410294B2 (en) 2008-08-12
CN1809733A (en) 2006-07-26

Similar Documents

Publication Publication Date Title
EP1768475B1 (en) Electronic control unit
US9846067B2 (en) Flow sensor, method for manufacturing flow sensor and flow sensor module
US7877868B2 (en) Method of fabricating circuit configuration member
US4329569A (en) Resilient snap-on electric heating jacket for tubular objects
US7458261B2 (en) Liquid level detector
US6827232B1 (en) Resin case providing compatibility between air permeability and water proofing property, and mold for producing such case
US20090258521A1 (en) Waterproof connector and method for producing the same
KR0177517B1 (en) Sealed insulation displacement connector
EP0817261A1 (en) Method for manufacturing plastic package for electronic device having a fully insulated dissipator
US7997132B2 (en) Capacitive sensor assembly for determining relative position
US6747346B2 (en) Container for semiconductor sensor, manufacturing method therefor, and semiconductor sensor device
US20050083045A1 (en) Liquid level detector
EP1393367A2 (en) Integrated sensor packaging and methods of making the same
US4032214A (en) Cable-termination assemblies and methods for manufacturing such assemblies
GB2133886A (en) Fast response temperature sensing probe
US7404321B2 (en) Sensor device having a buffer element between the molding and the sensing element
KR960000126B1 (en) Water-proof electrical splice enclosure
US4955980A (en) Thermometer probe
EP0807245B1 (en) Temperature sensor probe
JP4249193B2 (en) The semiconductor pressure sensor device
US4245188A (en) Capacitive measuring transducer
US6558172B2 (en) Shielding connector and manufacturing method thereof
FR2513759A1 (en) Thermocouple instrument
US6282966B1 (en) Pressure sensor apparatus with separation membrane held between sensor and measuring cell housing bodies
KR20040054481A (en) Sensor having resin mold casing and Method of manufacturing the same

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 10559763

Country of ref document: US

Ref document number: 2007110124

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 1020057023837

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 20048174101

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 1020057023837

Country of ref document: KR

122 Ep: pct application non-entry in european phase
WWP Wipo information: published in national office

Ref document number: 10559763

Country of ref document: US