JPS58158244A - Surface treating method for woody board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for surface treatment of wooden boards used as cosiclete formwork and the like.

] In order to improve the mold releasability of the Sisycrete frame, an attempt has been made to coat the surface of the wooden board constituting the trap form with a resin. The surface of a wooden board can be coated with resin by attaching a synthetic resin film to the surface of the wooden board, but there are various problems with such surface treatment waves for wooden boards, and the results are still not satisfactory. The current situation is that we are not getting the desired results.

An example of this is shown in FIG. In this method, a thermoplastic synthetic resin film (8) is layered on the surface of a wooden board (4), and then the synthetic resin film (8) is bonded to the wooden board (4) using a hot plate (9). It was designed so that However, in this method, the synthetic resin film (8) is heated using a heating plate (9).
When the heating plate (9) is pulled up after fusing the wooden board (4), the synthetic resin film (8) is fused to the side of the heating plate (9) and peels off from the wooden board (4). There is a problem that the yield rate is low, and it takes time and effort to remove the synthetic resin film (8) adhering to the heating plate (9), resulting in a very low production rate. Therefore, as shown in FIG. 2, a synthetic resin film (8) with a low melting rate and a film with a low melting rate Ii! It is possible to laminate a film with a high temperature of 1Ila1 degree and use a nine composite film to prevent the heat film (11) from adhering at an intermediate temperature of 11IIIlki1 degree of both films. After being taken out of the dormitory. However, with this product, it is possible to prevent the synthetic resin film (8) from adhering to the heating plate (9) and peeling off from the wooden board (4);
Film-(11) K 11 There was a problem of frequent delamination between layers. I groan, hot plate (
9) K, synthetic resin film (8) is made of wood board (4) K
When welding under heat and pressure, heat the wooden board (
4) The water in the film evaporates, and this water acts as a force to push up the unmelted film (n) on the upper layer, penetrating through the melted film on the lower layer.
1) causes delamination from the underlying film layer, causing blisters. This is due to insufficient adhesion between the film and #-t #adhesion K.
This was done in consideration of the above point, which is noticeable when an olefin-based synthetic olefin resin with an M point is used as a film. A surface treatment for wood boards that allows composite films to be thermally attached to wood boards without the risk of delamination! The purpose is to provide one method.

Kibatsu F! 4 is a specific invention synthetic resin inner layer film +11
A synthetic resin outer layer film whose melting temperature is higher than the melting temperature of the inner layer film il+ (a composite film +8 is formed by adhering RITO after corona discharge treatment), and the inner layer film T1) is attached to the wooden board (4) The composite film (3) is stacked with the melting temperature of the inner layer film (fl) and the outer layer film (
2) A method for surface treatment of a wooden board, characterized in that a composite film (3) is thermocompression bonded to a wooden board (4) under heating conditions at a temperature fK between the melting temperature of 2), and a synthetic resin as a combined invention. A composite film +31 is formed by adhering a synthetic resin outer layer film whose melting temperature is higher than the melting temperature of the inner layer film 11) and the inner layer film fl) after corona discharge treatment. After making many fine through holes (6), stack the composite film (3) on the wood & F41K inner layer film (1) side, and compare the melting temperature of the inner layer film + 11 and the outer layer film (2). The above object was achieved by a method for surface treatment of a wooden board, which is characterized by thermocompression bonding of a wooden board (4) with a K composite film under heating conditions at a temperature between the melting temperature of Monodeashi,
In order to create the composite film (3) of the present invention, which will be described in detail below, there is a method of adhering a pair of molded films together with an adhesive, and a method of adhering a molded film to an extruded film. Two methods are employed: adhesion via an agent, and the former method will be explained first.

First, the thermoplastic synthetic resin inner layer film (1) and the thermoplastic synthetic resin outer layer film (2) constituting the composite film (3) are extruded using an extrusion molding machine as shown in Fig. 3. The inner layer film fi
+ and the outer layer film (2) are each subjected to corona discharge treatment. As shown in Fig. 3, the corona discharge treatment is performed by applying high frequency and high voltage between the insulated electrode shaft connected to the transformer of the corona discharge treatment 1s04 and the grounded dielectric roll H to insulate the air. The film is destroyed to generate a corona discharge, and the surface of the film (1), (!l is passed through during this corona discharge, thereby corona discharge treatment is applied to the surface of the film (1), (!l).
By applying corona discharge treatment to the surfaces of 1) and (2),
If the surface of the films (1) and (2) is polarized and activated to improve the adhesion performance, it is particularly effective when used with polyester resin films that have low adhesion performance.

Here, the inner layer film fil and the outer layer film (2)
means the film for the outer layer (the film for the inner layer (11)
For example, as the inner layer film (1), a material with a higher melting temperature than that of medium or high pressure poly I preregistration,
For the outer layer, such as vinyl diacetate copolymer (polypropylene resin, polyethyl cyterephthalate, etc. can be used as the phantom fill value.Furthermore, as the inner layer film (1), it is possible to use a film for wood and (4) It is preferable to use an adhesive resin with improved adhesion properties.This can be modified to introduce a polar group by craft copolymerization of a polar T-mer such as an acid anhydride with a polyester pre-resist, etc. These include Mitsubishi Petrochemical's "℃ Dick" and Mitsui Petrochemical's "℃ Dick".
Adhesive polyolefin resins such as "Atomer", Jumen Kagaku's "Bosido First", Toa Fuel Chemical's "rHA series", and Exoshi's "Jixoshi J" are provided as adhesive polyolefin resins.

Inner layer film (1) treated with corona discharge as above
Apply adhesive +61 i-@ cloth to either (or both) of the outer layer film (2) and attach the adhesive as shown in Figure 4.
-boηg? ) Pass both films (1) (
2) is bonded together with the inner layer film (1) and the outer layer film (1) to obtain a composite film (3).
1 and the outer layer film (2) have a surface activated by corona discharge treatment, so that they can be bonded with high adhesive strength. Also, when it comes to adhesives, there is the film Dryra! Although any adhesive can be used, uretaceous adhesives are most preferred due to their excellent heat resistance properties.

After obtaining the composite film (3) in this way, as shown in Fig. +3) on the wooden board (4), a composite film (
3) k-weld. Here, the heating temperature f of the thermal temperature (9) is set to a temperature higher than the melting temperature of the inner layer film + 1) and lower than the melting temperature of the outer layer film (R). The inner layer film (!) melts and adheres to the surface of the wooden board (4), but the outer layer film (S!ltJ does not melt and the outer layer film (2) adheres to the surface of the wooden board (4) at a temperature of t91 K). Composite 1 ilm (3) adheres to heat and temperature (9) K and wood & (4)
There is no fear that it will peel off. Also, at this time, wood ′′ is heated by thermal temperature (9).
! fi (4), water vapor is generated, and even if this water vapor melts and heats the next inner layer film f1+, it will not adhere to the outer layer film (2) inner layer film (IIK) by corona discharge treatment. Since the adhesive is highly strong, there is no risk that the outer layer film (2) will partially peel off from the inner layer film (1) due to the pressure of water vapor, resulting in only damage. Adhesive (6) for bonding and outer layer film (2) to form a composite film (3)
If a polyurethane-based adhesive is used, there is no risk of deterioration due to heat resistance due to its heat resistance (91K), and the effect of preventing peeling can be further enhanced.

Next, a method for obtaining a composite film (3) by adhering a film immediately subjected to extrusion to a molded film via an ASICAR coating agent will be described. First, the outer layer film (2) is subjected to a discharge treatment in the same manner as shown in FIG. 3, and a sea car coating agent (6) is applied to the surface of this outer layer film (2). The adhesive strength coating agent (6) is used to activate the surface of one film and increase the adhesive strength between the films when manufacturing a composite film by directly extruding or coating the film. Ashika coating agent (6) has high polarity,
This polarity increases the polarity of the surface of the outer layer film (2). As the ASICAR coating agent (8), organic titanium-based ASICAR coating agents, polyester pre-stain-based ASICAR coating agents, and isocyanate-based ASICAR coating agents are provided, but isocyanate-based ASICAR coating agents have better heat resistance. Very preferable.

On the other hand, the inner layer film ILL is obtained by extrusion using an extrusion molding machine (1), and as shown in Figure 6, the inner layer film T11, which is in a softened state 111, is directly subjected to this extrusion. ) side: outer layer film I2
The outer layer film (2) K is fused and integrated with the inner layer film fi+ through the ashcar coating agent (6) to form a composite film (3).
This is what you get. Here, the surface of the outer layer film (2) has been activated by corona discharge treatment, and it has also been polarized with an ASICAR coating agent, and the outer layer film (inner layer film (1)) is bonded to the outer layer film (2). It is possible to obtain a composite film (3) with high strength and an integrated adhesive.The composite film (3) obtained in this way is used in the fifth
Similar to the case shown in the figure, composite film (3) k wood board (
Table 1fK of 4) can be fused and the surface of the wooden board (4) can be treated with a composite film [31].

In this case as well, corona discharge treatment and the use of the Ashikar coating agent (6) allow the inner layer film (1) and the outer layer film (
2), and when heated at high temperature (9), the pressure of the steam generated from the wooden board (4) causes the outer layer film to partially peel off from the inner layer film fi+. It is possible to prevent blistering from occurring.In addition, by using an isocyanate-based asica coating agent as the asica coating agent (@), the isocyanate-based asica coating agent with high heat resistance can be used at hot temperatures (9) K. There is no risk of deterioration due to heating, and the effect of preventing peeling can be further enhanced.

Next, the combined invention of the present invention will be explained. Figure 4 above,
As shown in Fig. 6, the composite film (3) is heated at high temperature (9) to achieve high interlayer adhesion between the inner layer film (1) and the outer layer film (9). When fusing 3) to the wooden board (4), it was possible to prevent delamination between the inner layer film (1) and the outer layer film. It is necessary to release the generated water vapor, and in order to completely prevent delamination between the inner layer film fi+ and the outer layer film, it is necessary to press it at a hot temperature (!I). It is preferable to bleed the air by raising the heat temperature (9).In the combined invention, even this bleed is not necessary.That is, the composite film (3) is heated over the entire surface of the composite film (3). As shown in Figure 7, minute through holes [7
1f'7)...It-Alms, this jar gold film (3)
The composite film (3) is fused to the surface of the wooden board (4) at a hot temperature (9) as shown in FIG. At this time, the water vapor generated from the wooden board (4) due to heating at the thermal temperature 11+ escapes from the through hole (7), so that an air bleeding operation is not necessary. In addition, the through holes (7) in the inner layer film [11] are closed by the melting of the inner layer film +11, and the through holes (7) in the outer layer film (1) are also filled with the molten resin of the inner layer film [11]. It is colder than sinking into the product, and the through hole (7) does not appear in the product, so there is no problem.

Next, the present invention will be specifically explained using examples.

<Example 1> A 70μ thick outer layer film of unstretched polypropylene (CPP) was subjected to corona discharge treatment under the conditions of 40 dyne/country using a corona discharge treatment machine, and acid anhydride was kraft copolymerized to obtain adhesive properties. High pressure polyester (poside first:
A 25μ thick inner layer film (manufactured by Sumitomo Chemical) was treated with corona discharge in the same manner as above.

Next, apply heat-resistant polyester type urethane adhesive (A-310 manufactured by Takeda Pharmaceutical Co., Ltd.) to one side of the CPP film for the outer layer.
5y/Ill'' and dried by passing it through a tumbler at 60 to 70°C to evaporate the adhesive solvent.

Next, I layered the CPP film for the outer layer and the PE film for the inner layer using a resin adhesive. A composite film was obtained by passing it through a hole and adhering it, and it was layered on top of the composite film, heated to 115°C, and made into IC1i/a at a temperature of 9.
The plywood was pressed for 3 minutes, heated for 30 seconds to remove air, and then pressed for another 30 seconds to obtain a board for cosiclete formwork with a composite film adhered to the plywood surface.

With this product, there is no delamination or blistering between the inner layer film and the outer layer film of the composite film, and it is possible to obtain a board for cosiclete formwork with a beautiful surface, and it is also durable at high temperatures. When attaching composite film to plywood
There was no case where the 41-glue film adhered to the heat and peeled off from the plywood.

<Example 2> A large number of through holes with a diameter of 50 μm were formed over the entire surface of the film obtained in the same manner as in Example 1 by electrical discharge hole machining, and this was stacked on the same plywood as in Example 1. By heating to 115° C. and pressing at a temperature of 1011 qlcrl for 3 minutes, a board for a cosiclete formwork with a composite film adhered to the surface of the plywood was obtained.

With this method, no delamination or blistering was observed between the inner layer film and the outer layer film of the composite film, and it was possible to obtain a board for cosiclete formwork with a beautiful surface. When attaching the composite film to the plywood, make sure that the composite film does not stick to the heat and peel off from the plywood. With this product, there is no need to bleed the air. Furthermore, in the product plate, the through holes have disappeared.

Example 3 A polyethylene terephthalate (PET) film for an outer layer having a thickness of 60 μm was subjected to corona discharge treatment in the same manner as in Example 1, and a piece of this PET film for an outer layer was prepared.
Apply with isocyanate-based anchor coating agent k N//♂.

On the other hand, the acid anhydride was kraft copolymerized and the adhesive medium polyethylene resin (°C Dick: manufactured by Mitsubishi Yuka) was molded using an extrusion molding machine (
The inner layer film obtained by extruding the inner layer film to a thickness of 30 mm at 280°C (280°C) is laminated onto the outer layer PET film via a sea car coating agent in the softened state immediately after extrusion.
A composite film was obtained.

The nine composite films obtained by pressing in this manner were stacked on the same plywood as in Example 1, and heated to 125°C to produce 10 Kf/+.
J. Pressed for 3 minutes, heated for 30 seconds to remove air, and then pressed for another 30 seconds to obtain a board for cosiclete formwork with a composite film adhered to the plywood surface.

With this product, there is no delamination or blistering between the inner layer film and the outer layer film of the composite film, and it is possible to obtain a board for cosiclete formwork with a beautiful surface, and it is also durable at high temperatures. When attaching the composite film to plywood, the composite film did not adhere to the heat and peel off from the plywood.

<Example 4> In the same manner as in Example 3, a large number of through holes with a diameter of 50 mm were formed over the entire surface of the composite film by electric discharge hole machining, and these were placed on the same plywood as in Example 1. The sheets were overlapped and pressed at a temperature of 125° C. at 10 Kp/cII for 3 minutes to obtain a board for a cosiclete formwork in which composite film V was adhered to the surface of the plywood.

In this case, no delamination or blistering was observed between the inner layer film and the outer layer film of the Gogogo film O, and it was possible to obtain a board for cosiclete formwork that was stable. Furthermore, when attaching a composite film to plywood at high temperatures, there is no chance that the composite film will adhere to the heat and peel off from the plywood. Also, in this case, there is no need to perform the air bleeding operation. Furthermore, in the product plate, the through holes have disappeared.

[Brief explanation of the drawing]

1 and 12 are schematic diagrams of the conventional example, FIG. 3 is a schematic diagram showing the corona discharge treatment in the present invention, and FIG. 4 is a schematic diagram showing the lamination of the inner layer film and the outer layer film in the same as above. Figure 5 is a schematic diagram showing the operation of fusing the composite film to the wooden board in the same manner as above, Figure 6 is a schematic diagram showing the combination of the inner layer film and the outer layer film on the other side of the present invention, and Figure 7. is an enlarged sectional view of the composite film on the other side. +1) is a film for the inner layer, (2) is a film for the outer layer, (
S) is a composite film, (4) is a wooden board, (6) is an adhesive, (6) is an anchor coating agent, and (7) is a through hole. Agent Patent attorney Ishi 1) Head Upper plan 1 Figure mouth===]-4 Figure 2 Figure 3 η Figure 4 Figure 5 ＼ P-

Claims (1)

[Claims] (Hot) A synthetic resin inner layer film and a synthetic resin outer layer film whose melting temperature is higher than that of the inner layer film are bonded together after corona discharge treatment to form a composite film, and the composite film is bonded to a wooden board. A wood material characterized by stacking a composite film on the inner layer film side and thermocompression bonding the composite film to a wooden board under heating conditions at a temperature between the melting temperature of the inner layer film and the melting temperature of the outer layer film. The surface of the board is determined. (i) The wood material described in item 1 of the scope of patent II, characterized in that a composite film is formed by subjecting the inner layer film and the outer layer film to corona discharge treatment, and then bonding both films with an adhesive. A method for surface treatment of a board. (3) A method for surface treatment of a wooden board according to claim 2, characterized in that a uretaceous adhesive is used as the adhesive. A method for surface treatment of a wood board according to item 1, in which after discharge treatment, an Ashikar coating agent Tk is applied to the extrusion molded rod. (6) An isocyanate-based anchor coating agent is used. A method for surface treatment of a wooden board according to claim 4. (6) Corona discharge treatment of a synthetic resin inner layer film and a synthetic resin outer layer film whose melting temperature is higher than that of the inner film B. It is then glued together to form a composite film.
After making a large number of fine through-holes on the entire surface of the composite film, the composite film is stacked on the wooden board on the inner layer film side, and the temperature is between the melting temperature of the inner layer film and the outer layer film. A method for surface treatment of wooden boards, characterized by thermocompression bonding of a composite film to the wooden boards under heating conditions.