JPS58155837U - 半導体用ボンデイングワイヤ−スプ−ル - Google Patents

半導体用ボンデイングワイヤ−スプ−ル

Info

Publication number
JPS58155837U
JPS58155837U JP1982052872U JP5287282U JPS58155837U JP S58155837 U JPS58155837 U JP S58155837U JP 1982052872 U JP1982052872 U JP 1982052872U JP 5287282 U JP5287282 U JP 5287282U JP S58155837 U JPS58155837 U JP S58155837U
Authority
JP
Japan
Prior art keywords
semiconductors
spool
bonding wire
wire spool
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982052872U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0128680Y2 (https=
Inventor
岡本　年雄
横岡　正行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP1982052872U priority Critical patent/JPS58155837U/ja
Publication of JPS58155837U publication Critical patent/JPS58155837U/ja
Application granted granted Critical
Publication of JPH0128680Y2 publication Critical patent/JPH0128680Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Winding Filamentary Materials (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP1982052872U 1982-04-12 1982-04-12 半導体用ボンデイングワイヤ−スプ−ル Granted JPS58155837U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982052872U JPS58155837U (ja) 1982-04-12 1982-04-12 半導体用ボンデイングワイヤ−スプ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982052872U JPS58155837U (ja) 1982-04-12 1982-04-12 半導体用ボンデイングワイヤ−スプ−ル

Publications (2)

Publication Number Publication Date
JPS58155837U true JPS58155837U (ja) 1983-10-18
JPH0128680Y2 JPH0128680Y2 (https=) 1989-08-31

Family

ID=30063565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982052872U Granted JPS58155837U (ja) 1982-04-12 1982-04-12 半導体用ボンデイングワイヤ−スプ−ル

Country Status (1)

Country Link
JP (1) JPS58155837U (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5554941U (https=) * 1978-10-11 1980-04-14
JPS55151346A (en) * 1979-05-16 1980-11-25 Toshiba Corp Container for winding metallic fine wire

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5554941U (https=) * 1978-10-11 1980-04-14
JPS55151346A (en) * 1979-05-16 1980-11-25 Toshiba Corp Container for winding metallic fine wire

Also Published As

Publication number Publication date
JPH0128680Y2 (https=) 1989-08-31

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