JPS59101438U - キヤピラリチツプ - Google Patents

キヤピラリチツプ

Info

Publication number
JPS59101438U
JPS59101438U JP20004882U JP20004882U JPS59101438U JP S59101438 U JPS59101438 U JP S59101438U JP 20004882 U JP20004882 U JP 20004882U JP 20004882 U JP20004882 U JP 20004882U JP S59101438 U JPS59101438 U JP S59101438U
Authority
JP
Japan
Prior art keywords
capillary
capillary chip
chip
pressure section
capillary tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20004882U
Other languages
English (en)
Inventor
江村　隆司
Original Assignee
三洋電機株式会社
東京三洋電橋機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社, 東京三洋電橋機株式会社 filed Critical 三洋電機株式会社
Priority to JP20004882U priority Critical patent/JPS59101438U/ja
Publication of JPS59101438U publication Critical patent/JPS59101438U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のキャピラリチップを説明する側面図、第
２図は従来のキャピラリチップの毛管を説明する断面図
、第３図は本考案のキャピラリチップを説明する側面図
、第４図は本考案のキャピラリチップの毛管を説明する
断面図である。　　　　　−１１、はキャピラリチップ
、１２は加圧部、１３はリード線、１４は溝、１５は毛
管である。、。

Claims (1)

    【実用新案登録請求の範囲】
  1. キャピラリチップ先端に設けられた加圧部と該加圧部よ
    り上方に位置しリード線を給送子る毛管を具備するキャ
    ピラリチップに於いて、前記毛管を断面楕円形状として
    成るキャピラリチップ。
JP20004882U 1982-12-27 1982-12-27 キヤピラリチツプ Pending JPS59101438U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20004882U JPS59101438U (ja) 1982-12-27 1982-12-27 キヤピラリチツプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20004882U JPS59101438U (ja) 1982-12-27 1982-12-27 キヤピラリチツプ

Publications (1)

Publication Number Publication Date
JPS59101438U true JPS59101438U (ja) 1984-07-09

Family

ID=30425580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20004882U Pending JPS59101438U (ja) 1982-12-27 1982-12-27 キヤピラリチツプ

Country Status (1)

Country Link
JP (1) JPS59101438U (ja)

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