JPS5815497Y2 - Mother plate used for seed plate production - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a mother plate for manufacturing a seed plate used as a cathode during electrolytic refining of metal.

Conventionally, in such a mother plate for producing seed plates, an insulating material is attached to the outer peripheral edge of the metal plate, and the metal surface surrounded by the insulating material is used as a cathode for depositing the seed plate.

Therefore, the conventional motherboard weighs 30 to 40 kg, and large-scale equipment such as a crane is required to suspend and transport a large number of such motherboards to the electrolyte tank.

In addition, the seed plate deposited on the mother plate must have a constant shape and the outer periphery must be as straight as possible. When peeling off, mechanical force is applied to the vinyl chloride insulation part provided on the outer periphery of the motherboard, which causes severe damage to the insulation part. The problem was that it could not be done.

Further, due to the damage to the insulating part, metal was electrodeposited on the damaged part, making it impossible to carry out the electrolytic operation for obtaining the seed plate well.

Furthermore, an insulating part is provided on the outer periphery of the metal base plate for 3 to 4 m.
Since it is made of m-thick vinyl chloride, when peeling the seed plate from the base plate, a peeling tool is used to hit the metal base plate, which will also damage the metal base plate that will be the electrodeposited surface. As a result, it was not possible to perform a desirable electrolytic operation.

In addition, we have also proposed a motherboard for manufacturing seed plates, in which the base of the motherboard is made of an insulating material, and a metal plate is laminated on the surface of the insulating material, either integrally during the molding of the motherboard or by bonding with an adhesive. has been done.

However, with this conventional motherboard, there are problems with the laminated structure of the insulating substrate and the metal plate, namely, the manufacturing process, especially the post-processing, is troublesome and expensive in the molding method, and in the case of using an adhesive, There is a problem that the adhesive is attacked by the electrode waves.

In view of the above points, the present invention is lightweight and easy to handle, has good peeling workability of the seed plate, and has a metal foil on the surface of the insulating outer skin containing fluororesin of the base plate. The object of the present invention is to provide a mother plate used for manufacturing seed plates that can be simply and firmly attached by pressure bonding.

Next, an embodiment of the mother plate for seed plate production according to the present invention will be described with reference to the drawings.

Figure 1 is a front view of the mother plate according to the present invention, and Figure 2 is the same II.
FIG. 3A is an enlarged sectional view of the main part taken along the line -II'.

B and C are explanatory diagrams showing the manufacturing procedure of the mother plate.

In the figure, reference numeral 1 denotes a motherboard, and this motherboard 1 has a motherboard base 2 made of an insulating material. In this embodiment, as shown in FIG. It is composed of a core material 3 made of a lightweight material such as plastic wood, and an insulating outer skin part 4 made of an FRP material containing fluororesin, which encloses the core material 3.

Metal foils 5, 5 made of copper, titanium, tin, etc. are bonded by thermocompression bonding to the inner side of both sides of the base plate base 2 having the above structure, leaving both side edges and the lower edge, and the base plate made in this way 1, an inverted U-shaped mother plate suspension bong 6 is fixed with screws 7 so as to be in contact with the metal foils 5, 5.

Further, a mother plate support beam 8 is inserted and supported in the mother plate suspension bong 6 in parallel with the upper side of the mother plate 1, and the metal foil 5 near the base side of the mother plate suspension bong 6 is supported. ,5
Strip-shaped insulating materials 9, 9 are applied parallel to the upper side of the base plate 1 on the surface thereof.

The surface of the metal foil 5 located below the insulating material 9 serves as a cathode for depositing the seed plate, and this cathode is electrically connected to the base plate support beam 8 via the base plate suspension bong 6. There is.

As a result of trial manufacturing of the mother plate 1 using copper foil as the metal foil 5, a copper foil with a thickness of 70μ was applied to the base 2 using a hot platen press at a temperature of 380°C, a pressure of 50kg/cm2, and a time of 3 to 5 minutes. When thermocompression bonding was carried out under the conditions of 2.8
A peel strength of kg/cm was obtained.

Note that the thickness of this metal foil 5 is in the range of 25 to 100 microns.

To manufacture the above-mentioned base plate 1, first, as shown in FIG. 3A, the metal foil 5 is adhered to the base body 2 by thermocompression bonding, and then, as shown in FIG. The plate suspension bong 6 and the base plate support beam 8 are attached, and then an insulating material 9 is applied as shown in FIG. 3C.

The base plate 1 thus produced is submerged in the electrolytic solution 10, and the base plate 1 is held so that the liquid level 10a of the electrolytic solution 10 is located within the range of the insulating material 9. When a voltage is applied using the foil 5 as a cathode, a metal serving as a seed plate is deposited on the surface of the metal foil 5.

When the thickness of the deposited metal reaches about 0.7 mm, the electricity is turned off and the deposited metal is peeled off from the surface of the metal foil 5 by applying mechanical force.

At this time, the length and width of the deposited metal are approximately 1 to 2 mm larger than the overall size of the metal foil 5.

Therefore, even if mechanical force is applied between the base plate base 2 and the metal to be peeled off, the metal foil 5 will not be damaged.

This is because the metal foil is bonded to the base plate by thermocompression bonding, so the top surfaces of the base plate 2 and the metal foil 5 are located on the same plane (Fig. 2), and the peeling container device is This is because it ends up only damaging the mother plate base 2 at the outer periphery.

In addition, this metal foil 5 is adhered to the outer skin 4 of the motherboard substrate containing fluororesin by thermocompression bonding, and there is no need to use an adhesive, so the attachment work is simple and strong, and the service life can be extended. It is something that can be achieved.

Further, since the base plate 2 is made of an insulating material unlike conventional metals, a preferable electrolytic operation can be performed even if the base plate 2 is damaged.

For this reason, a uniform seed plate can always be obtained.

What is more preferable is that the lifespan of the base plate is dramatically extended, and a lifespan of at least 1 to 2 years can be expected.

In addition, the proportion of metal that makes up the base plate 1 is small, and the weight is said to be about the same as before, making it easier to handle, and equipment such as cranes for manipulating the base plate is also lighter. Anything is fine.

Further, in this embodiment, the base plate is made to have a constant thickness, and the core material 3 is embedded in the base body 2 in order to prevent warping of the base body due to copper electrodeposition.

As the core material 3, there is no need to take acid resistance into consideration, and a low-lying material can be used, and the mother board 1 can be provided at low cost.

As explained above, according to the present invention, the base of the mother plate is
The outer circumferential surface of the core material made of lightweight material is covered with an insulating outer skin part, and a 100μ
Since the metal foil with the following thickness was crimped,
Overall, it is lightweight and easy to handle, and can be provided at low cost, and has the effect of reducing the weight of devices such as cranes for operating the base plate.

Further, according to the present invention, the outer skin of the motherboard substrate is formed of an insulating material containing fluororesin, and the metal foil is bonded to the outer skin by thermocompression bonding, so that the manufacturing process, especially the metal foil, is difficult. Not only is the fixing work easy and efficient, but the fluororesin is melted during this thermocompression bonding to firmly integrate and fix, and an acid-resistant adhesive is used between the outer skin and the metal foil. This has the advantage of being structurally robust and extending its lifespan since there is no need to do so.

Furthermore, since the outer skin of the base is made of fluororesin, it has excellent acid resistance and heat resistance, and also has the effect of facilitating the above-mentioned thermocompression bonding work.

In addition, since the thickness of the metal foil mentioned above is said to be 25 to 100μ, generally when copper foil is used as the metal foil, this thickness is the most easily available and economical, 25μ.
If the thickness is less than 100μ, it may be difficult for the required current to flow, but this does not occur in the case of the present invention. The present invention has excellent practical effects such as being lightweight and having good releasability.

[Brief explanation of the drawing]

The figures show an embodiment of the motherboard according to the present invention, and FIG. 1 is a front view of the motherboard, FIG. 2 is an enlarged cross-sectional view of the main part taken along line III', and FIGS. 3A and B. , C are explanatory diagrams showing the manufacturing procedure of the mother plate. 1...Mother board, 2...Mother board base, 3...
... Core material, 4 ... Insulating outer skin part, 5 ...
...Metal foil as a cathode.

Claims (2)

[Scope of utility model registration request] (1) In the base plate used for manufacturing seed plates used in electrolytic refining of metals, the base plate has a core material made of a lightweight material and an insulating material made of a material containing fluororesin that covers the outer peripheral surface of the core material. A metal foil with a thickness of 25 to 100 μm is bonded to the surface of this mother plate by thermocompression bonding, and the surface of this metal foil is used as a cathode for depositing the seed plate. The base plate used for the seed plate structure. (2) The insulating outer skin portion is a base plate used for manufacturing a seed plate according to claim 1, wherein the insulating outer skin portion is formed of an FRP material containing a fluororesin.