CN211744859U - Welding structure of FPC voltage acquisition piece - Google Patents
Welding structure of FPC voltage acquisition piece Download PDFInfo
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- CN211744859U CN211744859U CN202020625447.9U CN202020625447U CN211744859U CN 211744859 U CN211744859 U CN 211744859U CN 202020625447 U CN202020625447 U CN 202020625447U CN 211744859 U CN211744859 U CN 211744859U
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- voltage acquisition
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Abstract
The utility model discloses a welding structure of a voltage acquisition sheet of a FPC (flexible printed circuit), which comprises a FPC base material, a bonding pad, a first film and a voltage acquisition sheet; the surface of the FPC base material is provided with a circuit, the bonding pad is arranged on the surface of the FPC base material, and the bonding pad is electrically connected with the circuit; the first coating is arranged on the surface of the FPC base material, the first coating partially covers the bonding pad, and a notch groove is formed in the edge of the first coating; one end of the voltage acquisition sheet is provided with a welding part, the welding part is welded and fixed on the pad through a solder layer, and the solder layer and the welding part are both positioned in the notch groove. The breach groove has been seted up through the edge that is provided with first tectorial membrane to cooperation weld part passes through solder layer welded fastening on the pad, and solder layer and weld part all are located the breach inslot, avoid appearing rosin joint, the not firm condition of welding, prevent effectively that voltage acquisition piece from being peeled off, have effectively promoted voltage acquisition piece job stabilization nature through reflow soldering, and the production qualification rate of product is also higher simultaneously.
Description
Technical Field
The utility model relates to a voltage acquisition piece field technique especially indicates a welded structure of FPC flexible line way board voltage acquisition piece.
Background
Along with the increasing exhaustion of traditional energy sources and the increasing severity of environmental pollution, the nation provides strategies for energy conservation, emission reduction and low-carbon economy development, batteries are widely applied due to the characteristics of convenience, rapidness, cyclic utilization and the like in the application process, in order to obtain high power and large capacity, single batteries are required to be connected in series and in parallel to form a battery pack, in order to ensure that the battery pack can normally work, a battery management system is required to uniformly monitor the battery pack in real time, one monitoring link is to monitor the voltage of each single battery in the battery pack, the voltage value of each single battery is required to be collected in real time, and the performance of each single battery is judged.
The voltage acquisition piece that has now is put up on first tectorial membrane completely with flexible circuit board welded fastening time voltage acquisition piece, the tectorial membrane can hold in the palm the voltage acquisition piece, make the acquisition piece can not fully contact with the solder, form the lid effect between voltage acquisition piece and the pad, rosin joint appears easily, the not jail scheduling problem of welding, lead to the solder joint reliability not high, it is peeled off easily to gather the piece, the job stabilization nature of voltage acquisition piece is also not good, the production qualification rate of product is also lower, consequently, it is necessary to make further improvement to current voltage acquisition substrate welded structure.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model discloses to the disappearance that prior art exists, its main objective provides a welded structure of FPC flexible line way board voltage acquisition piece, and it can effectively solve the problem that rosin joint appears easily when current voltage acquisition piece welded structure welds, welds infirm, the solder joint reliability is not high, voltage acquisition piece is peeled off easily, job stabilization nature is not good and the production qualification rate is lower.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a welding structure of a voltage acquisition sheet of an FPC (flexible printed circuit) comprises an FPC base material, a bonding pad, a first coating film and a voltage acquisition sheet; the surface of the FPC base material is provided with a circuit, the bonding pad is arranged on the surface of the FPC base material, and the bonding pad is electrically connected with the circuit; the first coating is arranged on the surface of the FPC base material, the first coating partially covers the bonding pad, a notch groove is formed in the edge of the first coating, the notch groove is located right above the bonding pad, and the outer side edge of the notch groove is open; one end of the voltage acquisition sheet is provided with a welding part, the welding part is welded and fixed on the pad through a solder layer, the solder layer is clamped between the welding part and the pad, the solder layer and the welding part are both positioned in the notch groove, and the other end of the voltage acquisition sheet extends out of the outer side edge of the notch groove.
Preferably, the bottom surface of the FPC substrate is provided with a second coating.
Preferably, the pad is an OSP pad.
Preferably, the first coating film covers three edges of the bonding pad.
Preferably, the notch groove is square.
Preferably, the voltage collecting sheet is a nickel sheet.
Compared with the prior art, the utility model obvious advantage and beneficial effect have, particularly, can know by above-mentioned technical scheme:
cover the pad through being provided with first tectorial membrane part, and the breach groove has been seted up at the edge of first tectorial membrane, this breach groove is located the pad directly over, the outside limit in breach groove is opened, and the cooperation weld part passes through solder layer welded fastening on the pad, the solder layer presss from both sides and locates between weld part and the pad, and solder layer and weld part all are located the breach inslot, make voltage acquisition piece can not be held up by the tectorial membrane, can fully contact between voltage acquisition piece and the solder layer, avoid appearing the rosin joint, the not firm condition of welding, can effectively prevent that voltage acquisition piece from being peeled off, the reliability of solder joint has been guaranteed, and make through reflow soldering to form toe type solder joint between voltage acquisition piece and the substrate circuit, the stability of voltage acquisition piece work has effectively been promoted, the production qualification rate of product is also higher simultaneously.
To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is an exploded view of a preferred embodiment of the present invention;
fig. 2 is a schematic cross-sectional view of a preferred embodiment of the present invention.
The attached drawings indicate the following:
10. FPC substrate 20, pad
30. First coating film 31, notch groove
40. Voltage collecting piece 41 and welded part
50. Second coating film 60, circuit
70. And a solder layer.
Detailed Description
Referring to fig. 1 to 2, a specific structure of a preferred embodiment of the present invention is shown, which includes an FPC substrate 10, a bonding pad 20, a first coating 30 and a voltage collecting plate 40.
The second coating film 50 is provided on the bottom surface of the FPC base 10, and the wiring 60 is provided on the surface of the FPC base 10. The bonding pads 20 are disposed on the surface of the FPC base 10, and the bonding pads 20 are electrically connected to the wires 60, in this embodiment, the bonding pads 20 are OSP bonding pads.
The first coating 30 is disposed on the surface of the FPC base 10, the first coating 30 partially covers the pad 20, and a notch 31 is opened at an edge of the first coating 30, the notch 31 is located right above the pad 20, and an outer side of the notch 31 is opened. In the present embodiment, the first coating film 30 covers three sides of the pad 20, and the notch groove 31 has a square shape.
One end of the voltage collecting sheet 40 is provided with a welding part 41, the welding part 41 is welded and fixed on the pad 20 through a solder layer 70, wherein the voltage collecting sheet 40 is welded and fixed on the pad through a reflow soldering mode, which is beneficial to the outward excretion of flux residues, the voltage collecting sheet 40 and the circuit 60 form a toe-shaped welding point, thereby improving the reliability of welding, the solder layer 70 is clamped between the welding part 41 and the pad 20, the solder layer 70 and the welding part are both positioned in the notch groove 31, and the other end of the voltage collecting sheet 40 extends out of the outer side of the notch groove 31. In the present embodiment, the voltage collecting plate 40 is a nickel plate.
Detailed description the manufacturing process of this embodiment is as follows:
during manufacturing, the bonding pad 20 and the circuit 60 are etched on the FPC substrate 10 by electroplating, then the second coating film 50 is attached to the bottom surface of the FPC substrate 10, the first coating film 30 is attached to the upper surface of the substrate 10, the position of the notch groove 31 on the first coating film 30 corresponds to the position of the bonding pad 20, the notch groove 31 covers three sides of the bonding pad 20, then solder and soldering flux are placed on the bonding pad 20 and in the notch groove 31, the welding part 41 of the voltage acquisition sheet 40 is covered on the solder and the soldering flux, and finally, the welding part 41 of the voltage acquisition sheet 40 is fixed on the bonding pad 20 by soldering through the solder layer 70 by reflow soldering, so that the manufacturing of the embodiment is completed finally.
The utility model discloses a design focus lies in: cover the pad through being provided with first tectorial membrane part, and the breach groove has been seted up at the edge of first tectorial membrane, this breach groove is located the pad directly over, the outside limit in breach groove is opened, and the cooperation weld part passes through solder layer welded fastening on the pad, the solder layer presss from both sides and locates between weld part and the pad, and solder layer and weld part all are located the breach inslot, make voltage acquisition piece can not be held up by the tectorial membrane, can fully contact between voltage acquisition piece and the solder layer, avoid appearing the rosin joint, the not firm condition of welding, can effectively prevent that voltage acquisition piece from being peeled off, the reliability of solder joint has been guaranteed, and make through reflow soldering to form toe type solder joint between voltage acquisition piece and the substrate circuit, the stability of voltage acquisition piece work has effectively been promoted, the production qualification rate of product is also higher simultaneously.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.
Claims (6)
1. The utility model provides a welded structure of FPC flexible line way board voltage acquisition piece which characterized in that: the device comprises an FPC base material, a bonding pad, a first coating film and a voltage acquisition sheet; the surface of the FPC base material is provided with a circuit, the bonding pad is arranged on the surface of the FPC base material, and the bonding pad is electrically connected with the circuit; the first coating is arranged on the surface of the FPC base material, the first coating partially covers the bonding pad, a notch groove is formed in the edge of the first coating, the notch groove is located right above the bonding pad, and the outer side edge of the notch groove is open; one end of the voltage acquisition sheet is provided with a welding part, the welding part is welded and fixed on the pad through a solder layer, the solder layer is clamped between the welding part and the pad, the solder layer and the welding part are both positioned in the notch groove, and the other end of the voltage acquisition sheet extends out of the outer side edge of the notch groove.
2. The welding structure of the FPC flexible circuit board voltage acquisition sheet according to claim 1, wherein: and a second coating film is arranged on the bottom surface of the FPC base material.
3. The welding structure of the FPC flexible circuit board voltage acquisition sheet according to claim 1, wherein: the pad is an OSP pad.
4. The welding structure of the FPC flexible circuit board voltage acquisition sheet according to claim 1, wherein: the first cover film covers three edges of the bonding pad.
5. The welding structure of the FPC flexible circuit board voltage acquisition sheet according to claim 1, wherein: the gap groove is square.
6. The welding structure of the FPC flexible circuit board voltage acquisition sheet according to claim 1, wherein: the voltage acquisition sheet is a nickel sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020625447.9U CN211744859U (en) | 2020-04-23 | 2020-04-23 | Welding structure of FPC voltage acquisition piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020625447.9U CN211744859U (en) | 2020-04-23 | 2020-04-23 | Welding structure of FPC voltage acquisition piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211744859U true CN211744859U (en) | 2020-10-23 |
Family
ID=72851137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020625447.9U Active CN211744859U (en) | 2020-04-23 | 2020-04-23 | Welding structure of FPC voltage acquisition piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211744859U (en) |
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2020
- 2020-04-23 CN CN202020625447.9U patent/CN211744859U/en active Active
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