JPS58153697A - Heat-sensitive stencile paper - Google Patents

Abstract

PURPOSE:To provide the titled stencile paper which is capable of providing an explicit picture having no wrinkle, and a high resolution, by a method wherein a polyester film and a porous thin paper or a netlike sheet are adhered together, and a particular silicon coating layer is formed on said film surface. CONSTITUTION:A polyester film with a thickness of preferably 2-8mum and a porous thin paper or a netlike sheet are adhered together by the use of an adhesive, and silicon cured at room temperature is then applied on said film surface so that the work weighs 0.02-2g/m<2> on a dry basis.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat-sensitive stencil paper in which a polyester film and a porous tissue paper or mesh-like sheet are bonded together with an adhesive, and a silicone coating layer is provided on the surface of the polyester film.

Conventionally, a major drawback of heat-sensitive stencils has been the problem of fusion between the film of the heat-sensitive stencil and the original during plate-making, especially when using PPC originals copied with a developer such as toner containing epoxy resin. In some cases, the fusion was so severe that not only the manuscript but also the plate itself was damaged.

In order to prevent this fusion, it is recommended to provide a release layer on the surface of the film that comes into contact with the original, as described in, for example, No. 43-10093.
This method has been proposed in Japanese Patent Publication No. 47-5139, Japanese Patent Publication No. 1009-1988, Japanese Patent Publication No. 1531-1973, Japanese Patent Publication No. 30570-1977, etc.

In these prior art, powder, sodium stearate, surfactant, and silicone are used as materials to prevent the film from adhering to the document, but materials other than silicone are insufficient to prevent adhesion, and perforation is insufficient. The clarity is also poor. As the silicone, a high temperature curing type (cured at 100° C. or higher) silicone resin or silicone oil is used.

When using high-temperature curing silicone resin to form a release layer on a film, it is necessary to heat it to 100°C or higher to cure it, but since the film is very thin at 2 to 6 μm, fine wrinkles may be caused by heating. occurs. These wrinkles extremely deteriorate the adhesion between the document and the film during plate making, and reduce the clarity of the perforation scratches.

Furthermore, when silicone oil is used, since it is liquid at room temperature, there are drawbacks such as staining the original during plate making, or creating stickiness when applying the release layer by hand, and causing the silicone oil to transfer to hands.

The present invention provides a heat-sensitive stencil paper which has improved the above-mentioned drawbacks.

That is, the present invention provides a heat-sensitive stencil paper in which a polyester film and a porous thin paper or a mesh-like sheet are bonded together with an adhesive, and a silicone coating layer is provided on the surface thereof, in which a room temperature curing silicone is used as the silicone. This is a heat-sensitive stencil paper with the following characteristics.

The polyester film used in the present invention preferably has a thickness of 2 to 8 μm, and the porous thin paper is made of natural fibers such as manila hemp, kozo, and mitsumata, synthetic fibers such as tetoron, vinylon, and acrylnato, and semi-fabric fibers such as rayon. Basis weight 5-l 5 f/vr made from synthetic fiber as main raw material
? Can be used to a certain degree.

Furthermore, the mesh-like sheet is preferably one woven from fibers of nylon, polyester, polypropylene, etc. having a thickness of 30 to 50 microns, and the lattice spacing is 50 to tso microns.

Adhesives include vinyl acetate resin, acrylic resin,
Although various resins such as polyester resins can be used, linear polyester resins are most suitable because they can firmly adhere the polyester film and porous thin paper in small amounts.

Next, the room temperature curing silicone used in the present invention includes all those whose curing reaction proceeds at a temperature of 70°C or lower, such as Toray Silicone 5R2400 resin manufactured by Toray Silicone Co., Ltd., Toray Silicone SR24
10 resin, Toray Silico-7SR241 resin, and the like.

The effect of preventing fusion is greatly affected by the amount of silicone applied, and the effect increases as the amount of silicone applied increases. However, if the coating amount is too large, the energy required for plate making will increase and the clarity of the perforated image will also drop significantly. Therefore, in order to obtain a practically satisfactory adhesion prevention effect, it is necessary to apply an appropriate amount, and in the heat-sensitive stencil paper of the present invention, a dry weight of 0.02 to 2 t/wl is suitable.

The thermal stencil paper of the present invention has the following features and advantages.

1) No heat treatment is required to cure the silicone, so the polyester film does not shrink due to heat.
It does not cause any wrinkles that prevent reproduction of the original image.

2) Since it forms a cured film, it does not migrate like silicone oil and does not contaminate anything that comes into contact with the silicone film layer.

3) Silicone has high mold releasability and is extremely effective in preventing fusion, and since it is effective with a small amount of application, the perforation image is sharp and has high resolution.

4) Silicone has a low surface tension and silicone paint spreads easily on the film surface, so it spreads over all parts and forms a thin film.

5) Since the silicone cured film is chemically inert, it has long-term storage stability.

The present invention will be specifically explained below with reference to Examples.

Example 1' A saturated polyester resin (manufactured by Toyobo Co., Ltd., Pylon 30o) was dissolved in methyl ethyl keto/ to prepare an adhesive solution with a solid content concentration of 1o.

Using this adhesive, a polyester film with a thickness of 4 μm and a porous tissue paper with a thickness of 27 μm and a basis weight of 8.7 f/d were bonded together to prepare a heat-sensitive stencil paper. This is the standard product.

Next, a 1% methyl ethyl ketone solution of Toray Silicone 5R2411 was applied as a release agent to the film surface of the standard product, dried at 4°C for 15 minutes to form a release layer, and left at room temperature for 3 days.

The coating amount of the release layer was 0.19/lI.

Comparative Example 1 A 1% n-hex/solution of silicone oil was applied as a release agent to the film surface of the marked product prepared in Example 1, and dried at 40°C to form a release layer. The coating amount of the release layer was 0.2 f/rrl.

Comparative Example 2 High temperature curing type Shin-Etsu Silico-7KS7071 as release agent
．． Add 4 parts by weight of catalyst PL-3 to 100 parts by weight,
A solution was made with n-hexane, and this solution was applied to the surface of the standard film prepared in Example 1, and heated for 10 seconds at 130°C, which is the minimum heating temperature required to cure this silicone release agent. ,Met. Under these curing conditions, fine wrinkles appeared in the heat-sensitive stencil paper due to heat shrinkage of the film.

Wrinkles caused by heat shrinkage of the film during heat drying are 7.
It started to occur around 0°C.

Example 2 As a release agent, 4 parts by weight of catalyst 5PX242AC was added to 100 parts by weight of Toray Silicone 5R2400, and n
- This solution was diluted with hexane and applied to the surface of the standard film prepared in Example 1, dried at 40°C to form a release layer, and left at room temperature for 3 days. The coating amount of the release layer is 0.159/n? Met.

The heat-sensitive stencil sheets of Examples and Comparative Examples prepared as described above were plate-made using a plate-making machine (manufactured by Riso Kagaku Kogyo Co., Ltd., FK-150).

First, a copy was made on paper using a PPC copier (manufactured by Sharp Corporation, 5F740), and the photocopy was brought into close contact with the film surface of the heat-sensitive stencil paper, and exposed to xenon flash from the thin paper surface at a light intensity of S-5. Then, a perforation corresponding to the original image was formed, the original was separated, and a stencil for mimeograph printing was created.

This stencil is transferred to a rotary copying machine (REX ROTARY t
ooo).

In the case of the standard product, when separating the original after xenon furanoche irradiation, the thick text or solid printing part of the original was fused to the film surface □:, so the fused part of the thermal stencil paper and the surrounding area were also damaged. Damaged. .

Furthermore, fine fusion occurs even in thin and small letters,
This resulted in so-called printing failure. When this stencil was used for printing, excessive amount of mimeograph ink passed through the fused area and surrounding areas, making it impossible to obtain a printed image that reproduced the original image.

On the other hand, in the embodiment of the present invention, there are no wrinkles and no silicone migration, so there is no problem when separating the original after xenon flash irradiation, the separation is easy, and there is no fusion to the original or the perforated part. No clothing was allowed. In printing, the flow of mimeograph ink is extremely good, and as a result, the printed image is extremely clear and has a good quality of over 5000 copies.
Moreover, it was possible to obtain printed matter that faithfully reproduced the original image.

On the other hand, in Comparative Example 1, the silicone migrated to the original and seriously stained the original. In addition, the original was fused to the area where the silicone had transferred, resulting in plate removal.

A clear image could not be obtained when printing using this plate. In the case of Comparative Example 2, the wrinkles that occurred during heating and drying after silicone application inhibited the adhesion between the film surface and the original during plate making, and the areas that did not adhere were not perforated, making it impossible to obtain a printed image that reproduced the original image. I couldn't.

patent applicant Tomoekawa Paper Mill Co., Ltd. Manual continuation supplementary book φ month Iz day, 1981 l　Chief of the Patent Office Shima 1) Haru Itsuki-dono 1.Display of the incident 1981 Patent Application No. 36604 2. Name of the invention Thermal stencil paper 3. Person who makes corrections Relationship to the case Patent applicant spontaneous correction 5. Subject of correction 11) Page 1 Amend the "Claims" as shown in the attached sheet.

(2) From the first line from the bottom of the first page to the first line of the second page, "with a developer made of a toner containing especially epoxy resin" is changed to "especially with a developer containing toner containing epoxy resin, urethane resin, or polyester resin.""Use a toner that

(3) Page 2, line 5 Correct "hours and minutes" to "4I Kimiaki."

(4) Page 2, line 9 "Prior art" is corrected to "publicly known art."

'(5) On page 2, line lθ, "powder" is corrected to "various fine powders of inorganic and organic substances."

(6) On page 2, line 13, “as a silicone” was changed to “7 used for this purpose”.
"As a recon," he corrected.

(7) Page 3, line 13 Correct "room temperature curing type" to "room temperature curing type".

(8) Page 3, line 18 Correct "Tetron" to "Polyester".

(9) On page 4, line 12, [at a temperature of 70°C or lower] is corrected to [without the need for heating above 100°C].

Correct rsPX242AcJ in the second line from the bottom of page 7 to rsRX242AcJ.

01 page 8 line 3 [0.15f/dJ is corrected as "1.5f tide".

Page 8, line 6 "Correct FK-150J to "FX-150."

(Attachment) 2. Claims A heat-sensitive stencil paper in which a polyester film and a porous thin paper or mesh-like sheet are bonded together with an adhesive, and a silicone coating layer is provided on the surface of the film,
A heat-sensitive stencil paper characterized in that a room temperature curing silicone is used as the silicone.

Claims (1)

[Claims] A heat-sensitive stencil paper in which a polyester film and a porous thin paper or a mesh-like sheet are bonded together with an adhesive, and a silicone coating layer is provided on the surface of the film,
A heat-sensitive stencil paper characterized in that a room temperature curing silicone is used as the silicone.