JPS58151465A - Method for plating on one side - Google Patents

Abstract

PURPOSE:To protect non-plating sides surely and to perform plating on one side satisfactorily, by adhering the circumferential edge parts of both materials to be plated having the mutually opposed non-plating sides watertightly by means of adhesive tapes then applying plating. CONSTITUTION:A double coated adhesive tape 4 is adhered to the circumferential edge part of the non-plating side 3 of one flat plate 1. The circumferential edge part of the non-plating side 3' of the other flat plate 1' is adhered to said tape 4, whereafter the adhered parts of both plates 1, 1' are pressurized with rolls or the like so as to be formed into one body watertightly. Electroplating is applied on the thickness surfaces of both plates 1, 1' which are formed into one body in the above-mentioned way, by bringing the same into contact 6 with a rack 5. Upon ending of the electroplating, the plates 1, 1' are disconnected by cutting the adhered parts of the tape 4 and the adhesive agents stuck and left on the circumferential edge parts of the non-plating sides 3, 3' are removed. Adhesive agents or the tape 4 and the adhesive agents are usable in place of the tape 4.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention deals with single-sided plating method 1, for example, a method of plating only one side of a flat plate such as aluminum. Conventionally, when plating only one side of a flat plate such as aluminum, plating is not performed. A method of masking the direction of the other side by applying a coating agent mainly composed of a polymer compound that is non-water-resistant and has #1 properties, and forming a film of this polymer compound. However, this method has the disadvantage that it takes a lot of effort and time to apply the coating agent and dry it to form a film.
Especially for large size aluminum etc.

flat. Since the plate area is large, it is difficult to apply the coating agent and dry it, and it is difficult to continuously plate long flat plates using this method.

Furthermore, this method can be used after plating! Since the skinning film is peeled off and removed, the film needs to be non-peelable, but for this reason, the film may not adhere to the flat plate sufficiently, and the parts that are not in close contact with each other in the plating column 1 will be torn and the parts will be plated. Especially for flat plates! The peripheral edge in the direction of skinder WK formation tends to peel off, and the plating solution and the cocoon Il&current solution permeate through this peripheral edge, often soaking the substrate or causing Wa plating. In particular, when the material is aluminum, a highly concentrated caustic alkaline solution or nitric acid solution is used for its pretreatment, and the pH of the plating solution is low for copper sulfate plating and talem plating, so it is difficult to prevent alkali and wrinkles. Even if a masking film is formed on the aluminum plate, which is easily corroded and prone to displacement plating, the dense layer properties cannot be ensured sufficiently as mentioned above, and liquids are particularly likely to penetrate from the periphery. As a result, corrosion and displacement plating often occur, resulting in a very high defective rate. In addition, such corrosion,
If displacement plating occurred, it was almost impossible to correct it back to its original state.

The present invention has been made in consideration of the above-mentioned circumstances, and when a flat plate or the like is plated on one side, the non-plated side is reliably maintained and the required surface is omitted.
It is an object of the present invention to provide a single-sided plating method that can satisfactorily perform one-sided plating on a single-sided surface, and can therefore be suitably applied to corrosive materials such as aluminum.

That is, in order to achieve the above object, the present invention has the non-plated surfaces of two objects to be plated facing each other, and the peripheral edges of these two wave-plated objects are liquid-tightly bonded together using an adhesive tape and/or an adhesive. After plating, the adhesive tape and/or the adhesive are removed after plating.

Hereinafter, one method of implementing the present invention will be explained with reference to FIGS. 1 to 3.

□ In the figure, 1 and 1' are flat plates such as aluminum that should be plated on one side 2 and 2', respectively. When plating one side 2.2' of these flat plates 1.11, first refer to Figure 1181 and As shown in Figure 2, a screen adhesive tape 4 with adhesive layers formed on both sides is attached to the peripheral edge of the non-plated side (not plated) 30 of one flat plate 1, and the adhesive tape 4 is attached to the periphery of the non-plated side 30 of one flat plate l. 1' non-plated surface 3I is opposed to the non-plated surface 3 of one flat plate 1, and the circumference kPs of the non-plated surface 3' of the other flat plate 1' is bonded to the double-sided adhesive chip 14,
Next, the pedestal parts (periphery parts) of both flat plates l and 1' are pressurized with a reel, etc., and the non-plated dIJ3.3 of both flat plates 1.1' is
'The peripheral edges are liquid-tightly adhered and integrated with each other via the screen adhesive tape 4.

Then, with both the flat plates 1 and 1' integrated in this way, as shown in FIG. Let's have a meeting.

Next, after electroplating, both flat plates 1.1'0ii11
1tII! Insert a cutter etc. between the adhesive tapes 4 and 1
Both flat plates 1, 1' pasted by both itim attachment pieces 14
This is to remove adhesive remaining on the periphery of the non-plated surfaces 3, 31 of both flat plates 1.1'. According to the single-sided plating method described above, one flat plate 1.1' is removed. Since the IIO non-meshed plates 1 and 3' are adhered with double-sided adhesive tape 4 at the periphery of the plate 1 and 1', these two flat plates 1 and 1'
The pretreatment solution and plating solution do not enter between the gaps, and therefore the non-plated surfaces 3, 3' of both flat plates 1, 1' are reliably aSS.
Although it is plated only on one side 2.2',
In this way, the two flat plates 1.1' are overlapped and pasted at the peripheral edge of the non-plated calligraphy 5aVo, which is different from conventional O.
Of course, there is no inconvenience such as the peripheral edge peeling off as with the Y masking film, and it is also impossible for the liquid to infiltrate into the interior from parts other than the peripheral edge i that are torn, so it is impossible for the non-plating 1its, s' to occur during one plating process. This ensures that the casing does not get infiltrated and corroded. Therefore, it is possible to suitably plate one side of a material such as 17# Mie λ, which is easily corroded and susceptible to displacement plating while maintaining its non-plated surface.

In addition, when electroplating both flat plates 1 and 1' that have been bonded and integrated, the non-plated rkJ3. Even if the thickness of the flat plate 1.11O is relatively thin, the thickness is sufficient to form a contact point. Therefore, as shown in FIG. 3, both flat plates 1.1' are pasted and integrated.
Since the contact point 6 can be made on the thick side, a good plating film can be formed on the entire surface 2, 2' to be plated. In other words, when electroplating an object to be plated, the contact point of the lamp (jig) to the object and its surroundings may become unplated, or good electrodeposition may not occur.
This causes so-called contact marks, but as mentioned above, the contact points 6 can be made on the thickness sides of both flat plates 1 and 1', so even if the contact marks occur on these thickness sides, only one side will be left behind. Since there are no contact marks on 2.2', a very good plating film can be obtained on the entire surface of 2, 2I on one side. To elaborate more on this point, conventional! In the single-sided plating method using the Sukinder coating Sugii method, it is difficult to make a contact point in the thickness direction of the flat plate, so it was necessary to make a contact point of the footer at the peripheral edge of the surface 20 of the flat plate l to be plated. As a result, the plating points on the flat plate 1 and their surroundings became unplated, and a good plating film was not obtained, leaving contact marks, so the entire surface 2 to be plated was left unplated. A good plating film was not formed over the period of time, and therefore, it was necessary to cut the peripheral edge of the flat plate 10 including the contact traces after the plating was completed. On the other hand, the above-described method of the present invention is a solution to the conventional masking film J11 method ogm, and since it can make contact with the thickness surface of the flat plate, it can be applied to the mz and 2z gold paintings to be plated. Good plating is applied throughout,
There is no need to cut the peripheral edge of the flat plate 1.1' after plating is completed.

Furthermore, according to the above-described method of the present invention, two flat plates 1.
It is efficient because it is possible to plate two sheets on one side at the same time by overlapping 1', and it is easy to bond the peripheral edges of the non-plated surfaces 3 and 3' of the two flat plates 1 and 1'. Therefore, operability is improved.Furthermore, when both flat plates 1 and 1' are cut after plating, the bonding tool 14
Even if the adhesive remains on the periphery of the non-plated surface 3.3', it can be easily removed with an organic solvent, so post-treatment can be easily carried out.

In addition, in the above-mentioned method, when pasting the non-plated surfaces 3.3'fi [Ii edges of both flat plates 1 and 1' with the double-sided layer chip 14, the double-sided layer tape 40 is placed in the adhesive layer formation direction on both sides. Both flat plates 1.1' may be adhered by further applying adhesive to each of them, so that both flat plates 1.1' and tj! Plating can be performed with the adhesive strength of the Ll, 1' threshold being further increased. Further, the non-plated peripheral edges Hs and s' of both flat plates 1 and 1' can be adhered by using only adhesive instead of the inward adhesive chip 14. In this case, it is preferable to use an adhesive that is water-insoluble, organic solvent-soluble, and whose main component is a thermoplastic resin.

Furthermore, in the above-mentioned method, when electroplating a long flat plate on one side, each of the two long flat plates are successively directed toward the plating processing apparatus with their non-plated surfaces facing each other. The tape and/or adhesive is continuously supplied to both edges of the plated surfaces of both valves in one direction, and then the long flat plates are guided to the pressurizer 4-k to press both long flat plates. The plating image is adhered continuously in a liquid-tight manner on both edges in one direction, and is continuously guided to a plating processing device to be continuously electroplated. After plating, the two integrated long flat plates are divided again using a cutter device. 1. Continuous single-sided plating can be performed by further removing adhering/remaining adhesive tapes and adhesives using an organic solvent cleaning device.

Furthermore, it goes without saying that the method described above can be applied to electroless plating, and the object to be plated is not limited to a flat plate. It is also possible to apply adhesive tape from the outside so as to cover the periphery of the surface to be plated.

As described in detail above, the present invention involves making the non-plating sides of two objects to be plated face each other, and bonding the peripheral edges of the inner objects to be plated liquid-tightly with adhesive tape and/or ff1INiI agent. , remove the plating, and after plating, apply the adhesive tape and/or
Alternatively, by removing the adhesive, when plating one side of an object to be plated such as a flat plate, the non-plated side can be reliably preserved and plated. This can be suitably implemented.

EXAMPLES Hereinafter, the present invention will be specifically explained with reference to Examples, but the present invention is not limited to the following Examples.

(Example) The non-plated surfaces of two 300 x 800 x 2.5-0 aluminum flat plates were placed opposite each other, and the peripheral edges of the non-plated surfaces were bonded using commercially available rIIi adhesive tape as shown in Figure 1.2. pasted on.

Next, as shown in FIG. 3, these two bonded and integrated aluminum flat plates were held in a footer, contact points were made on the upper and lower thickness surfaces, and electrolytic copper plating was performed in the following steps.

Plating process After plating was completed, both aluminum plates were cut using a cutter from the area where the double-sided adhesive tape was applied, and then the remaining adhesive tape and adhesion were removed from the non-plated surface.

The non-plated surfaces of both Al 1 = U flat plates, each plated on one side, were treated with the above-mentioned cathodic alkaline electrolytic degreasing solution, a high concentration alkaline solution of copper cyanide strike solution, an SOS nitric acid solution, and a high concentration of bright sulfur copper plating solution. Although it was an acidic solution, there was no corrosion, and no displacement plating occurred with the bright sulfuric acid steel plating solution.1 Therefore, the pretreatment solution and plating solution did not penetrate into the non-plating direction, and the non-plating surface was ensured. It was confirmed that the plating was carried out under strict supervision.

In addition, although a slight contact trace was observed at the contact position 1 mentioned above, that is, on the thickness side, the plated surface had a good plating appearance over the entire surface, and there was no need to cut the peripheral edge in any way. It was recognized that a plated finished product can be obtained without using a plating method.

[Brief explanation of the drawing]

Figures 1m to 3 are for explaining the actual method of the present invention, respectively. Figure 1 is a front view of a flat plate of 2 plates in a state where it is rolled into an ayu, and j1! The figure is a cross-sectional view along the Xia-Iga line in Figure 1, #I3.
The figure is a side view showing the position of the contact point of the rack with respect to two flat plates pasted together, with a portion of the newspaper used as a newspaper. 1.1'...flat plate, 2,2'...one side, 3.3
'...Non-plated surface, 4...Both ll1liP adhesive tape. Dismissal Person: Sanwa Visit Korea Co., Ltd. Agent, Patent Attorney Aji Kojima #: IF'JiII Attorney Takahata Hanyo

Claims (1)

[Claims] t. The non-plated surfaces of the two objects to be plated O are faced to each other, and the peripheral edges of the two wave-plated objects are liquid-tightly bonded using an adhesive tape and/or adhesive, and then one plating is performed. A single-sided plating method, characterized in that the adhesive tape and/or the adhesive are removed after plating. 1. The single-sided plating method according to claim 1a, wherein the bonding portion of the tape and/or mold adhesive is the peripheral edge of the non-plated surfaces of the two objects to be plated.