JPH0466692A - Method for plating one side surface of metal plate and holding table - Google Patents

Abstract

PURPOSE:To restrain increase ratio of contamination quantity in electrolytic liquid to be low by sticking one pair of metal plates with pressure sensitive adhesive double coated tape to form an electrode plate, holding with a holding table, dipping the plate as a cathode member into electrolytic solution previously dipping an anode member, and executing plating to the one side surface. CONSTITUTION:By sticking one pair of the metal plates 10 with the pressure sensitive adhesive double coated tape, the electrode plate 14 is formed and dipped as the cathode member into the electrolytic solution 34 previously dipping the anode member 36. Successively, by conducting current between the anode member 36 and the electrode plate 14, metal film is formed on the one side of the metal plate. Then the electrode plates 14 are held with a holding table 16 having plural conducting parts mutually connected and also edge parts of the electrode plates 14 are brought into contact with the corresponding conducting body, and the electrode plates 14 are arranged with a mutual interval and the holding table 16 holding the above electrode plate 14 is dipped into the electrolytic solution 34.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a method for plating one side of a metal plate, and a method for plating a metal plate from a pair of metal plates attached to each other with double-sided adhesive tape. This invention relates to a holding stand that holds a plurality of plate-shaped electrodes.

(Prior art) Conventionally, as a method for plating one side of a metal plate, the surface of the metal plate that is not to be plated is covered with a coating material, and the metal plate is immersed as a cathode in an electrolytic solution in which an anode is immersed. There is a method in which a metal film is formed on the surface of the metal plate to be plated by passing an electric current between the anode and the metal plate.

The coating material that covers the non-plated surface of the metal plate is a masking tape with an adhesive substance applied to one side, or a coating agent that is removably applied in a film form to the non-plated surface of the metal plate. It is being

(Problems to be Solved by the Invention) When a masking tape is used as a coating material, some of the components of the masking tape are eluted into the electrolyte and become contaminated by the electrolyte.

When a coating agent is used as a covering material, a part of the film made of the coating agent tends to peel off in pieces from the non-plated surface of the metal plate in the electrolyte, so the film pieces precipitate in the electrolyte and over time. As time passes, the electrolyte becomes contaminated by membrane fragments. As a result, as the area to which the masking tape is applied, the area to which the coating agent is applied, and the number of times the metal plate is plated increases, the degree of contamination of the electrolyte increases, and it becomes difficult to maintain a constant quality of plating.

An object of the present invention is to provide a method for plating one side of a metal, which can reduce the degree of contamination of an electrolytic solution, and a holder used therein.

(Means for Solving the Problems) The method for plating one side of a metal plate of the present invention includes a step of bonding a pair of metal plates with a double-sided adhesive tube to form an electrode plate, and an electrolytic solution in which an anode member is immersed. an electrode plate dipping step in which the electrode plate is immersed as a cathode member; and an energization step in which a current is passed between the anode member and the electrode plate to form a metal coating on one side of the metal plate. A method for plating one side of a metal plate.

A plurality of electrode plates are formed in the electrode plate forming step, and in the electrode plate dipping step, the electrode plate is held by a holding stand having a plurality of mutually connected conductor parts, and the edges of the electrode plate are held. immersing the electrode plates in the electrolytic solution by bringing the electrode plates into contact with the conductor portion, arranging the electrode plates at intervals from each other, and immersing a holding base holding the electrode plates in the electrolytic solution; Preferably, it is characterized by:

The present invention provides a holding stand for holding a plurality of plate-shaped electrode plates parallel to each other at predetermined intervals, the holding stand being arranged perpendicularly to the electrode plates, and having a part of the edge of the electrode plates on one surface. A substrate made of an insulating material is abutted, and a plurality of holes are provided that are arranged parallel to the substrate and perpendicular to the electrode plate and penetrate through the electrode plate on one side. a holding plate made of an insulating material and provided with a plurality of grooves that are engaged with the other part of the electrode plate; a plurality of rod-shaped connecting members made of an insulating material, each of which has one end attached to the substrate, and which extends perpendicularly to the substrate through a corresponding hole in the holding plate; , a plurality of stop members made of an insulating material, each of which is removably attached to the corresponding connection member, disposed on the other side of the presser plate, and abutted against the presser plate.

(Function) When plating one side of a metal plate using the method of plating one side of a metal plate of the present invention, a plate-shaped electrode plate is formed, which is made up of a pair of metal plates attached to each other with double-sided adhesive tape. Ru.

When the electrode plate is immersed as a cathode member in an electrolytic solution, the double-sided adhesive tape is placed between one of the metal plates and the other, so that the double-sided adhesive tape and the electrolytic solution are immersed. Since the contact area is the edge, the contact area between the double-sided adhesive tape and the electrolytic solution is small, and the amount of the double-sided adhesive tape component eluted into the electrolytic solution is reduced.

Furthermore, since the electrode plate is composed of a pair of metal plates that are attached to each other, two metal plates each having a metal coating formed on one side can be obtained for one electrode plate. , the amount of the double-sided adhesive tape pieces from one electrode plate corresponds to two metal plates plated on one side, and the amount of the double-sided adhesive tape pieces eluted into the electrolyte per one metal plate is The amount of adhesive tape component is even smaller.

The plurality of electrode plates held by the holder are arranged at intervals from each other, and their edges are in contact with the conductor part of the holder, so that current can flow through the conductor part of the holder. Since it flows to each of the electrode plates, it is possible to plate one side of twice as many metal plates as the number of electrode plates.

When holding a plurality of plate-shaped electrode plates using the holding stand of the present invention, the distance between the holding plate and the substrate is adjusted. Since the connecting member is a rod-shaped member extending through the hole in the holding plate, the holding plate is moved while being guided by the connecting member, so that the distance between the holding plate and the substrate can be adjusted. This can be done by moving the presser plate.

After adjusting the distance between the holding plate and the substrate, the 'S
An electrode plate is disposed between the holding plate and the substrate, and a part of the edge of the electrode plate is brought into contact with one surface of the substrate. Next, the holding plate is moved toward the substrate. As a result, another part of the edge of the electrode plate is engaged with the groove of the holding plate and is brought into contact with the conductor portion. The stop member is attached to the connection member and is brought into contact with the presser plate, so that the electrode plate is sandwiched between the presser plate and the substrate, so that the electrode plate is not displaced.

(Example) Fig. 1 is a cross-sectional view showing a plating apparatus for plating one side of a metal plate by applying an embodiment of the method for plating one side of a metal plate according to the present invention. Now, the plating method and holding stand of the present invention will be specifically explained.

When plating one side of a semi-finished metal plate that has been cut into a predetermined shape and size, an electroplating method is used. The electroplating method includes a pretreatment process, a plating process, and a posttreatment process.

For example, when galvanizing one side of a plurality of carbon steel plates 10 cut into rectangular shapes of the same size, each carbon steel plate 10 is subjected to rust removal, degreasing, pickling, and intermediate treatment. Sum processing is performed sequentially.

Next, the carbon steel plate 10 treated in the pretreatment process is transferred to a plating process. In the plating process, first, a pair of carbon steel plates 10 are attached to each other with double-sided adhesive tape 12 to form an electrode plate 14 made of the pair of carbon steel plates 10. One and the other of the carbon steel plates 10 are overlapped so as to be aligned with each other. The planar shape and planar dimensions of the double-sided adhesive tape 12 are equal to the planar shape and planar dimensions of the carbon steel plate 10, and the double-sided adhesive tape 12 is attached to one and the other of the carbon steel plates 10 so that its edges are aligned with the edges of the carbon steel plate 10. is located between. By repeating the above operations, a plurality of plate-shaped electrode plates 14 are formed. The thickness of the electrode plate 14 is slightly smaller than the thickness of the third intestine.

The plurality of electrode plates 14 are held by a holding stand 16, which is an embodiment of the present invention. The holding table 16 includes a substrate 18 made of an insulating material. The substrate 18 is made of an epoxy resin plate and has a rectangular planar shape. A plurality of grooves 20 extending in the width direction are provided on one surface of the substrate 18. ?
The width dimension of 1120 is 3 m, and its depth dimension is 0.2
In the illustrated example, the number of grooves 20 is three.

One end of a pair of rod-shaped connecting members 22 made of an insulating material is attached to the substrate 18 . Each connecting member 22 is made of epoxy resin material. Each connecting member 22 extends vertically upward from one surface of the substrate 18, and has a circular cross-sectional shape.

A screw (not shown) is formed on the outer peripheral surface of each connecting member 22. One of the connecting members 22 is located at one corner of the substrate 18. In contrast, the other of the coupling members 22 is disposed at the other corner of the substrate 18 such that it diagonally faces one of the coupling members 22.

A holding plate 24 is arranged above the substrate 18 and facing it. The holding plate 24 is made of a rectangular stainless steel material having the same dimensions as the substrate 18, and has the following markings on its outer surface.
A vinyl chloride coating is formed to cover it. Three grooves 26 are provided on the surface of the holding plate 24 facing the substrate 18. Each of the multiple grooves 26 faces a corresponding groove 20. The width dimension of the bank 26 is 3aaa, and the depth dimension is 0.2 m. ? m! On the inner peripheral surface of 26,
The stainless steel material is exposed. The holding plate 24 is provided with a pair of holes 28 passing through it in the thickness direction. One hole 28 is arranged at one corner of the holding plate 24, and the other hole 28 is arranged at another corner diagonally opposite the one corner of the holding plate 24. . 4, a vinyl chloride coating is formed on the inner peripheral surface defining each person 28. Each person 28 has a corresponding connecting member 22 inserted therethrough.

A nut 30 made of an epoxy resin material is screwed into the screw of the connecting member 22. Each nut 30 is arranged above the holding plate 24.

When the electrode plate 14 is assembled into the holding base 16, the presser plate 24 is lifted above the substrate 18 while being guided by the connecting member 22. Next, the electrode plate 14 is placed between the holding plate 24 and the substrate 18 so that it is perpendicular to the substrate 18,
One of the edges of the electrode plate 14 is inserted into 21120.

Similarly, one of the edges of the other two electrode plates 14 is inserted into the corresponding groove 20.

After placing the three electrode plates 14 on the substrate 18, the holding plate 16 is lowered toward the substrate 18, and the edge of the corresponding electrode plate 14 is inserted into each of the grooves 26 of the holding plate 16.

Each nut 30 is then rotated until it abuts the retaining plate 24. When each nut 30 is in contact with the presser plate 24, the presser plate 24 presses each electrode plate 14 against the substrate 18, and the edges of each electrode plate 14 do not separate from the plates 20, 26. The edge of the groove 26 is in contact with the inner circumferential surface of the groove 26.

A holder 16 holding three electrode plates 14 arranged at intervals is immersed in an electrolytic solution 34 contained in a plating tank 32.

The main component of the electrolytic solution 34 is zinc sulfate. A pair of anode plates 36 made of zinc are immersed in the electrolyte 34 .

Each of the anode plates 36 is arranged on both sides of the holding table 16.

Each anode plate 36 is connected to a DC power source (not shown) via a conductor 38.
connected to the positive side of the On the other hand, the holding plate 24 is connected to the negative side of the DC power supply via a conductor 40.

Because the base of the stainless steel material exposed on the inner peripheral surface of the arm 26 of the holding plate 24 is in contact with the edge of the carbon steel plate 10, the holding plate 24 and the carbon steel plate 10 of each electrode plate 14 are electrically connected. Since the carbon steel plate 10 of each electrode plate 14 is connected to the negative side of the DC power source, it acts as a cathode.

The DC power supply is then activated and a DC current flows between each anode plate 36 and each electrode plate 14. Zinc deposited by electrolysis of zinc sulfate in the electrolytic solution 34 is deposited on each electrode plate 1.
It adheres to the surface of the carbon steel sheet 10 of No. 4 that is in contact with the electrolyte 34, and a zinc coating is formed on the surface. The electrode plate 14 is
Since it is composed of a pair of carbon steel plates 10 that are attached to each other, one side of the two carbon steel plates 10 can be plated at the same time using one electrode plate 14, which improves work efficiency and reduces costs. can be reduced.

When the electrode plate 14 is immersed in the electrolytic solution 34, the edges of the double-sided adhesive tape 12 that attaches one carbon steel plate 10 to the other are aligned with the edges of the carbon steel plate 10, so that Since the contact area of the double-sided adhesive tape 12 with the electrolyte 34 is only at its edge, the contact area between the double-sided adhesive tape 12 and the electrolyte 34 is small, and the double-sided adhesive tape 12
The amount of components eluted from the As a result, the amount of the double-sided adhesive tape component eluted into the electrolytic solution 34 is reduced, and the extent to which the electrolytic solution 34 is contaminated by the double-sided adhesive tape component is reduced.

After the plating of the carbon steel plate 10 is completed, the holding table 16 is filled with the electrolyte 3.
It will be raised from 4. The holding table 16 has three electrode plates 14
At the same time, it is transferred to the next post-processing step.

In the post-processing process, each electrode plate 14 is washed with hot water and dried with warm air.Next, the screws between the nut 30 of the holding base 16 and the screw of the connecting member 22 are released, and each electrode plate 14 is It is taken out from between the plate 24 and the substrate 18. Electrode plate 1
One of the carbon steel plates 10 of No. 4 is separated from the other, and the double-sided adhesive tape 12 is peeled off from the carbon steel plate 10.

When incorporating another electrode plate of different dimensions into the holding stand 16, the holding plate 24 of the holding stand 16 is attached to the connecting member 22.
Since the vertical distance between the holding plate 24 and the substrate 18 can be changed by moving the holding plate 24 and the substrate 18 upward and downward while being guided by can be easily adjusted.

In this example, one side of the carbon steel plate 10 is galvanized, but by selecting the material of the anode plate and the electrolyte, when a predetermined plating is applied to one side of the other plate,
The method of the invention can be applied.

Further, an electrode plate can be formed by pasting a pair of carbon steel plates with a plurality of elongated double-sided adhesive tapes. Figure 2 is a partially cutaway plan view of the electrode plate;
FIG. 3 is a sectional view taken along line A--A in FIG. 2.

When attaching a pair of carbon steel plates 50 to each other, a plurality of double-sided adhesive tapes 52, 54, 5 are attached to one of the carbon steel plates 50.
6 is pasted. The pair of double-sided adhesive tapes 52 are made of elongated tape pieces extending in the longitudinal direction of the carbon steel plate 50.
Each of the double-sided adhesive tapes 52 is placed on one of the carbon steel plates 50 so that one edge thereof is aligned with the edge of the corresponding carbon steel plate 50 along the longitudinal direction.

On the other hand, the pair of double-sided adhesive tapes 54
Each of the double-sided adhesive tapes 54 made of elongated tape pieces extending in the width direction of the carbon steel plate 50 is arranged on one side of the carbon steel plate 50 so that one edge thereof is aligned with the edge of the corresponding carbon steel plate 50 in the width direction. A pair of double-sided adhesive tapes 56 made of elongated tape pieces extending in the width direction of the carbon steel plate 50 are arranged between one and the other of the double-sided adhesive tapes 54 .

After pasting each double-sided adhesive tape 52, 54, 56, one carbon steel plate 50 and the other are overlapped so as to be aligned with each other, and the pair of carbon steel plates 50 are pasted with each double-sided adhesive tape 52, 54, 56. An electrode plate 58 is formed. The space formed between one and the other carbon steel plate 50 is isolated from the outside by each double-sided adhesive tape 52, 54, and the electrolytic solution 34 does not enter the space.

(Effects of the Invention) According to the method for plating one side of a metal plate of the present invention, by pasting a pair of metal plates forming the electrode plate with a double-sided adhesive tape disposed between them, the electrode plate can be coated with the electrolytic Since the area of the double-sided adhesive tape that comes into contact with the electrolyte when immersed in the solution is the edge of the double-sided adhesive tape, the amount of the double-sided adhesive tape component eluted into the electrolyte is small. Become. Moreover, since two metal plates with plating applied to one side are obtained for one electrode plate, the amount of the double-sided adhesive tape component eluted into the electrolyte per one metal plate is Even less. the result,
The rate of increase in the amount of electrolyte contamination relative to the number of metal plates plated on one side can be suppressed to a low level.

By holding a plurality of electrode plates on the holding stand, the electrode plates held on the holding stand and the conductor portion of the holding stand are electrically connected, so the number of metal plates that is twice as many as the number of electrode plates is plating can be performed on one side of the plate, improving work efficiency.

According to the holding table of the present invention, since the holding plate is moved in the axial direction of the connecting member while being guided by the connecting member, the distance between the holding plate and the substrate can be adjusted using the holding plate. This can be done by moving, and the distance between the presser plate and the substrate can be easily changed depending on the planar dimensions of the electrode plate. Further, when the electrode plate is disposed between the presser plate and the substrate, the stopper member is attached to the connecting member and brought into contact with the presser plate, so that the electrode plate is arranged between the presser plate and the substrate. Since the electrode plate is sandwiched between the electrode plate and the substrate, the work of holding the electrode plate becomes easier.

22... Connecting member, 24... Holding plate, 28... Hole, 30... Nut (stopping member), 34... Electrolyte,
36... Anode plate.

Agent: Patent Attorney Nakasuke Honjo

[Brief explanation of drawings]

Fig. 1 is a sectional view showing a plating apparatus for plating one side of a metal plate by applying an embodiment of the method for plating one side of a metal plate according to the present invention, and Fig. 2 is a partially broken view of another cathode plate. FIG. 3 is a cross-sectional view taken along line A--A in FIG. 2.

Claims (3)

[Claims] (1) a step of pasting a pair of metal plates with double-sided adhesive tape to form an electrode plate, and an electrode plate immersion step of immersing the electrode plate as a cathode member in an electrolytic solution in which an anode member is immersed; A method for plating one side of a metal plate, the method comprising: forming a metal coating on one side of the metal plate by passing a current between the anode member and the electrode plate. (2) A plurality of electrode plates are formed in the electrode plate forming step, and in the electrode plate dipping step, the electrode plate is held by a holding table having a plurality of mutually connected conductor parts, and the edges of the electrode plate are held. The electrode plates are brought into contact with the corresponding conductor parts, the electrode plates are arranged at intervals, and the holding base holding the electrode plates is immersed in the electrolytic solution. 2. The method for plating one side of a metal plate according to claim 1, wherein the metal plate is immersed in a liquid. (3) A holding stand for holding a plurality of plate-shaped electrode plates parallel to each other at predetermined intervals, the holding stand being arranged perpendicularly to the electrode plates, and having a part of the edge of the electrode plates on one surface. A substrate made of an insulating material to be abutted, and a plurality of holes arranged parallel to the substrate and perpendicular to the electrode plate and penetrating in the thickness direction, and having an edge of the electrode plate on one surface. a holding plate made of an insulating material and provided with a plurality of grooves that are engaged with other parts of the holding plate, each of which is installed in a corresponding groove of the holding plate;
a plurality of conductor parts in contact with another part of the edge of the electrode plate; and an insulating material, one end of each of which is attached to the substrate, and each of which extends perpendicularly to the substrate through a corresponding hole in the holding plate. a plurality of rod-shaped members made of insulating material, each removably attached to the corresponding connecting member, disposed on the other side of the presser plate, and abutting the presser plate; A holding stand including a plurality of stop members.