JPS58148487A - Material for flexible circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] As a method of manufacturing a flexible circuit board, in the case of a subtractive method such as a photoresist method, for example, a conductive material such as steel foil is attached to an insulating paste member of a polyester base film lining via an adhesive. Etching is performed on the base material of the so-called flexible steel clad laminate board to which the body is bonded to form the required circuit pattern.
Base materials such as Lexib λ steel clad laminates are made into long rolls 41!
In many cases, it is fed out one after another in a good condition and subjected to a continuous process for forming circuit patterns. The major issues to keep in mind when manufacturing at 1,000R are as follows.

One example is the stabilization of the dimensions of the materials used, and in relation to this, even if the dimensional tolerances are based on IA02ML-900 or IPO-ML-925, etc.
The management of the cumulative dimensional tolerance of flexible circuit boards, which is necessary to ensure the required yield, is still inadequate.The present invention takes such circumstances into consideration and aims to stabilize the dimensions of the base material used. The present invention provides a base material for flexible circuit boards that can secure the desired yield by reducing the management of cumulative dimensional tolerances of products as much as possible. There are nine types of base materials, such as a fibrous material such as a woven fabric of polyester fiber or glass fiber, a non-woven fabric thereof, or fiber chips, etc., mixed into the adhesive layer for bonding the conductor and the conductor. According to the authors, it was found that while it greatly contributed to dimensional stability, it also increased the folding strength of the product.

Hereinafter, the present invention will be described in further detail with reference to illustrated embodiments.
In FIG. 1, an IFi flexible insulation paste member,
2 is a foil-like conductor, 3 is an adhesive and a 4Fi chip-like fiber material, and the insulating base member 1 is a polyester film, a polyester nonwoven fabric, a tetraethylene film, a phenol film, a polyvinyl chloride film, and a glass epoxy film. , glass epoxy cloth, polyimide film, aromatic polyand film, etc. can be applied to the conductor 2, and in addition to electrolytic steel foil, compressed copper foil, or steel foil annealed thereto, as necessary. Stainless steel foil or aluminum foil or the like can be used. Adhesive 3Fi: Current adhesives such as thermosetting or pressure-sensitive adhesives can be used as appropriate; however, in the case of Figure 1, the adhesive 3 is one or more of the nine materials listed in paste member 1 above. In the embodiment shown in FIG. 2, instead of the chip-like fiber material 4, a fiber material 5K made of woven or non-woven fabric of these materials is used, for example, by adhesion. This shows a configuration in which the fiber material 5 is embedded and mixed into the adhesive material S by sufficiently impregnating it with the material 3. Such a bonding layer consisting of the fiber material 4 or 5 and the adhesive material 3 may be supplied by KJI during the bonding process of the base member 1 and the conductor 2, or such a bonding layer may be formed into a required film shape in advance. It is also possible to keep it.

As above! According to the base material for a flexible circuit board having a bonding structure, due to the presence of the fiber material 4 mixed in the adhesive material 3 and the fiber material 4 being embedded in the adhesive material 3, especially when compared with a base material bonded only with an adhesive material as in the past, It is possible to provide a product with excellent dimensional stability, and therefore, the cumulative dimensional tolerance that occurs during the photoresist process, etching process, etc. can be suppressed to a minimum.

It is ideal as a base material for use in this type of flexible circuit board, as it can also increase bending strength.

[Brief explanation of drawings]

FIG. 1 is a conceptual cross-sectional configuration diagram of a flexible circuit board base material according to one embodiment of the present invention, and FIG. 2 is a cross-sectional configuration diagram similar to FIG. 1 according to another embodiment of the present invention. 1...Insulating paste member 2...Flexible conductor 3...Adhesive material 4.5...Fiber material Applicant Nippon Mektron Co., Ltd. 2 3 Procedural amendment (voluntary) Showa! 1 year! 7th Japan Patent Office Commissioner Kazuo Wakasugi Station 1, Indication of Cases Patent Applications 1983-1983 J No. 2 Name of Invention 7 Substrate for Lexiple Circuit Boards 3 Relationship with Dominance of Person Who Makes Amendment Patent Applicant Address: Shiba Daimon, Minato-ku, Tokyo/Chomel Kokal! Issue name Nippon Meta) wn Co., Ltd. Kinsha Bin Agent Person Postal code 300-1j1 Detailed explanation of the invention in the specification Contents of the amendment B Contents of the amendment (1) Page 3 of the specification, lines 4 to 10 "Melyester non-woven fabric, t or aromatic polyamide film" in the row "
Free ethylene film, polypyrene film, polytetra 7wm ethylene film, polyvinyl vinyl film, priimide film, and priamide film are corrected to ``9 is aromatic lyamide paper''. (8) The same No. J Electric Power Purchase Line 77 to Happy IT Line O "the above-mentioned pace member/,..., two or more kinds" is corrected to "polyester fiber or company glass S + miscellaneous". (that's all)

Claims (1)

[Claims] Substrate material for circuit board, board, board, etc., characterized in that a fiber material is mixed in the adhesive layer for bonding an insulating paste member and a conductor.