JPS58143531A - Surface treating device for wafer - Google Patents

Surface treating device for wafer

Info

Publication number
JPS58143531A
JPS58143531A JP2596982A JP2596982A JPS58143531A JP S58143531 A JPS58143531 A JP S58143531A JP 2596982 A JP2596982 A JP 2596982A JP 2596982 A JP2596982 A JP 2596982A JP S58143531 A JPS58143531 A JP S58143531A
Authority
JP
Japan
Prior art keywords
wafer
tank
chemical
shaft
guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2596982A
Other languages
Japanese (ja)
Inventor
Tetsuya Takagaki
哲也 高垣
Hiroto Nagatomo
長友 宏人
Hisao Seki
関 久夫
Masayoshi Kanematsu
雅義 兼松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP2596982A priority Critical patent/JPS58143531A/en
Publication of JPS58143531A publication Critical patent/JPS58143531A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting

Abstract

PURPOSE:To prevent the adhesion of foreign matters, and to improve the degree of washing by shifting the wafer to the next tank from a tank without being contacted with air. CONSTITUTION:The wafer treated with a chemical liquid in a chemical-liquid tank 10 is fed into a moving guide 15 by a feed-in pusher 16 from a receiving guide 14. When the feed-in pusher 16 is returned to an original position, a cover 24 falls, and contacts with a lower-surface plate 21. The lower-surface plate 21 and the cover 24 rise from the inside of the chemical-liquid tank 10 as the wafer is left as it enters into the chemical liquid by a shaft 22 for vertical movement. The wafer is moved to the upper section of a rinsing tank 11 by a shaft 23 for horizontal movement, and drops into the rinsing tank 11 by the shaft 22 for vertical movement, the cover 24 rises, and the chemical liquid is washed away by pure water in a moment.

Description

【発明の詳細な説明】 本発明はウェハ表面処理装置に関する。[Detailed description of the invention] The present invention relates to a wafer surface processing apparatus.

−散に、千尋体製品の製造において牛専体ウニ・・の処
填工根での歩留V【良くするたわVcri、ウェハのf
k浄Inkどこまで^くできるかどうかか1蕾な豊凶と
なる。
-In particular, in the production of Chihirotai products, the yield rate of the processing process for beef and sea urchin...
The question of whether or not you can go as far as you can go will be a budding success.

ところで、9エバ洗浄工11は通常、薬液処理と水洗処
理とe)連続処理よりなる。−tq;定め、従来は−1
凶vCボ丁ようVC1系液処珈を行う几めの薬融檜Iと
、水洗流*t?Tう友めの水洗槽2と【別々[配直し、
ウェハ3を複数枚収納したカートリッジ4のハンドル5
に+で把持し、手でめる^は憬械的r(条准4111か
ら取り出して水洗槽2に移し換えている。
By the way, the 9eva cleaning process 11 usually consists of chemical treatment, water washing treatment, and e) continuous treatment. -tq; Defined, conventionally -1
A careful medicine cypress I that performs a VC1-based liquid treatment, and a water wash *t? T-friend flush tank 2 and [separately]
Handle 5 of cartridge 4 containing multiple wafers 3
Hold it with + and press it by hand ^ mechanically (take it out from article 4111 and transfer it to washing tank 2.

しかしながら、との輯し換えの際、9工・・3は薬液中
から散p出され7を時に空中に厘かれるので、ウェハ3
の′表向か乾燥し始め、柴液等力為ウニI・表面上に凝
縮して水滴とな9.この水滴地分にゴミ等か集まって一
析し、真物何着部(ワオーターマーク)か形成されてし
まう。
However, when replacing wafer 3 with wafer 3, wafer 3 is dispersed from the chemical solution and 7 is thrown into the air.
9. The surface of the sea urchin begins to dry, and water droplets condense on the surface of the sea urchin. Dust and other debris gathers in these water droplets and evaporates, forming a water mark.

そのli米、ウェハの洗浄膨か低下し、か留りq)低下
【来たすことになってしまう。
This leads to a decrease in the wafer cleaning capacity and a decrease in the retention capacity.

本発明の目的は、1ITIe貧米挟術の間聴点を膳次し
、ウェハへの異型の付着を防止し、^い洗#鍵t−得る
ことのできるウェハ洗浄候[會憚供することVCToる
The purpose of the present invention is to provide a wafer cleaning method that can be used to clean the wafer during the 1ITIe thinning process, prevent the adhesion of foreign particles to the wafer, and Ru.

この目的tS属するため、本宛#4は、桑液稽から水洗
IIK移し換えるなどL)−に9工・・か空中で乾燥し
ないよう#L構成し尺もOである。
Since this purpose belongs to tS, book address #4 is configured to #L so that it does not dry in the air, and the length is O.

以下、本発明を図−に示す実り釣rCシ友η1つて詳#
に貌−する。
Hereinafter, the present invention will be explained in detail as shown in the figure.
to look like.

感2図は本@例による9エバ況浄装置の一央九内を示す
斜m−である。
Figure 2 is a diagonal m- showing the center and inner part of the 9-evaporation purifying device according to this example.

本実hrIVcおいて、ウェハ洗浄装置は大きく分ける
と、ウェハ【水洗前に薬液錫塩する薬液槽IO、ウェハ
【水洗する水洗槽11、これら2つの檜10とIIc)
間でウェハ【薬f/1槽10から水洗槽111C1にし
換える移動機構12、および各種10.11内でウェハ
’を移動させるグツシャー機病13よりなる。
In this actual hrIVc, the wafer cleaning equipment can be broadly divided into wafers (chemical bath IO for washing chemical liquid with tin salt before washing, rinsing tank 11 for washing wafers, and these two cypresses 10 and IIc).
It consists of a moving mechanism 12 for changing the wafer from the chemical f/1 tank 10 to the washing tank 111C1, and a gutsher mechanism 13 for moving the wafer in the various parts 10.11.

III記薬濠僧10Kに、前縦のユニットからウェハr
受け、販ウェハ【薬液槽lO内に引き入れる上下勧町岨
な受入カイト14と、この受入ガイドと斡@4i111
112の*動ガイド15との間で9エバkeし供える送
込みプッシャー16とか設けられている。こI;Df込
みブツシャ−16は、水&権11内に棒勧し7tII−
ガイド15と払出ガイパ17と12)i41テ+7エハ
′に移し換える払出しプッシャー18と連軸1rL、 
 1)ct)躯−系で作動される。なお、符号1替は1
ツシャーlI構xH1;@成するプッシャー用シャフト
、20はプッシャー用ガイドである。
Wafer r from the front vertical unit to the III Yakushomon 10K
Receiving and selling wafers [A receiving kite 14 that is easy to pull into the chemical solution tank 10, this receiving guide, and @4i111
A feeding pusher 16 is provided between the moving guide 15 of 112 and the moving guide 15 for 9 ejaculations. This I; Df-included bushing 16 is inserted into water & water 11 and 7tII-
Guide 15, dispensing guider 17 and 12) dispensing pusher 18 and linking shaft 1rL for transferring to i41te+7eha',
1) ct) Operated by the body system. In addition, code 1 change is 1
The pusher shaft 20 is a guide for the pusher.

―配II−嶺佛12は、藺配参−カイド15【固定する
下向プレート21、この下面プレート21を上下動させ
る上下動用シャフト22、)−ブレー)21に水平方向
に11s動きせる水平#動用ンヤ7ト23、ウェハ【収
容したSaガイド15′に収納するよう前記下lプレー
)21上にかぷぜられるかぶせ@24、販かぶせ112
.4 k上下1芒せる壷上下動用シャフト25【有して
いる。第3図(旬に示すように、下向プレート21の1
lk126およびかぶせ1124の1127ri互い[
密tif、6! う−1−nぞれ平th度か出され、水
か漏れない構成となってお9、d026と2’l(D@
@性$1 カフ−t ti j[fT Th M)ばね
コンタクト28により一鉦される。
- Part II - Reibutsu 12 is a part of the guide 15 (downward plate 21 to be fixed, vertical movement shaft 22 to move this lower plate 21 up and down) - horizontal # that allows 21 to move horizontally for 11 seconds A cover @ 24 to be placed over the wafer (the lower plate to be stored in the accommodated Sa guide 15') 21, a sales cover 112
.. 4k Equipped with a shaft 25 for vertical movement of the pot which can be moved up and down once. Fig. 3 (as shown in Fig.
1127ri of lk126 and cover 1124 [
Secret tif, 6! 9, d026 and 2'l (D@
@Sensitive $1 Cuff-t ti j [fT Th M) One stroke is applied by the spring contact 28.

Ill記水洗水洗1tlj、前記した水洗槽11から後
段のユニットにウェハを払い出丁上) @ ”J In
:な罰紀払出しガイド17および払出しブツシャ−18
のa、清浄な純水【を時供給する純水人口21j、排水
口30か設けられている。1几、業沿惨lOと水洗槽1
1との闇には、水mn防止板31カ・配置されている。
Ill wash 1tlj, unload the wafer from the above-mentioned washing tank 11 to the subsequent unit) @ ``J In
: Penalty payout guide 17 and payout button 18
A, a pure water outlet 21j and a drain port 30 are provided to supply clean pure water. 1 liter, industrial waste lO and washing tank 1
1 and 31 water prevention plates are placed in the darkness.

久に1本実m−の作用について―j凶内〜(拘に関して
説明する。まず、薬液槽10内で薬液処理す117tウ
エハは受入ガイド14から送込みプッシャー16で4!
J@ガイド15に送り込まれる。送込みブツシャ−16
か元の位tに戻ると、かぶせ暮z4か@3図(A)の状
態から下降し、第3図(賜のように下面プレート21と
接触する。
About the action of the first real m--J Kyauchi~ (I will explain about the action. First, the 117t wafer to be treated with a chemical solution in the chemical solution tank 10 is fed from the receiving guide 14 with the pusher 16.
Sent to J@Guide 15. Feeding button shear 16
When it returns to the original position t, it descends from the state shown in Fig. 3 (A) and comes into contact with the lower plate 21 as shown in Fig. 3 (Fig. 3).

その徒、[3図(0)K示すように、下面プレート21
とかぶせ壷24は上下動用シャフト22により薬液槽1
0内から上昇し、空中に出る。この時、下面プレート2
1のrkJ28とかぶせ1k24の(1127とほぼね
コンタクト28で密着させられ、また水C)懺thII
jl力作崩かあるので、薬gか面26と27との間から
漏れることはなく、ウェハは薬液中に人つ7tままであ
る。
Therefore, [as shown in Figure 3 (0) K, the bottom plate 21
The covering pot 24 is connected to the chemical liquid tank 1 by the shaft 22 for vertical movement.
It rises from within 0 and emerges into the air. At this time, lower plate 2
1's rkJ28 and cover 1k24's (1127 and almost contact 28, and water C) 懺thII
Because of the effort involved, the chemical agent G does not leak from between surfaces 26 and 27, and the wafer remains completely immersed in the chemical agent.

この状態で、S勧ガイド15、下向プレート21および
かぶせ@24は第3図(0)の位置から水平移動用シャ
フト23で水洗槽11の上方に、IjlIIlされ友後
、上下動用シャフト22で水洗槽11&)中和下−姑せ
られるc、1m3図中2に示すように水洗槽11内の1
9r足の下鐸位1に遁すると、かぷゼ嚢24は第3図(
1)K示すように上昇し、薬液は一―のうち11c@水
で洗い流されるのて、ウェハは下面プレート2i上の移
−ガイド1sでm持され7tまま水洗され、清浄な状態
となる。
In this state, the S guide 15, the downward plate 21, and the cover 24 are moved from the position shown in FIG. Washing tank 11
When you move to the 9th lower leg position 1, the Kapze pouch 24 will open as shown in Figure 3 (
1) K rises as shown, the chemical solution is washed away with water, and the wafer is held on the transfer guide 1s on the lower plate 2i and washed with water for 7t, leaving it in a clean state.

七0@、ウェハは払出プッシャー18で移動カイト1s
かも払出ガイドx7に#LlILられ、饋毅のユニット
(図示せず)K払い出される。
70@, the wafer is moved by the payout pusher 18 for 1s
#LlIL is sent to the payout guide x7, and the unit K of Fuyuki (not shown) is paid out.

本1!jHFIKよれば、ウェハは常に薬液または純水
の中Kfかれ、J[111檜10から水洗槽1.lK萼
し換える間も9中に出ることかないので、仝甲での9エ
ム表−〇[繰によ1付着発生するクォーターマーりか#
除され、極めて^い洗浄層か侍られ、歩留りか向上する
Book 1! According to HFIK, wafers are always soaked in a chemical solution or pure water, and then placed in a washing tank 1. Since it does not appear in 9 even during the time when the calyx is replaced, the 9M table in this case -〇
The cleaning layer is removed and the cleaning layer is extremely thin, which improves the yield.

本発@框、クエへf洗滌、エツチング等の衣圓aiwt
t−行なう弐−錫塩装置に過用できる。
This is the original @ frame, square, f cleaning, etching, etc. clothes aiwt
It can be overused in t-conducting tin salt equipment.

以上112明したように1本発#4によれは、異型付着
のない高洗浄度のウニへ洗鰺【行うことη・でき、歩留
p【同上させることかできる。
As explained above, with one-shot #4, it is possible to wash the sea urchins with a high degree of cleaning without any abnormal adhesion, and it is possible to wash the mackerel and increase the yield rate P (same as above).

【図面の簡単な説明】[Brief explanation of drawings]

纂1−は健康Oウェハ洗浄鏝10−横図、醜2図α本′
#、明の一実施例でめるウニI・洗浄装置【示す91N
4槽図、纂3図体)〜(ト))は本発明におけるフェノ
〜の輪換えおよび表1処境工輸【順次示す概略断動因で
るる。 lO・・・県液櫓、11・・・水洗槽、12・・・#@
*構、13・・・ブツシャ−41!橋、14・・・受入
ガイド、15・・・柊勧ガイド、16・・・送込みブツ
シャ−117・・・払出ガイド、18・・・払出ブツシ
ャ−119・・・1ツシヤー中シヤフト、20・・・1
ツシヤー用ガイド、21・・・)向プレート、22・・
・上下動用シャフト、23・・・水平纏a#$4シャフ
ト、24・・・かぶせ金、25・・・着上下動用シャフ
ト、26・・・面、21・・・面、28・・・純水人0
130・・・薪水口、31・・・水漏れ防止板。 第  1  図
Summary 1 - Healthy O wafer cleaning trowel 10 - Horizontal view, Ugly 2 view α book'
#, A sea urchin I/cleaning device in an example of Ming [91N shown]
4 tank diagrams, 3 diagrams (3) to (g)) are the reasons for the rotation of the phenol in the present invention and Table 1. lO...Prefectural liquid tower, 11...Washing tank, 12...#@
* Structure, 13...butsusha-41! Bridge, 14... Acceptance guide, 15... Hiragi Kan guide, 16... Infeed button shear - 117... Output guide, 18... Output button shear - 119... 1 shaft in the middle of the shear, 20.・・1
Guide for shear, 21...) Direction plate, 22...
・Shaft for vertical movement, 23...Horizontal mating a#$4 shaft, 24...Folding metal, 25...Shaft for vertical movement of mounting, 26...plane, 21...plane, 28...pure water person 0
130...Firewood water outlet, 31...Water leak prevention plate. Figure 1

Claims (1)

【特許請求の範囲】 1、 ウェハklll数の槽を用いてfi[10処理す
るウェハ表向処@候筐において、ウェハ【空気に触れさ
せることなく檜から次の檜に移し換える手段tMするこ
とt%像とするウェハ&面処理装置。
[Scope of Claims] 1. In a wafer surface processing @cage where fi [10 wafers are processed using a tank with kllll number of wafers], wafers [means to be transferred from one hinoki to the next hinoki without being exposed to air. Wafer and surface processing equipment that produces t% images.
JP2596982A 1982-02-22 1982-02-22 Surface treating device for wafer Pending JPS58143531A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2596982A JPS58143531A (en) 1982-02-22 1982-02-22 Surface treating device for wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2596982A JPS58143531A (en) 1982-02-22 1982-02-22 Surface treating device for wafer

Publications (1)

Publication Number Publication Date
JPS58143531A true JPS58143531A (en) 1983-08-26

Family

ID=12180555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2596982A Pending JPS58143531A (en) 1982-02-22 1982-02-22 Surface treating device for wafer

Country Status (1)

Country Link
JP (1) JPS58143531A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0370133A (en) * 1989-08-09 1991-03-26 Shin Etsu Handotai Co Ltd Automatic cleaning device of work

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0370133A (en) * 1989-08-09 1991-03-26 Shin Etsu Handotai Co Ltd Automatic cleaning device of work

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