JPS58142934A - Molding material and molding process using the same - Google Patents

Abstract

PURPOSE:To obtain a molded article without lowering heat resistance, chemical resistance, etc. of the original resin, by using a material having excellent melt moldability and obtained by compounding a specific aromatic imide compound to an ester of an aromatic dicarboxylic acid and an aromatic dihydroxy compound, etc. CONSTITUTION:The objective molding material is prepared by compounding (A) 100pts.wt. of a polyester containing the ester unit of an aromatic dicarboxylic acid and an aromatic dihydroxy compound and/or the aromatic hydroxycarboxylic acid unit as main recurring unit, and capable of forming a solution having optical anisotropy with (B) an aromatic imide compound of formula (D is halogen or bivalent aromatic group; Ar is halogen or n-valent aromatic group; n is 1 or 2) in an amount to impart the mixture with a characteristic capable of forming optically isotropic molten material at <=380 deg.C (i.e. 10-200pts.wt.). The obtained molding material is molded under melting at a temperature to form an optically isotropic melt, and then treated with an organic solvent (e.g. toluene) which is a solvent of the component (B) but essentially inert to the component (A) until >=70% of the component (B) is extracted from the molded article.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a molding material and a molding method using the same, and its purpose is to provide a molding material with excellent latent formability and a molding material with excellent heat resistance, chemical resistance, and mechanical properties. Our objective is to provide a method for molding excellent molded products.

Due to the combination reaction between aromatic dicarboxylic compounds and dihydroxy aromatic compounds, aromatic oxycarboxylate (boriasolage) generally has excellent characteristics of heat resistance, mechanical properties, and strength, so it can be used in various compositions. Boarylates have been studied and also proposed. These poly-7 rylates can be roughly divided into those that form optically anisotropic melts and those that form optically isotropic melts in terms of melting properties.

Poly7 rylate, which forms an optically anisotropic melt, has the advantage of the above-mentioned physical properties, but on the other hand, it has the disadvantage that it has a high melt viscosity and melting point and is difficult to melt mold. It requires much higher molding temperatures than polyalkylene terephthalates such as polyalkylene terephthalates.

Additionally, melt-extruded lI polymers are highly oriented in the machine direction, resulting in, for example, films being susceptible to tearing in the machine direction.

There are five problems: the physical properties are not well balanced in the vertical and horizontal directions, and it is difficult to maintain this balance.

A method and method for improving the formability of boriant, including:
For example, polyethylene (IIIl Kai@4 Hatake-50), polycarbonate (4111@41-14), polyethylene terephthalate (41111@4
A method of mixing other types of y1177- such as Hatake-6HI No. 4kll) has been proposed.

In these methods, the other poly(FF-) used usually remains in the molded product, which impairs the excellent properties of the polyarylate, such as heat resistance, chemical resistance, or mechanical properties. A new question arises. In addition, polyanthine V-), which forms an optically anisotropic melt, has a well-balanced property in the vertical and horizontal directions. ! As a method for obtaining a film having 1. A method has been proposed in which the direction is perpendicular to the direction 6c t,@ more than double the extension (411open1@ss-* !14*? 41
/Newsletter) #', this method requires further improvement in terms of moldability.

The present inventor has conducted intensive studies on a method for improving the moldability of a polyester that forms an optically anisotropic melt while maintaining its original properties. Optically isotropic [
1. The present invention Kjj et al.1. Ta.

That is, the present invention provides an ester compound containing an aromatic dicarboxylic acid and an aromatic dihydroxylated compound having ester units and/or aromatic oxycarboxylic acid units as main repeating units and forming an optically anisotropic melt. in an amount which forms an optically ditropic melt at temperatures below 380° C. and imparts properties of 5.

Aromatic a1)' Compound β) shown in the lower formula 1. A molding material and a plated molding material are melt-molded ξ1 at a temperature at which the molding material forms an optically isotropic melt.
Then, the resulting molded article is treated with an organic solvent that dissolves the aromatic imide compound () but does not substantially attack the polyester (4) to extract the aromatic imide compound (01) in the molded article. This is a molding method characterized by:

In the present invention, an optically anisotropic melt refers to a melt that has the property of passing polarized light in an optical system equipped with polarizers crossed at 9.0, and an optically isotropic melt refers to a melt that has the property of passing polarized light in an optical system equipped with polarizers crossed at 9.0. A molten substance that does not have the property of transmitting polarized light.

The real deal! The polyester (2) used in JI is a polyester that has the property of forming an optically anisotropic melt. The aromatic dicarboxylic acids referred to in the present invention include pre-7tal lI, iso7ta-yoshishun, methyl terephthalic acid, diphenyl ether dicarboxylic acids, diphenyl dicarboxylic acids, diphenoxyethane dicarboxylic acids, and s7tale dicarboxylic acids! Examples of metal diphenylsulfonedicarboxylic acids include hydroquinone and resorcinol.

Ripruheide p-quinone, pruheide p-quinone.

Methi 47% ido p-quino/, ethyl hyde p-quinone.

t-Butylhydroquinone a j -7milhide-
Quinone, t-hebutylhydroquinone, dimethylbenzylhydroquinone #4. '4'-dihydroxydiphenyl, 4.4'-dihydroxydi7dynyl ether,
Bis(4-hydroxyphenoxy)ethane mL2'-
Dimethyl-4,4'-dihydroxydiphenyl, 3.1
'-dimethoxy-4,4/-dihydroxydiphenyl ether, bis(2-cool-4-human-xyphenoxy) ether,! - His(4-hydoxyphenyl)boupan etc. are exemplified. Further, aromatic oxycarboxylic acids and I, such as p-oxybenzoic acid, 4-oxydiphenyl-41-carboxylic acid, 3-cool-4-oxybenzoic acid, S-methoxy-4-oxy Benzoic acid, S-ethoxy-4-oxybenzoic acid,! -Methyl-4-oxybenzoic acid.

3-Methyl-4-oxybenzoic e11. t-?
vx #'-4-oxydiphenyl-4'-carboxylic acid, etc. are exemplified. These aromatic dicarboxylic acids, aromatic dihydroxy compounds and aromatic oxycarbo/acids are
As is clear from the above examples, K may be unsubstituted, or alkyl.

Aralkyl, alkoxy or alkoxy (1) may be a halogen-substituted product.Depending on the combination of these components, it may be preferable to use a substituted product for at least one component.In addition, in the present invention, optically anisotropic It is possible to use aliphatic or alicyclic dicarboxylic acids, diols, or oxycarboxylic acids in large proportions while maintaining the property of forming a molten substance.

The polyester (4) used in the present invention contains a para-oriented aromatic group in the polymer main chain, SO mole or more, F, %Kgo mole or more, and has a melting point (ml Fl that transitions from an 11-body to an optically anisotropic melt). : Enemy *) is 150-3110
°C, preferably zoo~ss.

℃ polyester is preferred. Here, a para-oriented aromatic group refers to a divalent bonding group of an aromatic group coaxially opposite to the aromatic ring, such as a 1,4-phenylene group, or a 1.4-phenylene group. I
- 7 phenyle groups and 2l-f7 talene groups arranged in opposite directions along parallel axes.

The preferred residues of the present invention are 1. A specific example of polyester (2) is:

(1) p-oxybenzoic acid and terephthalic acid, isophthalic acid, diphenoxyethane-4,4'-dicarboxylic acid,
Diphenyl ether-441-dicarboxylic acid, naphthalene-! One or more selected from the group consisting of I@-dicarboxylic acid, naphthalene-8,7-dicarboxylic acid, diterhexane-1,4-dicarboxylic acid, and carbonic acid, and hydroquinone, cool hydroquinone, methylhydroquinone, t-butylhydroki//, t-74ru8ide p
Quinone, Jime'Pkpe/Zilhydoquinone, 44'-
A copolyester consisting of one or more than 211 aromatic dihydroxy compounds selected from the group consisting of dihydroxydiphenyl and 4,4'-dihyde ρoxydi7ether; +2) Terephthalic acid, diphenyl-4,4'-dicarboxylic acid* , one selected from the group consisting of diphenooxyethane-4,4'-dicarboxylic acid and s7talene-2,6-dicarboxylic acid or zsν, and in some cases, a transparent component consisting of these and isophthalic acid, and hydride. -quinone, tarhide-quinone, methylhide-quinone, t-
Glythylhydride-quinone, t-7ξru^ide-quinone, dimethylbenzylhydride-quinone.

1 selected from the group consisting of 4.4'-dihydroxydiphenyl and 4.4'-dihydroxydiphenyl ether;
species or two or more species, in some cases these and resorcin and/or 3. Examples include polyesters or copolyesters consisting of a diol component consisting of bis(4-human-xyphenyl)butane. Of these, l1iK(1
) is preferred.

These esters can be polymerized by conventionally known methods, resulting in phenol/tetrachloroethane proverb @o/4s (weight ratio).
The specific viscosity (q-y@) measured once in a mixed solution of C-1) at 11 degrees and 31 degrees Celsius is preferably 1.0 or more,
More preferably 1. It is a bovmer more than @.

Next, the aromatic imidized compound 俤) used in the process is as follows:
It is represented by the following formula, and is an aromatic id compound which is non-reactive with polyester (2) and does not have a herogone atom in the molecule.

Monovalent aromatic groups (T) in which the hydrogen atom of these aromatic rings is substituted with other organic groups such as furkyl, 7-aryl, dichlorofurkyl, etc. include phenyl;

Diphenyl, naphthyl or the hydrogen atom of these aromatic rings is another organic group such as alkyl or aryl.

dichlorofurkyl, -x-mr' (where X is +, -8
Hey.

Beni H, -, -()C 1979-, etc.: Ar' is a t-substituted monovalent aromatic group such as a group represented by a 7-aryl group, such as phenyl, naphthyl, diphenyl, etc.; phenylene, diphenylene, naphthyl V7゜-Ar"-x-mul#- (where X has the same meaning as above; mur#
, M, J11 is a group represented by arylene (for example, phenylene, styrene, etc.), or other groups in which the hydrogen atom of these aromatic rings has a hydrogen atom, such as a fulkyl group or an aryl group.

From another point of view, a group represented by a divalent aromatic group (X has the same meaning as above) substituted with a Schiff-alkyl group, etc. is preferable. Boiling point is 30
・The temperature is preferably ℃ or higher, more preferably 350℃ or higher,
It is also stable at the melting temperature of polyester (2) (
For example, it is preferably something that does not decompose.

Preferred specific examples of such aromatic imide compounds include:
The following compounds can be exemplified.

4.4'-His 7-thalimide diphenyl ether.

1.4'-bis7talyl dodiphenyl ether.

s, s'-His 7-thalimide diphenyl ether.

4.4'-bis7talyl dodiphenyl sulfone.

3.4'-bislatalimido diphenyl sulfone.

3, s'-bislatalimido diphenyl sulfone.

4.4'-bisphthalimidodiphenylmethane.

4.4'-bis(l,8-su7talimido)diphenyl ether, L4'-bis(1,a-su7talimido)diphenyl ether, >s'-bis(l,@-su7talimido)diphenyl ether, 4. '4'-bis (14
-naphthalide) diphenylsulfone, LI'-bis(kudzu, exclusive 7thalimide) diphenylsulfo 7.4.
4'-bis(1,8-naphthalide)diphenylmethane, 4-7tal 4i dodiphenyl, 3-7
These are thalimido diphenyl sulfone, 4-7 thalimido diphenyl ether, and 3-phthalimido diphenyl ether.

These aromatic compounds are stable under the melting conditions of the polyester (4) and do not volatilize, and dissolve or disperse in the polyester (4) KIIJIK, increasing the molten charcoal or the melting point of the polyester (3). In addition, it has the effect of forming an optically isotropic composition. Further, it can be easily removed from the molded product by a step 11 using an organic solvent after molding.

The blending ratio of the aromatic imide compound @) is such that the resulting molding material has a temperature of S19°C or lower, preferably si.

This is the rate at which an optically isotropic melt can be formed at temperatures below °C, and this is the rate at which polyester fibers are formed.

Although it varies depending on the species 11 of the aromatic imide compound (image), it is usually 100 parts by weight of polyester (4) 1 to 1 part by weight. The preferred blending ratio is 50 to 180 parts by weight.

The molding material of the present invention is obtained by mixing both components (a polyester powder and an aromatic compound) in a predetermined ratio. This mixing method.

Although there is no particular restriction, it is preferable to knead both components thoroughly while melting, for example, in a melt kneader such as an Etastruder, and it is preferable to add the compound when adding heavy metal to the polyester, which is an aromatic imide compound.

The molding material of the present invention has a lower melt viscosity and melting point than the physical properties of polyester (3) alone, so it can be molded with a small load. A preferred method for molding the molding material is melt extrusion 1, in which the molding material can form an optically isotropic melt.

For example, about 50 moles of t-oxybenzoic acid units and about 11 moles of phenylene isophthalate units.

Polyesters that form optically anisotropic melts consisting of moles of 4.4'- and 4.4'-moles form optical Ilc-transferring melts even at high temperatures of 4.4'- Those containing hisphthalimide diphenyl ether are 2
An optically isotropic melt is formed at temperatures above 70°C, and melt extrusion at such temperatures yields molded products in which the orientation of the polymer in the cross direction is relatively suppressed. It has the advantage that it can be subjected to treatments such as elongation in the same way as polyesters that form ordinary optically isotropic melts. In addition, the composition of polyester is aromatic.
Depending on the type of compound and the amount of addition, the resulting molding material may exhibit melting anisotropy in a special electric thermometer, and if a draft is applied during molding using a hot temperature machine, the direction of the thickness distribution will change. The degree of orientation is much smaller than when the aromatic compound is added or not, and therefore, for example, in the case of a film, it is possible to uniformly stretch it in the direction perpendicular to it.
It has m1 points.

ψ has the advantage that the ε aromatic imide compound @) can be thoroughly extracted and removed by treating the molded article with a suitable organic solvent C). By this extraction process, usually 70- or more, even s
It is possible to extract and remove more than ob, especially more than 90% of aromatic isodo compounds. This extraction ratio depends on the purpose of the molded product,
It is best to consider the conditions of use, etc. For example, polyester ■ has its original physical properties! In order to maintain this, the amount of aromatic imide compound remaining in the molded article after the extraction treatment is preferably about 1.weight or less, more preferably 5.weight or less.

The organic solvent C) useful for extracting and removing the aromatic imide compound II) from the polyester molded article must be able to absorb the aromatic imide compound rBl and not substantially attack the polynisdel (2), i.e. dissolve it. Alternatively, it is an organic solvent that does not cause scaling. Examples of the caustic organic solvent include toluene, xylene, tarbenzene, trimethylbenzene, ethyl acetate, #) oxane, acetone, lyaloform, and methylene chloride. These organic solvents are preferably selected appropriately depending on the type of polynisdale and aromatic imide compounds.

Although the extraction treatment using a horizontal solvent opening can be carried out at room temperature depending on the case, it is preferably carried out by heating within a range where the shape of the molded article can be maintained.

For example, it is preferable to carry out the reaction under conditions of rapid solvent flow.

The extraction processing time varies depending on the form of the molded product, II & temperature, extraction ratio, etc., but is usually 1 second to 1 hour. For example, the larger the surface area of the molded article, the shorter the processing time.

In the present invention, preferred 1. Examples of molded products include films and fibers, and films are preferred in 411 and 17.

It is preferable that the film or fiber is finally oriented by birth (in this case, the stretching treatment and the extraction treatment may be carried out in either order).

When carrying out the extraction process, it is preferable to carry out the process under constant length or limited shrinkage since the film or fibers are easily deformed, but depending on the case, the process may be carried out under constant elongation. When stretching a film or fiber, the stretching is carried out at a temperature higher than or equal to the heat distortion temperature and lower than the melting point (TN) of the mixture of polynisder or polyester and an aromatic compound constituting the film or fiber. The preferred stretching ratio is 2 times or more for fibers, and 1.1 times or more in each of the longitudinal and lateral directions for films, more preferably 1.1 times or more, and an area ratio of 2 times or more (more preferably 3 times). Here, the thermal deformation temperature refers to the temperature at which the sample suddenly begins to elongate 1° when the sample is heated at a rate of 1° C'G with a tension of K M Kg- applied.

The molded product obtained by the Honkimei method can be further improved in mechanical strength than the heat treatment performed on ordinary polyacylates, so for example, the molded product can be heated for 1 second within the temperature range of goo°C to the melting point of the molded product. It is preferable to perform the heat treatment for ~10 hours.

Hereinafter, the present invention will be explained using specific examples, but the present practice is not limited to such specific examples. Of 1 case,
All "parts" are "parts by weight", and strength and elongation were measured using an Instron measuring machine at a tensile speed of 1001 cm. The melting point is measured using a weight melting point measuring device manufactured by Yanagimoto Seisakusho: 7, TN is the temperature at which the temperature is transferred from the crystal to the optically anisotropic melt, and 〒L is the temperature at which the crystal or the optically anisotropic melt changes from the optically isotropic material to the optically isotropic material. indicates the temperature at which it transforms into a molten material.

Examples 1 to 6 and Comparative Example 1 In a Mitsuro reactor equipped with a stirrer, 214 parts of p-oxybenzomonophenyl, 318 parts of diphenyl isophthalate, Hyde pki7y1ts,s@, and parts of antimony trioxide O0S are added. A predetermined amount of the aromatic imide compound shown in Table IK below was charged, and the system was heated at 240 to 280°C for 90 minutes under normal pressure.Then, the pressure in the system was gradually reduced and the temperature was raised to SO minutes, and then the absolute pressure was about ., lM. .

The temperature was set to 330°C, and the reaction was further carried out for the time shown in Table IK, and the resulting polymer composition was ground and chipped.1. Ta
.

Table IK shows the melting point (〒N, TE) of the obtained chip-shaped molding material and the temperature and melting point (Tsl'aTL') of poly 1- obtained by extracting the molding material with refluxing dioxane.

As shown in Table 1, extraction of aromatic metal compounds 1.
The poly-t- after heating exhibits melting anisotropy at temperatures above about 300°C, and does not change even after 3 days at 11:K (TL'>
s 16°C), the molding material of the present invention is 11 shown in Table 1K.
At temperatures above this, the melt becomes optically isotropic.

For comparison, when a polymerization reaction was carried out under the same conditions as above without adding any aromatic imide compound, the melt viscosity of the reactant rose rapidly during the reaction under reduced pressure, making stirring impossible.

Examples 1 to 9 and Comparative Examples In Examples 1 to 6, p-oxybenzoic acid phenyl was added to 2 parts, 8 parts, and diphenyl inphthalate! 4.4 parts of I, 92.4 parts of Idoki/7, 33 parts of the aromatic ildo compound shown in Table 2 below as the k aromatic imide compound, and an absolute pressure of about 0.1 If Table 2 below shows the reaction time at
A material was obtained by reacting in the same manner as in Examples 1 to 1, except for the following. The physical properties of the molding material obtained are shown.

For comparison, a polymerization reaction was carried out under the same conditions as above without adding any aromatic imide compound.1. However, the reaction product solidified during the reaction under reduced pressure.

Example 1・, ■ After drying the molding material obtained in Example 1, the cylinder temperature was 31・
Medium size at ℃, l■, length 10t'll! It was pushed out from Gui. The heat distortion temperature of the obtained film was 127°C. Next, use 3・O to increase the vertical direction by 1.1 times and the horizontal direction by 5 times.
．． It spread to twice the size at the same time, and then in Chloholm [
15 Soaked, extracted and dried.

N analysis revealed that 0.2-4'-bisphthalimide diphenyl ether was present in the obtained fill AK. The physical properties of the film obtained in this way are shown in Table S (Example 1@) below.
Show K.

Next, the film was placed in silicone oil at 100°C.
@ Under the extension of the capsule, the lateral direction was 4611 seconds below the length of the foot. The physical properties of the obtained film are shown in Table 8 (Example 11).

Table 3 Example 1! , 13 The molding material (chip) obtained in Example 2 was heated to an absolute pressure of about 0.1 w.
The mixture was heated to 11,411 ml at 1185° C. for 1 hour at 3 s of Hf at 0° C., then for 2 hours at 0° C. under a reduced pressure of Hf. The melting point of the obtained molding material was T%wt-294°C.

TL = sos °C, and the polyol after dioxane extraction was insoluble in the calyx@B/eil liquid medium.
Sansodedokorohoshi”C% bovff-’s II@i is 3
．． It was 9@.

Using the molding material obtained in this way, the same procedure as in Example 10 [
Then, the unstretched film was obtained by immersing the film in a fixed length in refluxing dioxic acid for KsO and extraction treatment. m
The amount of 4,41-bis7talimido diphenyl ether remaining in the film after release was Q.4.

Next, the film was heated at 190°C by 2 times in the machine direction, then 21 times
Stretched 2.5 times in the transverse direction K at @C (Table 4 below (Example 1)
A film shown in 3) was obtained. The film is further placed under tension,
Heat treatment was performed under reduced pressure of about 0.1 H9 absolute pressure for 3 minutes while gradually increasing the temperature from 240°C to 180°C. The physical properties of the obtained film were as shown below (Example 13). Became.

1!4 Example 1 13g of the unexpanded film obtained in Example 13 at 1°C
The specimen was simultaneously biaxially stretched 2.0 times and 3.0 times in the vertical and horizontal directions, respectively, and then immersed in a ρp hole solution for 1 minute under tension and dried.

Next, the obtained film was heated in a hot section I+ for 10 seconds while stretching 20 degrees vertically and horizontally in silicone oil at 220°C. The obtained film had physical properties shown in Table 1 below.

Table 1 Example Mouth, 16 Using the molding material obtained in Example 4, Kl as in Example 10
- A non-stretched film was obtained. The $1 form temperature of the acid film was 11 it°C. 3. Acid film at 170°C in the transverse direction. ! After stretching 1 time, Kl in 1l flow dioxane under constant stirring.
Immerse for 1 minute and extract L. After drying, print 20 times vertically on the page.
At 0°C, Kotobekaoki 1. Ta. 4,4'- remaining in the film
The amount of bis7tal-4 dodiphenyl sulfone was 00s-.

The physical properties of the obtained film (Example 15) and the physical properties of the film obtained by heating the film in the hot section St- (Example 16) while stretching the film 1.2 times laterally at 140°C are shown. 6
Shown below.

Example 1? , 11 The molding material (chip) obtained in Example 7 was heated to an absolute pressure of about 0.1-
Solid phase polymerization was carried out at 240° C. for 15 hours under reduced pressure of m1F. The melting point of the obtained molding material is TN=2e[:*〒&=mm4R
It was ℃.

After drying the wrinkled material, the temperature of the cylinder is ”'Cp@1
mm, length lhaml) extruded through a slit T-die,
Next, extract 1 by immersing in reflux dioxidation solution for KlΦ for a fixed length.
6M and dried.

The amount of 4,4'-bisphthalimide diphenyl ether remaining in the film after the extraction treatment was O.F. The obtained film was transparent and had the physical properties shown in Table 1 (
Example 17).

Next, the film after the above extraction treatment was heated at 2sO℃ in the longitudinal direction [2
, · times, and then two-wheel stretching was carried out in the transverse direction at 11 sO<0>C for 3 times. The obtained film had the physical properties shown in Table 7. Extrusion [1] An undrawn yarn was obtained. The heat distortion temperature of the undrawn yarn was 1tIIC.

The undrawn yarn was immersed in dioxane (II) for 16 minutes on a hot plate at 1110°C under S, S double stretching at a constant length of L1 and extracted! & went through. Physical properties of fiber after drying (Example 1
・) and the absolute pressure is approximately 0.1■' while tensioning the drawn thread with scissors.
Under reduced pressure of Hf, from XSO℃! Gradually raise the temperature over 1 hour to 1. The physical properties of the fiber obtained by heat treatment (Example 2G) are shown in Table IK.

Table 1 1111/IA Example Diphenyl terephthalate! i 4.4i1.1 Isophthal Shun Schiff ggkm B, 68m 113 class 7 j
ruhydroquinone III and antimony dioxide O,O
Using part S, the reaction time at an absolute pressure of about 6.1 ■Hf was 3.
The reaction was carried out in the same manner as in Example 1 except that q @y/@
I got the proverbial -1 poly 1-. The melting point of this polymer is T,! It was 70 degrees Celsius* TL>B.

Next, 4011 km of 4,4'-bisphthalimide diphenyl ether was added to 100 parts of the polyv-v-1 and extruded at 330°C using a two-wheeled rug to form chips. The melting point of the molding material obtained was THmxos°C.

The zero-order wrinkle molding material at TL = 31i℃ was made into a material with a diameter of 0.5
An undrawn yarn was obtained by melt extrusion at 330°C from a nozzle of m.

Next, the undrawn yarn was stretched by a factor of S, O at 0°C, extracted by immersion in refluxing chloroform KIS at a fixed length, and dried.
is. The physical properties of the obtained fibers are strength 4. @f/d@, Young's modulus was 27 #f/d·.

Claims (1)

[Scope of Claims] 1. An ester unit of an aromatic dicarboxylic acid and an aromatic dihydroxy compound and/or a repeating unit whose main position is an aromatic oxycarbonate. and a polyester (ARK) that forms an optically anisotropic melt.
, forming an optical, orthogonal melt at temperatures below 3110°C L
A molding material which is formed by blending an aromatic imide compound (Bl) represented by the following formula in an amount that imparts the characteristics of 1. Ester units of an aromatic dicarboxylic acid and an aromatic dihydroxy compound and/or IJ ester (A) K, SSO, which has aromatic oxycarbonyl units as the main repeating unit and forms an optically anisotropic melt, has the property of forming an optically isotropic melt at a temperature below ℃. A molding material containing a given amount of an aromatic imide compound (1) represented by the following formula is melt-molded at a temperature at which the plating molding material forms an optically isotropic melt, and then the obtained The aromatic imide compound (4) in the molded article is treated with an organic solvent that dissolves the aromatic imide compound (4) but does not substantially attack the polyester (4). A forming method characterized by extraction. 1. The compounded amount of the acid aromatic imidization material (6) is in the range of 1-400 parts by weight of the polyester (J100 parts by weight). Molding method.Table The molding method according to item 2 of the scope of the patent application, characterized in that the molded product is heat treated after the extraction treatment.