JPS58142583A - Light emitting element - Google Patents
Light emitting elementInfo
- Publication number
- JPS58142583A JPS58142583A JP57024420A JP2442082A JPS58142583A JP S58142583 A JPS58142583 A JP S58142583A JP 57024420 A JP57024420 A JP 57024420A JP 2442082 A JP2442082 A JP 2442082A JP S58142583 A JPS58142583 A JP S58142583A
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- junction
- light emitting
- groove
- compound semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
Abstract
Description
【発明の詳細な説明】 本発明は発覚素子、友とえば赤外発光素子に関する。[Detailed description of the invention] The present invention relates to detection elements, such as infrared light emitting elements.
赤外発光素子の一つとして、第1FjAK示すようにド
ーム製赤外発?素子(以下単に素子とも称す)が知られ
ている。この素子lはドーム状のGaAlム一体2の平
坦面上にG aA I A taからなるPill導電
層3を糞するとともに、このPWJ4電層3上に順次M
W4111m4.N l!lIIEm5に有L7tl
ll造トなっている。箇た、M ai1M電層Sの上
面すなわち素子の主面の中央には、Pジ導電層3Kまで
達するリング状(無端状)の溝6が設けられている。As one of the infrared light emitting elements, dome-made infrared light emitting device is used as shown in the 1st FjAK. BACKGROUND ART Elements (hereinafter also simply referred to as elements) are known. This element 1 deposits a pill conductive layer 3 made of GaAIA ta on the flat surface of a dome-shaped GaAl film 2, and sequentially deposits M on this PWJ4 conductive layer 3.
W4111m4. Nl! lIIEm5 has L7tl
It's completely built. In addition, a ring-shaped (endless) groove 6 reaching up to the P conductive layer 3K is provided on the upper surface of the M ai1M conductive layer S, that is, in the center of the main surface of the element.
したがって、 PtjI導電層3とM型部電層4との接
合でめるPI接合7は溝6の周一面に露出している。1
7t、溝6の外周−のP湯導電層3上は拡散処理によっ
てP+型導電層8となっている。箇た、溝6は絶縁11
i!9で仮われている。さらに、M w導電層5および
溝6の外霧のPr1i導電層8上にはそれぞれカソード
電極10およびアノード電極11が設けられている。カ
ンードIIItlOは第2図に示すように円形電極、ア
ノード電極11は馬蹄形電極となっている。そして、こ
れらの両電極に所定の電圧を印加することによって、P
M接合7で発光させ、ドーム面12から党tlA子外部
に出射させる。Therefore, the PI junction 7 formed by the junction between the PtjI conductive layer 3 and the M-type conductive layer 4 is exposed on the entire circumference of the groove 6. 1
7t, the P-type conductive layer 3 on the outer periphery of the groove 6 is made into a P+ type conductive layer 8 by diffusion treatment. The groove 6 is insulated 11.
i! It is assumed to be 9. Further, a cathode electrode 10 and an anode electrode 11 are provided on the Mw conductive layer 5 and the Pr1i conductive layer 8 outside the grooves 6, respectively. As shown in FIG. 2, the cando IIItlO is a circular electrode, and the anode electrode 11 is a horseshoe-shaped electrode. Then, by applying a predetermined voltage to both these electrodes, P
Light is emitted at the M junction 7 and emitted from the dome surface 12 to the outside of the tlA element.
ところで、このような素子にあっては、X’M接@−7
の直径ri100μm”6るいは160unφと小さい
ため、電流密嶽が為(、寿命が短かい一点がある。そこ
で、電fiffifk振少させるためにはPM襞合径を
大目(することが考えられる。しかし、光通信用の素子
KToりては、ガ9xファイバーのコア後が5ops以
下と細いため%責細會効率を轟くするためには前記PM
II!合7の18011m小化が望すれる。By the way, in such an element, the X'M contact @-7
Since the diameter of the PM is as small as 100μm"6 or 160unφ, the current density is short (there is one point that the life is short. Therefore, in order to reduce the electric current flux, it is considered to increase the PM fold diameter). However, since the optical communication element KTo has a thin core of less than 5 ops of the 9x fiber, it is necessary to
II! A reduction of 18011 m in total 7 is desired.
オた、P夏螢会at大1<Lm場場合Cは、P菖接合画
の中央1llKrI@かうに伜なりてアノードII極1
1と壷會各wtommが大1((第2110矢印群参1
I)tkhことかbii党位相羞が大1(1j1.中央
部はど発覚−遵くなる。したがって、問題装置の発−y
tIIとしてIImいた場合、−履装置が慟覚後の反射
覚の受覚による位暢葺によってiiiagilを測定す
ルメカ翼ズムからして、メイツチンダ時O大It尭元位
相差は−11を不正確な一〇とすることになp、実lI
K#1IIIJIで11kくなる一点がある。Ota, P summer firefly meeting at large 1 < Lm field case C is the center 1llKrI of the P iris joint picture
1 and each wtomm is large 1 ((2110th arrow group reference 1
I) tkh or bii party phase is a big one (1j1. The central part will be obedient to the discovery of the problem device.
If IIm is present as tII, then the phase difference at the time of Maytsuchinda is incorrectly -11, given the lumeka wing rhythm in which the device measures iiiagil by the reflex sensation after sensation. To make it 10, it is true
There is one point where K#1IIIJI becomes 11k.
し′1eがって、本li明の1的は電鉋書&および発覚
位相差t@淑でlるa党票子を提供することにある。Therefore, one purpose of this invention is to provide a party vote with the electric plane book & and the discovery phase difference t@shu.
ζOような■釣tagするために素置−は、化合IaI
中導体基1[0主−に形成した一端状の溝によって■鵞
れる領域O上層tSt−亀−領域とし、下層を第2導電
膠領域とし、かつ溝の内周瞭厘にFrlll合端を露出
させる構造の発覚素子において。ζO-like ■Preparation for fishing tag - Compound IaI
The region O that is inserted by the one-end groove formed in the middle conductor group 1 [0 is the upper layer tSt- turtle region, the lower layer is the second conductive glue region, and the Frllll joint end is clearly formed on the inner periphery of the groove. In the detection element of the exposing structure.
前記下層の第2導亀1領域盲たはそO中央部は中球状に
窪み、PM接合面は中球状の1lI−となっているもの
であって、以下実、IIIガによp本実@Yt*明する
。The central part of the second guiding turtle 1 area blind or so O in the lower layer is hollow in the shape of a medium sphere, and the PM joint surface is 1lI- in the shape of a medium sphere. @Yt* Clarify.
第3図は本発明〇一実施例による一元素千〇斯面図、第
4図四〜16)は同じく発党率子omit@雫を示す断
面図である。FIG. 3 is a 1,000-dimensional cross-sectional view of one element according to the embodiment No. 1 of the present invention, and FIG.
こO実sno発+2子(素子)lfijll!lI’t
’示す従来例と同様にドーム状oaahtム―体(化合
物中導体基板)2の平坦面上K G aムlム―からな
るP1111導電11−薯するとともに、こOpH#l
電層3上KIIk次[4電M4.M ll瘍電層St
G&ムlム8で形成した構造となっている。を尺、M+
膠導電層5の上面すなわち素子の主面O中央には、PW
4亀層3に1で遍するリング状CIII端状)の#6が
設けられている。まt%11160内−の119合面は
中央部が下方に中球状に−んに―ff111となってい
る。なお、1131m!會1は壽・O内llll1面に
露出している。また、瀦60外周−のPw導亀層3上紘
拡散処Ill#ICよってP+謬導亀層8となっている
。さらに、霞6はl!縁餌9で普われるとともに、I@
導電層6上に紘円形のカソード電1i1Gが、P+膠導
電層8上には馬II形の7ノード+uiitが設けられ
ている。This is from sno + 2 children (element) lfijll! lI't
'Similar to the conventional example shown, a P1111 conductor 11 consisting of a KGa membrane is placed on the flat surface of the dome-shaped oaaht membrane (conductor substrate in a compound) 2, and this OpH#l
KIIk next on electric layer 3 [4 electric M4. M ll tumor charge layer St
It has a structure made of G&M 8. is the length, M+
PW
A ring-shaped CIII end (#6) extending over the four turtle layers 3 is provided. The 119 joint surface in t%11160 has a downwardly spherical shape in the center. In addition, 1131m! Ai 1 is exposed on the 1st side of Hisashi O. Moreover, the P+ guiding turtle layer 8 is formed by the Pw guiding turtle layer 3 on the outer periphery of the wall 60 being subjected to a diffusion treatment Ill#IC. Furthermore, Kasumi 6 is l! As well as being popularized by edge bait 9, I@
A square cathode electrode 1i1G is provided on the conductive layer 6, and 7 nodes +uiit in a horse II shape are provided on the P+ glue conductive layer 8.
つぎに、このような発覚素子の脂造方I&にりいて、j
I4!l!a叫〜−・)を用いて簡単に観−する。第4
84 tas K 示f Xうに、LOOpm前m10
31 ”80 G ロムー@14上に数百μmの厚さ0
GaAjム・層(G。Next, we will explain how to make such a detection element.
I4! l! You can easily watch it using the following. Fourth
84 tas K Show f X sea urchin, m10 before LOOpm
31 ” 80 G Romu@14 with a thickness of several hundred μm 0
GaAj layer (G.
ムlム一体2)kWする基鈑ウェハ)IStF@意した
後、その上m(主1f)Kil相エピタキシャル方!に
よって、畝十声m10層さKl’磨導電導電層3成する
。その後、Pj1導電層3の主面中央に中球状の鰯み1
6にエツチングによって形成する。2) kW base plate wafer) IStF@, then m (main 1f) Kil phase epitaxial method! A conductive conductive layer 3 is formed by polishing the ridges 10 layers Kl'. After that, a medium spherical sardine 1 is placed in the center of the main surface of the Pj1 conductive layer 3.
6 by etching.
’:>yvc、同l11m?示すように、211導電層
3゜上面に@相エピタキシャル方法で順次I11導電層
4、H+H導電層5を形成する。それぞれの厚さは!乃
至数pvaとなゐ。こOS来、Pシ尋電層3と1層導電
層4七〇fi41には中央Sが下方に中球状に突出する
一面13r’l!する11M接合7が形成される。その
後、窪み161取pm!むように、亜鉛(Zn)t−拡
散させてP湯導電層3に運するP−導電層8を形成する
。':>yvc, same l11m? As shown, an I11 conductive layer 4 and an H+H conductive layer 5 are sequentially formed on the upper surface of the 211 conductive layer 3 by the @ phase epitaxial method. The thickness of each! From a few pva to several pva. Since this OS, the P conductive layer 3 and the single-layer conductive layer 470fi41 have a central S projecting downward into a spherical shape on one side 13r'l! A 11M junction 7 is formed. After that, the depression was 161 pm! A P- conductive layer 8 is formed in which zinc (Zn) is diffused and transported to the P-water conductive layer 3.
りぎに、同図+61で示すように、前記M 11導電層
5上に円形のカソード電極tor、pm*電層8上に馬
蹄形のアノードl1k11に設けるとともに、P+型導
電層8と11+製導電層4.5との界面領域!モートメ
サエッチングによって除去し、リング状O除去部でめる
溝6kl!!!縁纒9で豪う、さらに、ウェハ115t
−各素子部毎に分断し、G4A/As 体2tドーム
状に研摩して、第3図に示すようなドーム面12tWす
る素子1に製造する。Finally, as shown at +61 in the figure, a circular cathode electrode tor is provided on the M11 conductive layer 5, a horseshoe-shaped anode l1k11 is provided on the PM* conductive layer 8, and a P+ type conductive layer 8 and a conductive layer made of 11+ are provided. Interface area with layer 4.5! 6kl groove removed by Mort Mesa etching and filled with ring-shaped O removal part! ! ! 115 tons of wafers with 9 rims and 115 tons of wafer
- Each element is divided into parts and polished into a dome shape of 2t G4A/As to produce an element 1 having a dome surface of 12tW as shown in FIG.
仁のような発ft累子1は、溝6Kj[Ja鵞れた領域
に形成されるPlig合7はその中央部で下方に突出す
る中球状の−I013となっている。このため、2M1
11合1*7は従来に地壁して略2倍と広くなることか
ら、電KIF&が約中分となる。11k、PM接合7E
Iiは下方に突出し**amとなることから各PM接合
面部分とアノード亀@11との距離の差は第3図の矢印
で示すように従来に比較して小さくなる。このため、発
光位相差は従来よりも小さくな9、測距装置の光源とし
ても便用できるようになる。The groove 6Kj [Ja] of the thread-like opening 1 is formed in the thick region, and the plug 7 formed in the central part thereof has a medium spherical shape -I013 that protrudes downward. For this reason, 2M1
Since the 11-go 1*7 is approximately twice as wide as the conventional ground wall, the electric KIF & will be approximately the same size. 11k, PM junction 7E
Since Ii protrudes downward and becomes **am, the difference in distance between each PM joint surface portion and the anode turtle @11 becomes smaller compared to the conventional case, as shown by the arrow in FIG. 3. Therefore, the light emission phase difference is smaller than that of the conventional device 9, and the device can be conveniently used as a light source for a distance measuring device.
なお、本発明は前記実JIIlガKII!lI定されな
い。たとえば、溝でsrsまれる領域のPm1m合面全
体1r4!1球状として、一定の直径内におけるPIg
合面の面積の増大を図り、かつ各PIg合面各面各部ア
ノード電極11とO距離の差を小さくするよう和しても
よい。また、本発明は工0等他の牛導体amにも通用で
書る。In addition, the present invention is applicable to the above-mentioned real JIIlga KII! lI is not determined. For example, assuming that the entire Pm1m joint surface of the region srs in the groove is 1r4!1 spherical, PIg within a certain diameter
They may be summed to increase the area of the mating surfaces and to reduce the difference in O distance between each PIg mating surface and each part of the anode electrode 11. Furthermore, the present invention is also applicable to other conductors such as 0 and 0.
以上のように、本発明によれば、Pill会面の増大に
よる電流書屓の@誠9発元位相差の@fltk図ること
ができるため、発覚素子の長寿命化9発覚素子の測距装
置への適用を図ることができる。As described above, according to the present invention, it is possible to increase the @fltk of the current phase difference due to the increase in the pill surface area, thereby extending the life of the detection element. can be applied.
図面0w1lI#な説明
JIEI図は従来の発覚素子を示す断面図、第2図は向
じ〈斜視図、第3図は本発明の一実Jl内による発覚素
子のmi1図、纂4図181〜C・)は同じく発覚素子
の製造段階1示す断面図である。Explanation of drawings JIEI is a sectional view showing a conventional detection element, Fig. 2 is a perspective view from the opposite direction, and Fig. 3 is an mi1 diagram of a detection element according to the present invention. C.) is a sectional view showing the first manufacturing step of the detection element.
1・・・素子、2・・・GaA7ム一体、3・・・P置
部電層、4・・・M111導電層、5・・・M+型導電
層、6・・・溝、7・・・py*合、8・・・p +
g導電層、1G・・・カンート”電極、11・・・アノ
ード1極、13・・・曲面、16・・・窪み。DESCRIPTION OF SYMBOLS 1...Element, 2...GaA7 integrated circuit, 3...P terminal conductive layer, 4...M111 conductive layer, 5...M+ type conductive layer, 6...groove, 7...・py*combination, 8...p +
g conductive layer, 1G... Kanto' electrode, 11... one anode pole, 13... curved surface, 16... depression.
Claims (1)
ってS箇れる領域の上層を第1導lI型領域とし、下層
を第2導IK#領域とし、かつ溝の内周l1lIIIに
PM接合燗を露出させる構造の発光素子において、前配
下層の第2導電IIIII域t7tr;tその中央部は
半球状に窪み、PMl[1合面は半球状の曲面となって
いることに骨黴とするJli元票子。1. The upper layer of the region S formed by the non-electroconducting groove formed on the main surface of the conductive substrate in a compound is the first conductive lI type region, the lower layer is the second conductive IK# region, and the inner periphery l1lIII of the groove is made of PM. In a light-emitting element having a structure that exposes the bonding layer, the second conductive region t7tr;t of the front lower layer has a hemispherical depression in its center, and the bonding surface is a hemispherical curved surface. Jli former vote child.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57024420A JPS58142583A (en) | 1982-02-19 | 1982-02-19 | Light emitting element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57024420A JPS58142583A (en) | 1982-02-19 | 1982-02-19 | Light emitting element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58142583A true JPS58142583A (en) | 1983-08-24 |
Family
ID=12137658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57024420A Pending JPS58142583A (en) | 1982-02-19 | 1982-02-19 | Light emitting element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58142583A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4862230A (en) * | 1986-09-12 | 1989-08-29 | Nec Corporation | Double heterostructure light emitting diode |
JP2005228924A (en) * | 2004-02-13 | 2005-08-25 | Toshiba Corp | Semiconductor light emitting element |
EP1592070A2 (en) * | 2004-04-30 | 2005-11-02 | Osram Opto Semiconductors GmbH | Semiconductor light emitting and/or receiving device and method for structured contact deposition onto a semiconductor chip |
FR3023978A1 (en) * | 2014-07-18 | 2016-01-22 | Commissariat Energie Atomique | OPTOELECTRONIC DEVICE WITH ELECTROLUMINESCENT DIODE |
-
1982
- 1982-02-19 JP JP57024420A patent/JPS58142583A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4862230A (en) * | 1986-09-12 | 1989-08-29 | Nec Corporation | Double heterostructure light emitting diode |
JP2005228924A (en) * | 2004-02-13 | 2005-08-25 | Toshiba Corp | Semiconductor light emitting element |
EP1592070A2 (en) * | 2004-04-30 | 2005-11-02 | Osram Opto Semiconductors GmbH | Semiconductor light emitting and/or receiving device and method for structured contact deposition onto a semiconductor chip |
EP1592070A3 (en) * | 2004-04-30 | 2007-11-07 | Osram Opto Semiconductors GmbH | Semiconductor light emitting and/or receiving device and method for structured contact deposition onto a semiconductor chip |
US7592194B2 (en) | 2004-04-30 | 2009-09-22 | Osram Opto Semiconductors Gmbh | Radiation-emitting and/or -receiving semiconductor component and method for the patterned application of a contact to a semiconductor body |
FR3023978A1 (en) * | 2014-07-18 | 2016-01-22 | Commissariat Energie Atomique | OPTOELECTRONIC DEVICE WITH ELECTROLUMINESCENT DIODE |
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