JPS58138936U - solid photography - Google Patents

solid photography

Info

Publication number
JPS58138936U
JPS58138936U JP1982035139U JP3513982U JPS58138936U JP S58138936 U JPS58138936 U JP S58138936U JP 1982035139 U JP1982035139 U JP 1982035139U JP 3513982 U JP3513982 U JP 3513982U JP S58138936 U JPS58138936 U JP S58138936U
Authority
JP
Japan
Prior art keywords
semiconductor wafer
solid photography
member provided
abstract
solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982035139U
Other languages
Japanese (ja)
Inventor
大西 健治
Original Assignee
沖電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 沖電気工業株式会社 filed Critical 沖電気工業株式会社
Priority to JP1982035139U priority Critical patent/JPS58138936U/en
Publication of JPS58138936U publication Critical patent/JPS58138936U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係る固体写真の第一の実施例゛を示す
斜視図、第2図はその断面図、第3図は同じ(第二の実
施例を示す断面図、第4図は同じく第三の実施例を示す
断面図である。 1・・・保護用ガラス、2・・・補強用枠、3・・・半
導体ウェハ、4・・・補強用ガラス。
Fig. 1 is a perspective view showing a first embodiment of the solid-state photograph according to the present invention, Fig. 2 is a sectional view thereof, and Fig. 3 is the same (a sectional view showing the second embodiment, Fig. 4 is a sectional view showing the same). It is a sectional view showing the third embodiment as well. 1... Protective glass, 2... Reinforcing frame, 3... Semiconductor wafer, 4... Reinforcing glass.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 写真原板を用いて写真を形成した半導体ウェハと、該半
導体ウェハの表面に設けた透明部材と、裏面に設けた補
強部材と、該半導体ウェハの円周上に補強用枠をもうけ
たことを特徴とする固体写真。
A semiconductor wafer on which a photograph is formed using a photographic original plate, a transparent member provided on the front surface of the semiconductor wafer, a reinforcing member provided on the back surface, and a reinforcing frame provided on the circumference of the semiconductor wafer. and solid photos.
JP1982035139U 1982-03-15 1982-03-15 solid photography Pending JPS58138936U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982035139U JPS58138936U (en) 1982-03-15 1982-03-15 solid photography

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982035139U JPS58138936U (en) 1982-03-15 1982-03-15 solid photography

Publications (1)

Publication Number Publication Date
JPS58138936U true JPS58138936U (en) 1983-09-19

Family

ID=30046623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982035139U Pending JPS58138936U (en) 1982-03-15 1982-03-15 solid photography

Country Status (1)

Country Link
JP (1) JPS58138936U (en)

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